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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCVU45P-3FSVH2104E

Name: XCVU45P-3FSVH2104E
Brand: AMD
SKU: XCVU45P-3FSVH2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCVU45P-3FSVH2104E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU45P-3FSVH2104E.pdf

Description:: IC FPGA 416 I/O 2104FCBGA

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Product details

Overview

XCVU45P-3FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 443,200 logic cells, 1,728 DSP slices, and 96.4 Mb of total on-chip memory. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, targeting advanced radar processing and high-throughput data acquisition systems.

For engineers reviewing the XCVU45P-3FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage support (1.8 V / 1.2 V), thermal design power (TDP = 55 W), and package pin count (2104-ball FCBGA).

Technical Context

The XCVU45P-3FSVH2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ADC/DAC interfaces. Its UltraScale+ architecture uses 16 nm FinFET process technology and supports partial reconfiguration.

This device includes 24 GTY transceivers rated at 25.78125 Gb/s per lane, 1,200 user I/Os across 22 banks, and configurable I/O standards including LVDS, SSTL, and HSTL. It supports JTAG, SelectMAP, and SPI configuration modes.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	443,200 - determines maximum combinational/sequential logic capacity for custom RTL implementation
DSP Slices	1,728 - enables parallel multiply-accumulate operations for signal processing kernels
Transceiver Speed	25.78125 Gb/s - supports 25G Ethernet, CPRI, and JESD204B interface compliance
Total On-Chip Memory	96.4 Mb - includes block RAM, UltraRAM, and distributed RAM for buffering and lookup tables
I/O Count	1,200 - provides high-density interconnect for multi-protocol board-level integration
TDP	55 W - defines thermal envelope requiring active cooling in compact enclosures
Configuration Mode	Master SPI / SelectMAP / JTAG - enables flexible programming and field updates

Pinout & Package

Package: 2104-ball Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid included.

Pin/Terminal	Circuit Role	Design Meaning
VCCINT	Core Supply	1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation
VCCAUX	Auxiliary Supply	1.8 V supply for configuration logic, transceivers, and I/O banks
VCCO_0	I/O Bank Supply	Programmable 1.2–1.8 V output driver supply for Bank 0 I/Os
MGTAVCC	Transceiver Analog Supply	1.0 V analog supply for GTY transceiver PLLs and serializers
INIT_B	Configuration Status	Open-drain output indicating configuration completion or error state
CCLK	Configuration Clock	Input clock for master SPI configuration mode; up to 100 MHz

Key Features

Feature	Design Value
PCIe Gen4 Hard IP	Integrated endpoint/root complex supporting x16 lanes without external PHY
UltraRAM Blocks	128 × 288 Kb deep memory blocks enabling large FIFOs with single-cycle access
Partial Reconfiguration	Enables dynamic logic swapping during operation for multi-mode system adaptation
GTY Transceivers	24 lanes with built-in PRBS generators/checkers and eye scan for link validation
Security Features	Bitstream encryption (AES-256), HMAC authentication, and secure boot enforcement

Applications

Radar Signal Processing	5G Massive MIMO Baseband
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; GTY transceivers interface with ADC/DAC arrays. Use Value: 25 Gb/s transceivers enable direct connection to high-speed RF sampling converters, reducing latency and PCB layer count.	Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR base station units. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD engines; PCIe Gen4 x16 connects to host CPU for real-time parameter updates. Use Value: 1,728 DSP slices deliver >2.5 TMAC/s throughput for concurrent multi-carrier DPD computation.
High-Energy Physics DAQ	AI Accelerator Co-Processor
Use Scenario: Front-end trigger processing and zero-suppression in particle detector readout systems. IC Role / Device Role / Timing Role: Time-critical pattern matching and data compression using LUT-based state machines and block RAM buffers. Use Value: 443,200 logic cells support >10,000 parallel match engines with sub-10 ns latency.	Use Scenario: Custom tensor operator acceleration tightly coupled with GPU or SoC via AXI4-Stream and PCIe. IC Role / Device Role / Timing Role: Offloads convolution and quantization ops; UltraRAM provides on-die weight storage for low-latency inference. Use Value: 96.4 Mb on-chip memory eliminates off-chip DRAM access bottlenecks for small-batch AI workloads.

Radar Signal Processing

5G Massive MIMO Baseband

Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; GTY transceivers interface with ADC/DAC arrays.

Use Value: 25 Gb/s transceivers enable direct connection to high-speed RF sampling converters, reducing latency and PCB layer count.

Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR base station units.

IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD engines; PCIe Gen4 x16 connects to host CPU for real-time parameter updates.

Use Value: 1,728 DSP slices deliver >2.5 TMAC/s throughput for concurrent multi-carrier DPD computation.

High-Energy Physics DAQ

AI Accelerator Co-Processor

Use Scenario: Front-end trigger processing and zero-suppression in particle detector readout systems.

IC Role / Device Role / Timing Role: Time-critical pattern matching and data compression using LUT-based state machines and block RAM buffers.

Use Value: 443,200 logic cells support >10,000 parallel match engines with sub-10 ns latency.

Use Scenario: Custom tensor operator acceleration tightly coupled with GPU or SoC via AXI4-Stream and PCIe.

IC Role / Device Role / Timing Role: Offloads convolution and quantization ops; UltraRAM provides on-die weight storage for low-latency inference.

Use Value: 96.4 Mb on-chip memory eliminates off-chip DRAM access bottlenecks for small-batch AI workloads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCVU29P-3FSVH2104E	Fewer logic cells (295,200), reduced DSP slices (1,152), same package and transceiver speed	Suitable for mid-bandwidth radar or lower-channel-count 5G systems	Select when full XCVU45P resources are unused and BOM cost reduction is critical
XCVU9P-2FLGA2104I	Lower speed grade (-2), industrial temperature range, 192 GTY transceivers but lower density (154,300 logic cells)	Better suited for extended-temperature embedded control with high transceiver count	Choose for thermal-constrained environments where -3 speed grade is unnecessary

Compared with XCVU29P-3FSVH2104E and XCVU9P-2FLGA2104I, the XCVU45P-3FSVH2104E delivers highest logic density and DSP throughput in the 2104-ball FCBGA footprint, making it optimal for bandwidth- and compute-bound applications where performance margins are non-negotiable.

Availability

XCVU45P-3FSVH2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-energy physics data acquisition requiring stable component supply and long-term program support.

Supply support for XCVU45P-3FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, networking, and embedded systems.

The Virtex UltraScale+ family targets high-performance, high-bandwidth applications demanding deterministic latency, hardened protocol engines, and scalable logic resources - especially in defense, communications infrastructure, and scientific instrumentation.

FAQ

What is the maximum transceiver line rate supported by the XCVU45P-3FSVH2104E?

The XCVU45P-3FSVH2104E supports a maximum transceiver line rate of 25.78125 Gb/s using its GTY transceivers. This enables compliance with 25G Ethernet, JESD204B/C, and CPRI protocols. The XCVU45P-3FSVH2104E achieves this rate with built-in equalization and clock-data recovery circuits, and does not require external retimers for standard PCB trace lengths up to 20 inches.

Does the XCVU45P-3FSVH2104E support partial reconfiguration?

Yes, the XCVU45P-3FSVH2104E supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logic modules during runtime without resetting the entire device. The XCVU45P-3FSVH2104E implements dedicated configuration logic and frame-based bitstream addressing to ensure safe, verified reconfiguration sequences.

What configuration modes are available for the XCVU45P-3FSVH2104E?

The XCVU45P-3FSVH2104E supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI enables fast, single-pin serial loading from flash memory; SelectMAP allows high-speed parallel configuration via microprocessor bus; JTAG is used for debugging and boundary-scan testing. All modes are accessible simultaneously during power-up sequencing.

What is the thermal design power (TDP) of the XCVU45P-3FSVH2104E?

The XCVU45P-3FSVH2104E has a typical thermal design power (TDP) of 55 W under worst-case operating conditions. This value assumes full utilization of logic, DSP, and transceivers at junction temperature of 100°C. The XCVU45P-3FSVH2104E requires a heatsink with ≥0.35°C/W thermal resistance and forced airflow for sustained operation in enclosed systems.

Which memory interface standards does the XCVU45P-3FSVH2104E support?

The XCVU45P-3FSVH2104E supports DDR4, LPDDR4, and RLDRAM3 memory interfaces via dedicated hard memory controller IP. It achieves up to 2400 MT/s data rates on DDR4 with 64-bit wide interfaces. The XCVU45P-3FSVH2104E includes calibration logic, write leveling, and read leveling to maintain signal integrity across temperature and voltage variations.

XCVU45P-3FSVH2104E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex® UltraScale+™

Package/Case:: 2104-BBGA, FCBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 108960

Number of Logic Elements/Cells:: 1906800

Total RAM Bits:: 49597645

Number of I/O:: 416

Number of Gates:: -

Voltage - Supply:: 0.825V ~ 0.876V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 2104-FCBGA (47.5x47.5)

XCVU45P-3FSVH2104E FAQ

1.How can I place an order for XCVU45P-3FSVH2104E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU45P-3FSVH2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU45P-3FSVH2104E reliable?

The price and inventory of XCVU45P-3FSVH2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU45P-3FSVH2104E is usually 5 days.

3.What payment methods are accepted for XCVU45P-3FSVH2104E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU45P-3FSVH2104E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU45P-3FSVH2104E?

XCVU45P-3FSVH2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU45P-3FSVH2104E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU45P-3FSVH2104E?

For technical support, including XCVU45P-3FSVH2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU45P-3FSVH2104E requirements.

6.How does Aetrix verify that XCVU45P-3FSVH2104E is sourced from the original manufacturer or authorized distributors?

All XCVU45P-3FSVH2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU45P-3FSVH2104E meets industry standards.

7.What is the process for return or replacement of XCVU45P-3FSVH2104E?

All XCVU45P-3FSVH2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU45P-3FSVH2104E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU45P-3FSVH2104E part is unused and in its original packaging.

Return procedure for XCVU45P-3FSVH2104E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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