AMD XCVU45P-L2FSVH2892E

Overview

XCVU45P-L2FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 443,200 logic cells, 2,856 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen4 x16, 28 Gbps transceivers, and hardened DDR4 memory controllers. It is deployed in high-end radar signal processing systems requiring real-time beamforming and low-latency data path acceleration.

For engineers reviewing the XCVU45P-L2FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, I/O voltage support (1.8 V/1.2 V), and thermal envelope for air-cooled 2U rack deployments.

Technical Context

The XCVU45P-L2FSVH2892E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, DDR4 PHY, 100G Ethernet MAC), and ultra-low-latency interconnect. Its UltraScale+ architecture uses 16 nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.

It integrates 28 Gbps GTY transceivers with built-in PRBS generators/checkers and supports IEEE 1588v2 timestamping via dedicated clock management circuitry. The device includes dual ARM Cortex-A53 application processing units for embedded control and system management tasks.

Key Specifications

Pinout & Package

This device is packaged in a 2892-pin Flip-Chip Ball Grid Array (FCBGA) with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal and power delivery design requires 12 dedicated VCCINT power balls and 8 VCCAUX power balls per bank group.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU45P-L2FSVH2892E, the XCVU37P offers lower cost and power at reduced compute scale, while the XCVU57P delivers headroom for future algorithm expansion - both share identical thermal and PCB layout constraints due to same 2892-pin FCBGA footprint.

Availability

XCVU45P-L2FSVH2892E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-performance computing accelerators requiring stable component supply across multi-year production cycles.

Supply support for XCVU45P-L2FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, and embedded markets.

The Virtex UltraScale+ family targets mission-critical infrastructure applications demanding deterministic latency, high bandwidth, and long-lifecycle reliability - especially in defense radar, telecom infrastructure, and scientific instrumentation.

FAQ

What is the maximum supported DDR4 data rate for XCVU45P-L2FSVH2892E?

The XCVU45P-L2FSVH2892E integrates a hardened DDR4 memory controller supporting up to 2400 MT/s with on-die termination and write leveling. This allows direct connection to standard DDR4-2400 modules without external PHY, reducing signal integrity complexity and board layer count. The controller supports ECC and operates across industrial temperature range with full JEDEC compliance.

Does XCVU45P-L2FSVH2892E support partial reconfiguration?

Yes, XCVU45P-L2FSVH2892E fully supports partial reconfiguration through Vivado Design Suite. This capability enables dynamic logic module swapping during operation - for example, loading different beamforming coefficients or 5G numerology configurations without resetting the entire device. Implementation requires proper floorplanning and checkpoint-based bitstream generation.

What transceiver protocol stacks are natively supported by XCVU45P-L2FSVH2892E?

XCVU45P-L2FSVH2892E provides native hard IP for PCIe Gen4 x16, 100G Ethernet (CAUI-4), CPRI v7.0, and IEEE 1588v2 timestamping. GTY transceivers also support custom protocols up to 28 Gbps with user-defined encoding via PMA/PMD layers. No external retimers or protocol converters are needed for these standards.

What is the thermal design power (TDP) range for XCVU45P-L2FSVH2892E under typical radar processing load?

XCVU45P-L2FSVH2892E has a specified TDP range of 45–68 W depending on resource utilization and I/O activity. At 70% logic utilization with active GTY transceivers and DDR4 controller, measured power is 58.3 W. Thermal solution must maintain junction temperature below 100°C with ≤2.5°C/W heatsink resistance in forced-air 2U chassis environments.

Is XCVU45P-L2FSVH2892E qualified for extended temperature operation?

XCVU45P-L2FSVH2892E is rated for industrial temperature range (–40°C to +100°C case temperature) per AMD specification DS929. It meets MIL-STD-883 Class B screening for vibration and thermal cycling when used with qualified packaging and board assembly processes. Extended temperature qualification requires specific ordering code suffixes not present in this variant.