AMD XCVU45P-L2FSVH2104E

Overview

XCVU45P-L2FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, and 3,960 DSP slices, configured in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, used in 5G wireless infrastructure baseband processing.

For engineers reviewing the XCVU45P-L2FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (0.35–1.8 V), thermal design power (125 W typical), and PCIe Gen4 x16 interface capability.

Technical Context

The XCVU45P-L2FSVH2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate transceivers supporting PAM4 and NRZ signaling. It supports JESD204B/C for high-speed data converter interfacing and includes integrated ARM Cortex-R5 dual-core processors for real-time control.

Configuration is performed via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The device operates across -40°C to +100°C junction temperature range and complies with JEDEC JESD22-A108 for reliability testing.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 39.5 mm × 39.5 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU29P-L2FSVH2104E, the XCVU45P-L2FSVH2104E delivers 50% more logic and 57% more DSP resources within identical thermal and board footprint constraints; versus XCVU57P-L2FSVH2104E, it offers optimal balance of performance, power (125 W vs. 155 W), and cost for deployed 5G and radar platforms.

Availability

XCVU45P-L2FSVH2104E is available at Aetrix Electronics and suitable for 5G wireless infrastructure, aerospace radar systems, and high-performance computing accelerators requiring stable component supply over extended production lifecycles.

Supply support for XCVU45P-L2FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications such as 5G baseband, radar, and AI acceleration, with emphasis on hardened connectivity and security features.

FAQ

What is the maximum transceiver line rate supported by the XCVU45P-L2FSVH2104E?

The XCVU45P-L2FSVH2104E supports a maximum transceiver line rate of 32.75 Gb/s per lane using its UltraScale+ GTY transceivers. This enables implementation of 400G DR4 optical interfaces, 100G KR4 backplane links, and JESD204C data converter connections. The device includes 64 GTY transceivers, each configurable for NRZ or PAM4 signaling depending on protocol requirements.

Does the XCVU45P-L2FSVH2104E include hardened PCIe Gen4 support?

Yes, the XCVU45P-L2FSVH2104E integrates a hardened PCIe Gen4 x16 endpoint/root port block capable of 32 GT/s operation. This eliminates the need for soft IP implementation, guarantees timing closure, and provides native support for advanced features including ASPM L1 substates, SR-IOV, and ATS. The XCVU45P-L2FSVH2104E's PCIe hard IP is fully compliant with PCI-SIG specifications v4.0.

What I/O standards are supported by the XCVU45P-L2FSVH2104E bank structure?

The XCVU45P-L2FSVH2104E supports 18 I/O standards across its 24 I/O banks, including LVCMOS (1.0–1.8 V), SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential standards like LVDS, BLVDS, and RSDS. Each bank is independently powered, allowing mixed-voltage operation. The XCVU45P-L2FSVH2104E also supports on-die termination and programmable slew rate control per pin group.

Is the XCVU45P-L2FSVH2104E qualified for industrial temperature operation?

Yes, the XCVU45P-L2FSVH2104E is rated for industrial temperature operation with a junction temperature range of -40°C to +100°C. It meets JEDEC JESD22-A108 reliability standards and is qualified for continuous operation in outdoor 5G base stations, avionics systems, and industrial automation controllers. Thermal management must maintain case temperature ≤ 95°C under full load.

Does the XCVU45P-L2FSVH2104E include embedded processors?

Yes, the XCVU45P-L2FSVH2104E integrates dual ARM Cortex-R5F processors running at up to 600 MHz, with 256 KB of tightly coupled memory (TCM) per core and AXI coherency support. These processors handle real-time configuration management, partial reconfiguration sequencing, and system monitoring tasks, enabling the XCVU45P-L2FSVH2104E to operate as an autonomous subsystem without external microcontroller dependency.