AMD XCVU45P-3FSVH2892E

Overview

XCVU45P-3FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 443,200 logic cells, 2,856 DSP slices, and 72.5 Mb of block RAM; it supports PCIe Gen4 x16, 25G transceivers, and operates at -3 speed grade in a 2892-pin Flip-Chip Stacked Silicon Interconnect (SSI) package for high-end networking and radar processing systems.

For engineers reviewing the XCVU45P-3FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP resource count, thermal envelope, and SSI inter-die routing capability in multi-die architectures.

Technical Context

The XCVU45P-3FSVH2892E implements a multi-die architecture using AMD's Stacked Silicon Interconnect (SSI) technology with four FPGA dies interconnected via silicon interposer; it integrates hardened PCIe Gen4 x16 root port and endpoint blocks, 25G GTY transceivers with PAM4 support, and UltraScale+ memory controller IP supporting DDR4-2400 and RLDRAM3-1600.

It delivers deterministic low-latency signal processing through dedicated AXI-Stream interconnects between dies and includes integrated clock management with 24 MMCMs and 24 PLLs distributed across die boundaries to maintain timing integrity in heterogeneous compute partitions.

Key Specifications

Pinout & Package

The XCVU45P-3FSVH2892E is housed in a 2892-pin Flip-Chip BGA (FSVH2892) package with integrated thermal lid and 0.8 mm ball pitch; pinout is defined across four I/O banks (HR, HP, HPC, and GTY), each with dedicated voltage domains, reference clocks, and termination controls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU29P-3FSVH2892E and XCVU9P-2FLGA2104I, the XCVU45P-3FSVH2892E delivers 50% more DSP slices and 2.3× more block RAM in the same 2892-pin package, enabling monolithic implementation of full-system baseband and radar processing without external memory or logic expansion.

Availability

XCVU45P-3FSVH2892E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-frequency trading systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCVU45P-3FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client applications.

The Virtex UltraScale+ family targets high-throughput, low-latency signal and packet processing in communications infrastructure, defense electronics, and financial acceleration systems.

FAQ

What is the maximum transceiver line rate supported by the XCVU45P-3FSVH2892E?

The XCVU45P-3FSVH2892E supports a maximum transceiver line rate of 25.78125 Gbps using its GTY transceivers. This enables compliance with 25G Ethernet, CPRI, and JESD204B/C standards. The device includes built-in PAM4 encoding capability and programmable equalization to maintain signal integrity over backplanes and optical interfaces. All transceiver lanes are fully functional in the -3 speed grade at junction temperatures up to 100°C.

Does the XCVU45P-3FSVH2892E include hardened PCIe Gen4 IP?

Yes, the XCVU45P-3FSVH2892E integrates hardened PCIe Gen4 x16 root port and endpoint blocks. These are implemented in dedicated silicon, not programmable logic, delivering deterministic latency and full link training compliance without consuming LUTs or DSP slices. The hard IP supports Advanced Error Reporting (AER), hot-plug, and ASPM power states, and operates natively at 16 GT/s per lane with automatic lane reversal and polarity inversion.

What package type and thermal solution does the XCVU45P-3FSVH2892E use?

The XCVU45P-3FSVH2892E uses a 2892-pin Flip-Chip BGA (FSVH2892) package with integrated thermal lid and 0.8 mm ball pitch. It requires a copper-core PCB with ≥6-layer stackup, thermal vias under the package, and forced-air or liquid cooling for sustained operation above 35 W. The thermal lid enables direct contact with cold plates and meets JEDEC JESD51-2 and JESD51-14 standards for thermal characterization.

How many MMCMs and PLLs are available in the XCVU45P-3FSVH2892E?

The XCVU45P-3FSVH2892E contains 24 Mixed-Mode Clock Managers (MMCMs) and 24 Phase-Locked Loops (PLLs), distributed across its four SSI dies. Each MMCM supports fine-grained phase shifting, jitter filtering, and fractional-N synthesis; each PLL provides low-jitter clock multiplication and division. These resources are accessible via dedicated clock routing networks with sub-100 ps skew between adjacent dies for time-critical applications.

Is the XCVU45P-3FSVH2892E compatible with AMD Vivado Design Suite 2023.1?

Yes, the XCVU45P-3FSVH2892E is fully supported in AMD Vivado Design Suite 2023.1 and later versions. Device files, IP integrator templates, and timing constraints are included out-of-the-box. The toolchain provides automated floorplanning for SSI die boundaries, inter-die timing closure guidance, and transceiver wizard support for GTY PAM4 configuration. Bitstream generation and programming via JTAG or Quad-SPI flash are validated for this specific speed grade and package.