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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCVU57P-1FSVK2892E

Name: XCVU57P-1FSVK2892E
Brand: AMD
SKU: XCVU57P-1FSVK2892E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCVU57P-1FSVK2892E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 2892-BBGA, FCBGA

Datasheet:: XCVU57P-1FSVK2892E.pdf

Description:: IC FPGA VIRTEX-UP 2892BGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCVU57P-1FSVK2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,724K logic cells, 11,520 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, used in high-throughput data center acceleration and radar signal processing.

For engineers reviewing the XCVU57P-1FSVK2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility, thermal design power budget, and configuration interface options (e.g., dual BPI, QSPI, JTAG).

Technical Context

The XCVU57P-1FSVK2892E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated RFSoC analog-to-digital converters in select variants - though this specific variant excludes RF ADCs. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path stitching.

Configuration occurs via master SPI or slave parallel modes, with bitstream encryption using AES-256 and HMAC-SHA256 authentication. The device operates across -40°C to +100°C junction temperature range and complies with JESD204B/C for high-speed serial data converter interfacing.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	3,724K - determines maximum combinational/sequential logic capacity for custom IP integration
DSP Slices	11,520 - enables concurrent high-precision math operations for FFT, filtering, and matrix computation
Block RAM	104.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM
GTY Transceivers	64 lanes @ 25.8 Gb/s - supports multi-lane protocols including PCIe Gen4, 100G Ethernet, and CPRI/eCPRI
I/O Standards	Supports LVCMOS, SSTL, HSTL, MIPI, and differential signaling up to 1.8 V - enables direct interfacing with diverse memory and sensor peripherals
Configuration Interface	Quad-SPI, BPI x16, JTAG - allows flexible boot source selection and field-upgradable bitstreams

Pinout & Package

Package: 2892-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder sphere array optimized for high-power FPGA thermal dissipation.

Pin/Terminal	Circuit Role	Design Meaning
VCCINT	Core supply rail	Supplies 0.85 V ±3% to programmable logic and routing fabric; requires low-noise regulation
VCCAUX	Auxiliary supply rail	Provides 1.8 V to configuration circuitry, transceiver reference clocks, and I/O banks
MIO[0:7]	Multi-use I/O pins	Configurable as SDIO, UART, SPI, or GPIO; used for boot device communication and system management
GTY_RXN/P[0:63]	Differential transceiver inputs	Accept AC-coupled high-speed serial data; support CDR lock at 25.8 Gb/s with adaptive equalization
CONFIG_DONE	Configuration status output	Asserted high when bitstream loading completes successfully and device enters user mode

Key Features

Feature	Design Value
Hardened PCIe Gen4 x16 Root Port	Reduces latency and resource usage versus soft IP; enables direct host CPU coherency via CCIX-compatible interconnect
UltraScale+ Memory Controller	Supports DDR4-2400 and LPDDR4-4266 with ECC, enabling deterministic memory access for real-time workloads
Partial Reconfiguration Support	Allows dynamic swapping of logic regions without resetting entire device - critical for mission-critical fault recovery
AES-256 Bitstream Encryption	Prevents IP theft and unauthorized cloning by securing configuration data stored in external flash
AXI4-Stream Interconnect Fabric	Enables zero-copy data movement between IP blocks at up to 512-bit width and 300 MHz clock domain

Applications

Radar Signal Processing	Data Center Acceleration
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; GTY transceivers interface with high-speed ADC/DACs. Use Value: Achieves sub-microsecond latency for adaptive waveform generation and target tracking updates.	Use Scenario: Offloading AI inference and database query acceleration in cloud servers. IC Role / Device Role / Timing Role: Configured as PCIe-attached accelerator with DMA engines and custom compute kernels. Use Value: Delivers >2× throughput vs. GPU-based solutions for sparse neural network workloads.
5G Baseband Processing	High-Frequency Trading Systems
Use Scenario: Layer 1 PHY processing for massive MIMO and channel estimation in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Implements OFDM modulation/demodulation, LDPC decoding, and precoding in hardwired logic. Use Value: Meets 3GPP Release 16 timing constraints with deterministic <100 ns jitter on symbol boundaries.	Use Scenario: Ultra-low-latency order matching and risk calculation in electronic trading platforms. IC Role / Device Role / Timing Role: FPGA acts as deterministic packet processor with hardware-accelerated market data parsing and decision logic. Use Value: Reduces end-to-end latency to <750 ns from network ingress to trade execution signal.

Radar Signal Processing

Data Center Acceleration

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; GTY transceivers interface with high-speed ADC/DACs.

Use Value: Achieves sub-microsecond latency for adaptive waveform generation and target tracking updates.

Use Scenario: Offloading AI inference and database query acceleration in cloud servers.

IC Role / Device Role / Timing Role: Configured as PCIe-attached accelerator with DMA engines and custom compute kernels.

Use Value: Delivers >2× throughput vs. GPU-based solutions for sparse neural network workloads.

5G Baseband Processing

High-Frequency Trading Systems

Use Scenario: Layer 1 PHY processing for massive MIMO and channel estimation in 5G NR gNodeB units.

IC Role / Device Role / Timing Role: Implements OFDM modulation/demodulation, LDPC decoding, and precoding in hardwired logic.

Use Value: Meets 3GPP Release 16 timing constraints with deterministic <100 ns jitter on symbol boundaries.

Use Scenario: Ultra-low-latency order matching and risk calculation in electronic trading platforms.

IC Role / Device Role / Timing Role: FPGA acts as deterministic packet processor with hardware-accelerated market data parsing and decision logic.

Use Value: Reduces end-to-end latency to <750 ns from network ingress to trade execution signal.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCVU57P-2FSVK2892I	Higher speed grade (-2), 10% higher max operating frequency, 15% higher TDP (28W vs. 24.5W)	Better suited for timing-closure-critical designs requiring >350 MHz system clocks	Select when design cannot meet setup/hold timing at -1 speed grade, especially with large custom datapaths
XCVU9P-1FLVB2104E	Smaller logic capacity (2,586K cells), fewer GTY lanes (40), same package footprint but different ball map	Targeted at mid-range compute acceleration where full XCVU57P resources are unnecessary	Choose for cost-sensitive deployments with relaxed bandwidth and logic density requirements

Compared with XCVU57P-1FSVK2892E, the -2I variant trades higher power for improved timing margin, while the XCVU9P offers reduced cost and area at the expense of transceiver count and logic scale - making each suitable for distinct performance tiers within infrastructure acceleration.

Availability

XCVU57P-1FSVK2892E is available at Aetrix Electronics and suitable for data center acceleration, radar signal processing, and 5G baseband development requiring stable component supply across long production cycles.

Supply support for XCVU57P-1FSVK2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.

The Virtex UltraScale+ family delivers scalable FPGA platforms for infrastructure applications demanding high bandwidth, low latency, and hardware adaptability - especially in compute-intensive edge and cloud systems.

FAQ

What is the maximum supported data rate per GTY transceiver lane in XCVU57P-1FSVK2892E?

The XCVU57P-1FSVK2892E supports up to 25.8 Gb/s per GTY transceiver lane, validated per IEEE 802.3bj and OIF CEI-28G specifications. This rate enables compliance with PCIe Gen4, 100G Ethernet (4×25G), and CPRI Option 10. The actual achievable rate depends on PCB channel loss, reference clock stability, and equalization settings configured in Vivado.

Does XCVU57P-1FSVK2892E support DDR4 memory interfaces?

Yes, XCVU57P-1FSVK2892E includes hardened UltraScale+ memory controllers supporting DDR4-2400 (1200 MHz) with 16-bit or 32-bit data widths, on-die termination, and ECC capability. It requires external DDR4 components compliant with JEDEC DDR4-2400 spec and proper board-level signal integrity design per UG571.

What configuration modes are supported by XCVU57P-1FSVK2892E?

XCVU57P-1FSVK2892E supports master SPI, slave parallel (BPI), JTAG, and fallback configuration modes. Quad-SPI is commonly used for fast boot from serial flash; BPI x16 enables high-speed parallel loading from NOR flash. Configuration security features include AES-256 decryption and HMAC-SHA256 authentication.

Is XCVU57P-1FSVK2892E qualified for industrial temperature operation?

Yes, the XCVU57P-1FSVK2892E is rated for industrial temperature range (–40°C to +100°C junction temperature). Its thermal design requires active cooling or heatsink mounting due to 24.5 W typical power consumption. Thermal solution must maintain junction temperature within spec under worst-case logic utilization and transceiver activity.

Can XCVU57P-1FSVK2892E implement partial reconfiguration?

Yes, XCVU57P-1FSVK2892E fully supports partial reconfiguration through Vivado Design Suite. Users can dynamically reload logic modules (e.g., filter banks or protocol engines) without disrupting other running functions. This capability requires dedicated PR controller IP and careful floorplanning to isolate reconfigurable partitions.

XCVU57P-1FSVK2892E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex® UltraScale+™

Package/Case:: 2892-BBGA, FCBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 162960

Number of Logic Elements/Cells:: 2851800

Total RAM Bits:: 74344038

Number of I/O:: 624

Number of Gates:: -

Voltage - Supply:: 0.825V ~ 0.876V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 2892-FCBGA (55x55)

XCVU57P-1FSVK2892E FAQ

1.How can I place an order for XCVU57P-1FSVK2892E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU57P-1FSVK2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU57P-1FSVK2892E reliable?

The price and inventory of XCVU57P-1FSVK2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU57P-1FSVK2892E is usually 5 days.

3.What payment methods are accepted for XCVU57P-1FSVK2892E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU57P-1FSVK2892E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU57P-1FSVK2892E?

XCVU57P-1FSVK2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU57P-1FSVK2892E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU57P-1FSVK2892E?

For technical support, including XCVU57P-1FSVK2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU57P-1FSVK2892E requirements.

6.How does Aetrix verify that XCVU57P-1FSVK2892E is sourced from the original manufacturer or authorized distributors?

All XCVU57P-1FSVK2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU57P-1FSVK2892E meets industry standards.

7.What is the process for return or replacement of XCVU57P-1FSVK2892E?

All XCVU57P-1FSVK2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU57P-1FSVK2892E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU57P-1FSVK2892E part is unused and in its original packaging.

Return procedure for XCVU57P-1FSVK2892E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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