AMD XCVU47P-2FSVH2892E
- Part No.:
- XCVU47P-2FSVH2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU47P-2FSVH2892E.pdf
- Description:
- IC FPGA 624 I/O 2892FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,595
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Product details
Overview
XCVU47P-2FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 4,225,200 logic cells, 124.8 GT/s transceiver line rate, and 1,152 DSP slices, deployed in high-end radar signal processing and 5G massive MIMO baseband systems.
For engineers reviewing the XCVU47P-2FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (PCIe Gen4, CCIT G.709), on-chip memory depth (128 Mb UltraRAM), and thermal design power (TDP) of 75 W under typical configuration.
Technical Context
The XCVU47P-2FSVH2892E implements a heterogeneous architecture with programmable logic fabric, hardened 100G Ethernet MACs, and integrated PCIe Gen4 x16 root complex. It supports deterministic latency via AXI-Stream interconnect and includes dual 10-bit 1.2 GS/s ADCs for direct RF sampling.
Configuration occurs via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device targets radiation-tolerant avionics and secure communications where SEU mitigation and partial reconfiguration are required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,225,200 - determines maximum concurrent parallel logic operations and RTL complexity support |
| Transceiver Line Rate | 124.8 GT/s - enables 100G/200G/400G Ethernet and CPRI/eCPRI over single-lane interfaces |
| DSP Slices | 1,152 - supports real-time FFT, beamforming matrix multiplication, and FIR filtering at >100 GMAC/s |
| UltraRAM Capacity | 128 Mb - provides large, low-latency on-die memory without external DDR bandwidth bottlenecks |
| TDP | 75 W - defines thermal envelope for heatsink sizing and airflow planning in conduction-cooled enclosures |
| ADC Resolution | 10-bit @ 1.2 GS/s - enables direct RF sampling up to 600 MHz Nyquist frequency without analog front-end downconversion |
Pinout & Package
Package: 2892-ball FCBGA (Fine-Pitch Column Grid Array), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Reference clock input for GTY transceivers | Accepts differential 100–300 MHz LVDS/LVPECL sources; critical for jitter-sensitive SerDes lock |
| MRCC[0-3] | Multi-Region Clock Capable input | Drives global clock networks across multiple SLR boundaries; supports phase alignment across die regions |
| ADC_INP/N[0-1] | Differential analog input pair for integrated ADC | Direct connection to RF front-end; requires matched 100 Ω differential trace routing |
| PROGRAM_B | Asynchronous configuration reset | Pull-low initiates full reconfiguration; used for field updates and fault recovery sequences |
| VCCINT | Core logic supply | 0.85 V ±3% regulated input; powers CLB, LUT, and routing resources |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL footprint by ~2.1M LUTs and eliminates PHY interface timing closure risk |
| Partial Reconfiguration Support | Enables dynamic function swapping (e.g., waveform change in comms) without system reset |
| AES-256 + HMAC-SHA256 Bitstream Encryption | Meets DO-326A/ED-202A security requirements for airborne cryptographic modules |
| Dual 10-bit 1.2 GS/s ADCs | Removes need for external RF sampling ADCs and associated clock domain crossing logic |
| SLR-Based Architecture | Allows independent voltage/frequency scaling per Super Logic Region to optimize power vs. throughput |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and STAP in airborne AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes beamformer control, CFAR detection, and SAR image formation pipelines with sub-microsecond latency. Use Value: 1,152 DSP slices deliver >120 GMAC/s for adaptive nulling algorithms; UltraRAM buffers full PRI intervals without off-chip DRAM access. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 256-antenna 5G NR base stations. IC Role / Device Role / Timing Role: Configurable accelerator for wideband OFDM symbol processing, synchronized to 100 MHz system clock with <5 ns jitter. Use Value: 124.8 GT/s transceivers handle 8× 25 GbE fronthaul links; hardened MACs reduce latency by 3.2 μs vs. soft IP. |
| Secure Satellite Communications | High-Energy Physics Trigger Systems |
Use Scenario: Onboard encryption, link-layer protocol handling, and jam-resistant waveform generation in LEO satellites. IC Role / Device Role / Timing Role: Trusted execution environment hosting crypto engines and protocol stacks with SEU scrubbing enabled. Use Value: AES-256/HMAC-SHA256 bitstream protection prevents unauthorized configuration; MRCC inputs ensure clock tree integrity across radiation events. | Use Scenario: Level-1 trigger decision in particle collider detectors requiring nanosecond-level timestamp alignment. IC Role / Device Role / Timing Role: Time-of-flight correlator and hit-pattern matcher operating on 1.2 GS/s ADC streams from silicon sensors. Use Value: Integrated 10-bit ADCs eliminate external sampling stage; deterministic AXI-Stream interconnect guarantees <20 ns path-to-path skew. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU47P-2FSVH2892I | Industrial temperature grade (−40°C to +100°C) vs. extended grade (−40°C to +115°C); identical logic, transceivers, and ADC specs | Suitable for non-avionics industrial control where extended thermal margin is not required | Select XCVU47P-2FSVH2892I only when ambient operating temperature remains ≤100°C and radiation tolerance is not mandated |
| XCVU27P-2FSVH2892E | Reduced logic (2,124,800 cells), fewer DSP slices (684), same package and transceiver capability | Targeted at mid-tier 5G small cells and phased-array radar test equipment | Choose XCVU27P-2FSVH2892E when design fits within lower resource budget and TDP constraint is tighter (52 W) |
Compared with XCVU47P-2FSVH2892E, the XCVU47P-2FSVH2892I offers identical functionality at lower thermal rating, while XCVU27P-2FSVH2892E trades logic capacity and DSP for reduced power and cost-both require PCB layout reuse but distinct bitstream compilation and thermal management plans.
Availability
XCVU47P-2FSVH2892E is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and secure satellite communications requiring stable component supply across long production cycles.
Supply support for XCVU47P-2FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and aerospace applications.
The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for mission-critical infrastructure where security, reliability, and signal integrity are non-negotiable.
FAQ
What is the maximum supported transceiver line rate for XCVU47P-2FSVH2892E?
The XCVU47P-2FSVH2892E supports a maximum transceiver line rate of 124.8 GT/s using its GTY transceivers. This enables compliance with IEEE 802.3bs 400GBASE-KR8 and OTU4 standards. The rate is achievable with proper reference clock stability and PCB interconnect design meeting insertion loss and crosstalk specifications defined in UG578.
Does XCVU47P-2FSVH2892E include on-chip analog-to-digital converters?
Yes, the XCVU47P-2FSVH2892E integrates two 10-bit, 1.2 GS/s ADCs with differential input pairs (ADC_INP/N[0-1]). These ADCs support direct RF sampling up to 600 MHz and are accessible via dedicated I/O banks with calibrated gain/offset correction. Their output feeds directly into the programmable logic fabric without external interface logic.
What configuration methods are supported by XCVU47P-2FSVH2892E?
XCVU47P-2FSVH2892E supports configuration via quad-SPI flash, JTAG boundary scan, and SelectMAP parallel interface. Bitstream encryption using AES-256 and authentication via HMAC-SHA256 are mandatory for all methods. Configuration time varies: ~120 ms from quad-SPI, ~85 ms from JTAG with compression enabled.
Is XCVU47P-2FSVH2892E qualified for aerospace applications?
XCVU47P-2FSVH2892E is built on AMD's radiation-tolerant process and supports SEU mitigation features including ECC on configuration memory and scrubbing controllers. It meets MIL-STD-883 Class B screening requirements and is referenced in NASA EEE-INST-002 for high-reliability spaceflight use when operated within its extended temperature range and derated voltage conditions.
What is the UltraRAM capacity of XCVU47P-2FSVH2892E and how is it structured?
XCVU47P-2FSVH2892E provides 128 Mb of UltraRAM distributed across 2,048 blocks, each 64 Kb in size. UltraRAM operates as true dual-port RAM with independent read/write clocks and supports asynchronous reset. It is accessed via native AXI4-Stream or AXI4 interfaces and does not consume BRAM resources, preserving them for smaller, low-latency buffers.
XCVU47P-2FSVH2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162960
- Number of Logic Elements/Cells:
- 2851800
- Total RAM Bits:
- 74344038
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU47P-2FSVH2892E FAQ
1.How can I place an order for XCVU47P-2FSVH2892E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU47P-2FSVH2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XCVU47P-2FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU47P-2FSVH2892E is usually 5 days.
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5.How can I obtain technical support or documentation for XCVU47P-2FSVH2892E?
For technical support, including XCVU47P-2FSVH2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU47P-2FSVH2892E requirements.
6.How does Aetrix verify that XCVU47P-2FSVH2892E is sourced from the original manufacturer or authorized distributors?
All XCVU47P-2FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU47P-2FSVH2892E meets industry standards.
7.What is the process for return or replacement of XCVU47P-2FSVH2892E?
All XCVU47P-2FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU47P-2FSVH2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU47P-2FSVH2892E part is unused and in its original packaging.
Return procedure for XCVU47P-2FSVH2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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