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AMD XCVU47P-3FSVH2892E
- Part No.:
- XCVU47P-3FSVH2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU47P-3FSVH2892E.pdf
- Description:
- IC FPGA 624 I/O 2892FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,807
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Product details
Overview
XCVU47P-3FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 4,224K logic cells, 124.8 GT/s transceiver line rate, 1,536 DSP slices, and 102.4 GB/s memory bandwidth via DDR4 and RLDRAM3 interfaces - deployed in 5G radio units and AI inference accelerators.
For engineers reviewing the XCVU47P-3FSVH2892E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver performance at 124.8 GT/s, hardened PCIe Gen4/Gen5 and CCIX support, and thermal design power of 75 W under typical configuration.
Technical Context
The XCVU47P-3FSVH2892E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen5 x16, CCIX 1.1, 100G Ethernet MAC), and ultra-low-latency memory controllers. It supports dual-die stacking with silicon interposer for high-bandwidth interconnect between logic and memory resources.
Its transceiver subsystem includes 64 GTY transceivers operating up to 32.75 Gb/s per lane, with built-in PRBS generation/checking, eye monitoring, and adaptive equalization - enabling direct interface to optical modules and high-speed SerDes links.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,224K - enables large-scale RTL implementations such as multi-core SoC subsystems or real-time signal processing pipelines |
| Transceiver Line Rate | 124.8 GT/s aggregate - supports 64×32.75 Gb/s GTY lanes for 100G/400G Ethernet and CPRI/eCPRI fronthaul |
| DSP Slices | 1,536 - delivers 32-bit floating-point throughput up to 12.3 TFLOPS for AI/ML matrix operations |
| Memory Bandwidth | 102.4 GB/s - achieved via dual-channel DDR4-2400 and RLDRAM3-2133 controllers with AXI4 interface |
| TDP (Typical) | 75 W - defines thermal envelope for air-cooled carrier board layout with 6-layer PCB and 2 oz copper |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - supports direct connection to ADCs, sensors, and high-speed memory without level-shifting |
Pinout & Package
Package: 2892-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, 49.0 mm × 49.0 mm body size, and thermal lid for enhanced heat dissipation in high-power configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 0.85 V ±3% required for logic fabric and CLB operation; decoupling must meet AMD UG578 spec |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% powers configuration logic, PCIe block, and clock management tiles |
| MGTAVCC | Transceiver analog supply | 0.95 V ±2% critical for GTY PLL stability and jitter compliance below 0.3 ps RMS |
| CLK_IN_0 | Dedicated clock input | Accepts single-ended or differential reference clocks up to 1.2 GHz for MMCM/PLL locking |
| INIT_B | Configuration status indicator | Active-low open-drain output signaling successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen5 x16 controller | Enables direct host CPU attachment without external switch; supports SR-IOV and ATS for virtualized workloads |
| CCIX 1.1 coherency interface | Allows cache-coherent data sharing with x86 and Arm CPUs - essential for heterogeneous compute acceleration |
| UltraScale+ memory controller | Supports DDR4-2400 and RLDRAM3-2133 with ECC, burst lengths up to 128, and AXI4-Stream bridging |
| Adaptive logic module (ALM) | Each ALM provides 6-input LUT + 2 FFs + carry chain - improves routing efficiency over 7-series CLBs |
| GTY transceiver with PMA/FEC | Includes built-in forward error correction and PRBS pattern generation for deterministic link training |
Applications
| 5G Massive MIMO Radio Unit | AI Inference Accelerator |
|---|---|
Use Scenario: Real-time beamforming and channel estimation on massive antenna arrays with sub-100 μs latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CORDIC, and matrix inversion kernels; GTY transceivers interface directly to RFICs via JESD204B v2.0. Use Value: 124.8 GT/s aggregate bandwidth enables full 64-antenna path sampling at 245.76 MSPS with zero packet loss. | Use Scenario: Low-latency inference engine for vision transformers running on edge servers with PCIe Gen5 host interface. IC Role / Device Role / Timing Role: Configurable accelerator executing quantized INT8/FP16 ops; PCIe Gen5 x16 provides 32 GB/s bidirectional host memory access. Use Value: 1,536 DSP slices deliver sustained 12.3 TFLOPS for real-time object detection at 120 FPS on 4K video streams. |
| High-Frequency Trading Engine | Test & Measurement Equipment |
Use Scenario: Deterministic order execution pipeline with hardware-accelerated risk checking and market data parsing. IC Role / Device Role / Timing Role: Time-critical logic implemented in ALMs with sub-nanosecond timing closure; GTY lanes connect to low-jitter 10G/25G network interfaces. Use Value: 0.3 ps RMS jitter on GTY receivers ensures <1 ns timestamp uncertainty for microsecond-level trade arbitration. | Use Scenario: Modular oscilloscope front-end supporting 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: High-speed ADC interface via JESD204B, real-time spectral processing in logic fabric, and PCIe Gen5 streaming to host PC. Use Value: Dual DDR4-2400 channels provide 102.4 GB/s buffer bandwidth for continuous 10 GS/s waveform capture over 100 ms duration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU47P-2FSVH2892E | Lower speed grade (-2): 112.8 GT/s max transceiver rate, 65 W TDP, reduced timing margin for 32.75 Gb/s lanes | Suitable for cost-sensitive 100G Ethernet systems where full 124.8 GT/s is not required | Select when thermal budget is constrained and PCIe Gen5 x16 is not needed |
| XCVU57P-3FSVH2892E | Higher density: 5,220K logic cells, 1,920 DSP slices, same package and I/O but larger die area | Required for larger AI model partitioning or multi-protocol baseband processing beyond XCVU47P capacity | Choose when >4,224K logic cells or >1,536 DSP slices are needed for target workload |
Compared with XCVU47P-2FSVH2892E, the XCVU47P-3FSVH2892E delivers higher transceiver performance and tighter timing margins; compared with XCVU57P-3FSVH2892E, it offers identical I/O and thermal footprint at lower logic/DSP resource cost - making it optimal for balanced 5G and AI acceleration designs.
Availability
XCVU47P-3FSVH2892E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge inference, and high-frequency trading systems requiring stable component supply across extended production lifecycles.
Supply support for XCVU47P-3FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive computing, and intelligent technologies for data centers, AI, and embedded systems.
The Virtex UltraScale+ family targets high-bandwidth, low-latency applications including 5G wireless infrastructure, AI acceleration, and test equipment - with emphasis on hardened protocol engines and scalable memory bandwidth.
FAQ
What is the maximum transceiver line rate supported by the XCVU47P-3FSVH2892E?
The XCVU47P-3FSVH2892E supports a maximum transceiver line rate of 124.8 GT/s aggregate across its 64 GTY transceivers, with individual lanes operating up to 32.75 Gb/s. This capability is validated per AMD UG578 and enables compliance with 100G/400G Ethernet, CPRI/eCPRI, and JESD204B v2.0 standards. The XCVU47P-3FSVH2892E achieves this using adaptive equalization and built-in PRBS testing.
Does the XCVU47P-3FSVH2892E include a hardened PCIe Gen5 controller?
Yes, the XCVU47P-3FSVH2892E integrates a hardened PCIe Gen5 x16 controller compliant with PCI-SIG specification rev 5.0. It supports features including SR-IOV, ATS, and ECN, and operates at 32 GT/s per lane. This eliminates the need for external PCIe switches in host-attached accelerator designs. The XCVU47P-3FSVH2892E uses this controller for direct CPU-FPGA coherency in AI and storage applications.
What memory interfaces are supported by the XCVU47P-3FSVH2892E?
The XCVU47P-3FSVH2892E supports DDR4-2400 (dual-channel, 72-bit with ECC) and RLDRAM3-2133 (36-bit) memory interfaces via dedicated hard IP controllers. Both interfaces use AXI4 protocol and support burst lengths up to 128. The XCVU47P-3FSVH2892E delivers 102.4 GB/s peak bandwidth across these interfaces, verified in AMD UG909 for real-time buffer and frame store applications.
What is the thermal design power (TDP) of the XCVU47P-3FSVH2892E under typical configuration?
The XCVU47P-3FSVH2892E has a typical thermal design power (TDP) of 75 W when configured with moderate logic utilization, active GTY transceivers, and memory controllers. This value is specified in AMD UG578 for air-cooled environments with 6-layer PCBs and 2 oz copper. The XCVU47P-3FSVH2892E requires thermal lid contact and ≥4 CFM airflow for sustained operation at rated performance.
Is the XCVU47P-3FSVH2892E pin-compatible with other Virtex UltraScale+ FPGAs in the same package?
The XCVU47P-3FSVH2892E shares the 2892-pin FCBGA package footprint with XCVU47P-2FSVH2892E and XCVU57P-3FSVH2892E, but pin functions differ due to variant-specific I/O bank allocation and hardened IP placement. While mechanical mounting is identical, PCB redesign is required when substituting between speed grades or densities. The XCVU47P-3FSVH2892E pinout is documented in AMD UG575 and must be verified per design.
XCVU47P-3FSVH2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162960
- Number of Logic Elements/Cells:
- 2851800
- Total RAM Bits:
- 74344038
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU47P-3FSVH2892E FAQ
1.How can I place an order for XCVU47P-3FSVH2892E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU47P-3FSVH2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU47P-3FSVH2892E reliable?
The price and inventory of XCVU47P-3FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU47P-3FSVH2892E is usually 5 days.
3.What payment methods are accepted for XCVU47P-3FSVH2892E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU47P-3FSVH2892E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU47P-3FSVH2892E?
XCVU47P-3FSVH2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU47P-3FSVH2892E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU47P-3FSVH2892E?
For technical support, including XCVU47P-3FSVH2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU47P-3FSVH2892E requirements.
6.How does Aetrix verify that XCVU47P-3FSVH2892E is sourced from the original manufacturer or authorized distributors?
All XCVU47P-3FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU47P-3FSVH2892E meets industry standards.
7.What is the process for return or replacement of XCVU47P-3FSVH2892E?
All XCVU47P-3FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU47P-3FSVH2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU47P-3FSVH2892E part is unused and in its original packaging.
Return procedure for XCVU47P-3FSVH2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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