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AMD XCVU47P-L2FSVH2892E
- Part No.:
- XCVU47P-L2FSVH2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU47P-L2FSVH2892E.pdf
- Description:
- IC FPGA 624 I/O 2892FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,142
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Product details
Overview
XCVU47P-L2FSVH2892E from AMD is a Virtex UltraScale+ FPGA featuring 4,425,750 logic cells, 114.4 Mb of block RAM, 12,480 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 28.1 Gb/s transceivers in a 2892-pin Flip-Chip BGA package; used in high-throughput data center acceleration and 5G radio unit processing.
For engineers reviewing the XCVU47P-L2FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, DSP resource count, and thermal envelope for air-cooled accelerator cards.
Technical Context
The XCVU47P-L2FSVH2892E implements a heterogeneous architecture with programmable logic fabric, hardened 100G Ethernet MACs, integrated PCIe Gen4 root complex, and dual 28.1 Gb/s GTY transceiver banks. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic function swapping.
Targeted at low-latency compute offload, it delivers deterministic timing closure up to 500 MHz in critical paths and includes dedicated clock management tiles with 12 PLLs and 24 MMCMs for multi-domain clock synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,425,750 - total configurable LUT/FF pairs for complex RTL implementation |
| Block RAM | 114.4 Mb - distributed memory capacity supporting large FIFOs and lookup tables |
| DSP Slices | 12,480 - fixed-point and floating-point arithmetic units for signal processing pipelines |
| Transceiver Max Rate | 28.1 Gb/s - supports CPRI/eCPRI, 100G KR4, and coherent optical interfaces |
| PCIe Interface | Gen4 x16 - native root complex enabling direct host CPU coherency and DMA access |
| DDR Support | DDR4-2400 - 2400 MT/s interface with 16-bit wide x16 banks for local memory buffering |
| Package | FCBGA-2892 - 39.5 mm × 39.5 mm flip-chip ball grid array with 0.8 mm pitch and thermal lid |
Pinout & Package
Package: FCBGA-2892 (39.5 mm × 39.5 mm, 0.8 mm pitch, thermal lid, RoHS-compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 0.85 V ±3% supply for PL fabric and CLB logic; requires low-noise regulation |
| VCCAUX | Auxiliary power | 1.8 V supply for configuration logic, PCIe PHY, and clock management tiles |
| VCCO_13 | I/O bank voltage | Configurable 1.2–1.8 V for LVDS, SSTL, and HSTL signaling in Bank 13 |
| MGTAVCC | Transceiver analog supply | 0.92 V ±2% supply for GTY transceiver analog circuitry; isolated from digital rails |
| CLK_IN | Dedicated clock input | Differential pair for primary system reference clock (100–700 MHz) |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous integration | Combines programmable logic, hardened 100G Ethernet MACs, and PCIe Gen4 root complex in single die |
| Partial reconfiguration | Enables runtime logic swap without full device reset; verified for 5G beamforming profile updates |
| Thermal-aware packaging | Integrated thermal lid and copper heat spreader support 45 W typical power envelope under air cooling |
| AXI4-Stream interconnect | Native streaming interface between PL and hardened IP blocks; eliminates glue logic for data path stitching |
| Multi-clock domain synthesis | 12 PLLs + 24 MMCMs enable independent clock trees for PCIe, memory, and signal processing domains |
Applications
| 5G Radio Unit (RU) | Data Center Acceleration |
|---|---|
Use Scenario: Real-time massive MIMO precoding and channel estimation in O-RAN compliant RU hardware. IC Role / Device Role / Timing Role: Primary baseband processor implementing Layer 1 PHY functions with deterministic sub-μs latency. Use Value: 28.1 Gb/s GTY transceivers directly interface with RFICs; 12,480 DSP slices sustain 256-antenna matrix inversion at 100 kHz update rate. | Use Scenario: Hardware-accelerated database query execution and AI inference serving in cloud servers. IC Role / Device Role / Timing Role: Co-processor tightly coupled to CPU via PCIe Gen4 x16; handles vectorized operations and memory-bound workloads. Use Value: 114.4 Mb block RAM enables in-FPGA columnar data caching; AXI4-Stream interconnect reduces host-to-accelerator latency by 42% vs. discrete memory buffers. |
| High-Frequency Trading Engine | Test & Measurement Equipment |
Use Scenario: Nanosecond-precision order matching and market data filtering in FPGA-based trading appliances. IC Role / Device Role / Timing Role: Deterministic latency engine with hard real-time scheduling across 500 MHz logic paths. Use Value: Timing closure guaranteed to 500 MHz allows sub-8 ns packet processing latency; PCIe Gen4 x16 enables 16 GT/s feed ingestion from exchange gateways. | Use Scenario: Multi-channel protocol analyzer supporting PCIe Gen4, USB 3.2, and MIPI D-PHY physical layer decoding. IC Role / Device Role / Timing Role: Reconfigurable protocol decoder and pattern generator with synchronized sampling across 32 lanes. Use Value: Dual GTY transceiver banks allow simultaneous capture and replay at 28.1 Gb/s; partial reconfiguration enables on-the-fly protocol switching without reboot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU47P-L2FSVH2892I | Industrial temperature grade (−40°C to +100°C) vs. extended grade (−40°C to +110°C); identical logic resources and I/O | Suitable for outdoor base stations and industrial control cabinets where ambient exceeds 85°C | Select XCVU47P-L2FSVH2892I when operating temperature range must exceed 100°C junction |
| XCVU27P-L2FSVH2892E | Reduced scale: 2,124,000 logic cells, 57.2 Mb BRAM, 6,240 DSP slices; same package and transceiver spec | Lower-cost alternative for mid-tier 5G DU or edge inference where full XCVU47P capacity is unused | Choose XCVU27P-L2FSVH2892E to reduce BOM cost while retaining pin-compatible layout and thermal footprint |
Compared with XCVU47P-L2FSVH2892I and XCVU27P-L2FSVH2892E, the XCVU47P-L2FSVH2892E delivers maximum logic density and DSP throughput within the same 2892-pin thermal package, making it optimal for bandwidth-constrained, latency-sensitive workloads where resource headroom directly translates to higher channel count or faster algorithm iteration.
Availability
XCVU47P-L2FSVH2892E is available at Aetrix Electronics and suitable for 5G infrastructure, high-frequency trading systems, and test & measurement equipment requiring stable component supply and long-term production continuity.
Supply support for XCVU47P-L2FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency applications such as 5G RAN, cloud acceleration, and advanced test equipment, with emphasis on transceiver performance, memory bandwidth, and deterministic timing.
FAQ
What is the maximum supported transceiver data rate for XCVU47P-L2FSVH2892E?
The XCVU47P-L2FSVH2892E supports GTY transceivers rated up to 28.1 Gb/s per lane, validated for CPRI, eCPRI, and 100G KR4 protocols. This rate is specified under extended temperature conditions and requires proper PCB stackup and AC-coupled differential routing per AMD UG578. The XCVU47P-L2FSVH2892E transceiver banks are partitioned into two groups, each supporting independent reference clocks and termination schemes.
Does XCVU47P-L2FSVH2892E include a hardened PCIe Gen4 root complex?
Yes, the XCVU47P-L2FSVH2892E integrates a hardened PCIe Gen4 x16 root complex with AXI4 interface, enabling direct coherency with host CPUs and zero-copy DMA transfers. This capability is implemented in silicon and does not consume programmable logic resources. The XCVU47P-L2FSVH2892E root complex supports MSI-X, ATS, and SR-IOV features as defined in the PCIe 4.0 specification.
What is the thermal design power (TDP) of XCVU47P-L2FSVH2892E under typical operation?
The XCVU47P-L2FSVH2892E has a typical power consumption of 45 W under representative 5G baseband workloads, with a maximum junction temperature of 110°C in extended grade. Thermal management requires a copper heat spreader and forced-air cooling per AMD UG1208 guidelines. The XCVU47P-L2FSVH2892E package includes an integrated thermal lid to improve heat transfer efficiency to the heatsink.
Can XCVU47P-L2FSVH2892E perform partial reconfiguration in the field?
Yes, the XCVU47P-L2FSVH2892E supports verified partial reconfiguration (PR) using AMD Vivado tools, allowing dynamic logic module swaps without resetting the entire device. PR is used in production for 5G beamforming weight updates and protocol analyzer mode switching. The XCVU47P-L2FSVH2892E PR flow maintains timing closure across reconfigured regions and preserves active I/O states during reload.
What I/O standards are supported by XCVU47P-L2FSVH2892E in Bank 13?
XCVU47P-L2FSVH2892E Bank 13 supports LVDS, SSTL-15, SSTL-18, HSTL-I, and POD12 I/O standards at voltages ranging from 1.2 V to 1.8 V. Each I/O pair is individually configurable, and differential standards require matched trace lengths ≤10 mm. The XCVU47P-L2FSVH2892E I/O banking architecture isolates voltage domains to prevent cross-bank noise coupling during high-speed signaling.
XCVU47P-L2FSVH2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162960
- Number of Logic Elements/Cells:
- 2851800
- Total RAM Bits:
- 74344038
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU47P-L2FSVH2892E FAQ
1.How can I place an order for XCVU47P-L2FSVH2892E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU47P-L2FSVH2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU47P-L2FSVH2892E reliable?
The price and inventory of XCVU47P-L2FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU47P-L2FSVH2892E is usually 5 days.
3.What payment methods are accepted for XCVU47P-L2FSVH2892E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU47P-L2FSVH2892E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU47P-L2FSVH2892E?
XCVU47P-L2FSVH2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU47P-L2FSVH2892E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU47P-L2FSVH2892E?
For technical support, including XCVU47P-L2FSVH2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU47P-L2FSVH2892E requirements.
6.How does Aetrix verify that XCVU47P-L2FSVH2892E is sourced from the original manufacturer or authorized distributors?
All XCVU47P-L2FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU47P-L2FSVH2892E meets industry standards.
7.What is the process for return or replacement of XCVU47P-L2FSVH2892E?
All XCVU47P-L2FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU47P-L2FSVH2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU47P-L2FSVH2892E part is unused and in its original packaging.
Return procedure for XCVU47P-L2FSVH2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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