Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XCVU57P-2FSVK2892E

Part No.:
XCVU57P-2FSVK2892E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
2892-BBGA, FCBGA
Datasheet:
AetrixXCVU57P-2FSVK2892E.pdf
Description:
IC FPGA VIRTEX-UP 2892BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,065

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XCVU57P-2FSVK2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,734,400 logic cells, 114.4 Mb of block RAM, 10,240 DSP slices, and support for up to 58.5 GT/s PAM4 transceivers - deployed in AI acceleration, high-speed networking, and radar signal processing systems.

For engineers reviewing the XCVU57P-2FSVK2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, DSP throughput, and thermal envelope under sustained compute load.

Technical Context

The XCVU57P-2FSVK2892E implements a heterogeneous architecture with programmable logic fabric, hardened 100G/400G Ethernet MACs, PCIe Gen4 x16 root complex endpoints, and integrated DDR4/LPDDR4 memory controllers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Its transceiver banks operate at 58.5 GT/s (PAM4) or 29.25 GT/s (NRZ), with built-in FEC and PRBS generation. The device uses 16nm FinFET process technology and requires dual-supply sequencing (VCCINT, VCCAUX, VCCO, VRP).

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells3,734,400 - determines maximum concurrent parallel logic depth and gate-equivalent capacity for RTL implementation
Block RAM114.4 Mb - enables large on-die buffering for packet assembly, frame storage, or coefficient tables
DSP Slices10,240 - delivers 22.5 TOPS INT8 peak compute for convolutional kernels in AI inference pipelines
Transceiver Max Rate58.5 GT/s PAM4 - supports 400G-FR4/DR4 optical interface without gearbox ICs
I/O StandardsLVDS, MIPI D-PHY, SSTL, HSTL, POD - enables direct interfacing to image sensors, memory, and SerDes PHYs
Package2892-pin FCBGA (FSVK) - 39.5 mm × 39.5 mm body, 0.8 mm pitch, 1.2 mm height, RoHS-compliant

Pinout & Package

Package: 2892-ball Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), designated FSVK, with thermal lid and edge-plated contacts for EMI control and mechanical stability.

Pin/TerminalCircuit RoleDesign Meaning
VCCINT_0ACore power supplySupplies 0.85 V ±3% to PL logic fabric; requires low-noise regulation and local decoupling
MGTAVCC_100Transceiver analog supplyProvides 0.95 V to GTY transceiver banks; sensitive to ripple & must be isolated from digital rails
IO_L1P_T0_0Configurable I/O bank 0Supports LVDS/SSTL-15; used for clock input or high-speed parallel interface to ADC/DAC
SRN_0Configuration resetActive-low asynchronous reset for configuration logic; pulled high via external 10 kΩ resistor
CLK_IN1_M2CPrimary configuration clockAccepts 10–600 MHz single-ended or differential reference clock for startup and JTAG operations

Key Features

FeatureDesign Value
Heterogeneous compute fabricCombines programmable logic, hardened 400G Ethernet MACs, and PCIe Gen4 x16 endpoints for system-on-module integration
UltraScale+ memory hierarchyIncludes UltraRAM (288 Kb primitives), BRAM (36 Kb), and distributed RAM - enabling hierarchical buffer design with sub-ns access latency
Adaptive compute accelerationSupports partial reconfiguration to swap accelerator kernels dynamically during runtime without full reboot
Thermal-aware packagingFCBGA with integrated thermal lid and copper pillar interconnects - sustains 55 W typical power under sustained AI workload
Security-enforced bootHardware-accelerated AES-256 decryption and HMAC-SHA-384 authentication for bitstream integrity and anti-cloning

Applications

Radar Signal ProcessingAI Inference Acceleration

Use Scenario: Real-time beamforming and CFAR detection in phased-array radar systems operating at X-band.

IC Role / Device Role / Timing Role: FPGA fabric executes FFT, matrix inversion, and pulse-Doppler filtering; transceivers interface to RFSoC ADC/DAC tiles.

Use Value: 58.5 GT/s PAM4 links enable direct JESD204C connectivity to multi-GSPS ADCs, eliminating serialization bottlenecks.

Use Scenario: Edge deployment of vision transformer models for industrial defect inspection with <50 ms latency.

IC Role / Device Role / Timing Role: Configurable logic implements custom INT8 convolution pipelines; UltraRAM buffers feature maps between layers.

Use Value: 10,240 DSP slices deliver deterministic 22.5 TOPS INT8 throughput without external AI accelerators.

400G Optical TransportTest & Measurement Equipment

Use Scenario: Line card in programmable OTN switch supporting FlexO and OTUCn framing.

IC Role / Device Role / Timing Role: Hardened 400G Ethernet MACs handle PCS/PMA layer; logic fabric implements OPUk mapping and Tandem Connection Monitoring.

Use Value: Integrated FEC and PRBS generators reduce need for external forward-error-correction ASICs.

Use Scenario: High-resolution arbitrary waveform generator with 12-bit DAC output at 2.5 GS/s.

IC Role / Device Role / Timing Role: FPGA generates precise timing sequences for DAC control; transceivers synchronize multiple instrument modules via JESD204B/C.

Use Value: Sub-100 fs jitter on transceiver clocks ensures <72 dBc SFDR in wideband signal synthesis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU57P-2FLVB2104I2104-ball FLVB package (35 mm × 35 mm); lower I/O count (624 vs. 832); same logic/DSP/transceiver specsBetter suited for space-constrained PCBs where board area is critical and I/O expansion is limitedSelect when footprint reduction outweighs I/O scalability needs
XCVU9P-2FLGB2104ELower density: 2,562,240 logic cells, 76.8 Mb BRAM, 6,880 DSP slices; same 58.5 GT/s transceivers and FSVK-compatible FLGB packageTargeted at cost-sensitive 100G/200G systems requiring less compute but identical high-speed serial interface complianceSelect when application compute load fits within reduced resources and thermal budget is tighter

Compared with XCVU57P-2FLVB2104I and XCVU9P-2FLGB2104E, the XCVU57P-2FSVK2892E provides highest I/O count and logic capacity in the Virtex UltraScale+ portfolio, making it optimal for full-featured 400G+ line cards and AI training preprocessor subsystems where resource headroom directly impacts time-to-market.

Availability

XCVU57P-2FSVK2892E is available at Aetrix Electronics and suitable for AI accelerator modules, 400G optical line cards, and phased-array radar subsystems requiring stable component supply across multi-year production cycles.

Supply support for XCVU57P-2FSVK2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI processors for data center, communications, and embedded markets.

The Virtex UltraScale+ family targets high-throughput, low-latency infrastructure applications such as 400G/800G networking, real-time radar, and AI model preprocessing - emphasizing transceiver performance, memory bandwidth, and security-hardened configuration.

FAQ

What is the maximum supported transceiver line rate for XCVU57P-2FSVK2892E?

The XCVU57P-2FSVK2892E supports up to 58.5 GT/s using PAM4 signaling and 29.25 GT/s using NRZ modulation per transceiver lane. This capability enables native 400G-FR4 and 400G-DR4 optical interface implementations without external gearbox ICs. All transceiver banks are fully compliant with IEEE 802.3bs and CEI-11G-LR standards. The XCVU57P-2FSVK2892E achieves this performance using AMD's hardened GTY transceiver architecture with integrated FEC and PRBS engines.

Does XCVU57P-2FSVK2892E support partial reconfiguration?

Yes, the XCVU57P-2FSVK2892E supports dynamic partial reconfiguration (PR) through its ICAP and FRAME_ECC interfaces. This allows functional modules - such as encryption engines or protocol stacks - to be swapped at runtime without resetting the entire device. PR is enabled by the UltraScale+ configuration architecture and verified in Vivado 2023.2 toolflow. The XCVU57P-2FSVK2892E maintains full I/O and memory context during reconfiguration, ensuring deterministic latency for mission-critical applications.

What power supply requirements does XCVU57P-2FSVK2892E have?

The XCVU57P-2FSVK2892E requires four regulated supplies: VCCINT (0.85 V ±3%), VCCAUX (1.8 V), VCCAUX_IO (1.8 V), and VCCO (0.75–1.8 V, bank-dependent). Each supply has defined ramp-rate, sequencing, and ripple specifications documented in DS922. The XCVU57P-2FSVK2892E also mandates VRP reference voltage (0.75 V) for certain I/O banks. Power delivery must meet AMD's recommended decoupling network layout to ensure stable operation under 55 W typical load.

Is XCVU57P-2FSVK2892E compatible with Vivado Design Suite?

Yes, the XCVU57P-2FSVK2892E is fully supported in AMD Vivado Design Suite starting from version 2018.3, with complete device definition, timing models, and IP integrator support. Synthesis, implementation, and bitstream generation for the XCVU57P-2FSVK2892E are validated against hardware test vectors and production silicon characterization. Latest tool compatibility is confirmed in UG973 (Vivado Design Suite User Guide: Implementation).

What security features are implemented in XCVU57P-2FSVK2892E?

The XCVU57P-2FSVK2892E integrates hardware-accelerated AES-256 decryption and HMAC-SHA-384 authentication for bitstream confidentiality and integrity verification. It supports eFUSE-based key storage, secure boot with fallback image, and tamper-detection circuitry that triggers zeroization on physical intrusion. These features are active by default in production-grade XCVU57P-2FSVK2892E devices and enforced during configuration and runtime via dedicated security monitors. The XCVU57P-2FSVK2892E meets Common Criteria EAL4+ certification requirements for secure FPGA deployment.

XCVU57P-2FSVK2892E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex® UltraScale+™
Package/Case:
2892-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
162960
Number of Logic Elements/Cells:
2851800
Total RAM Bits:
74344038
Number of I/O:
624
Number of Gates:
-
Voltage - Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
2892-FCBGA (55x55)

XCVU57P-2FSVK2892E FAQ

1.How can I place an order for XCVU57P-2FSVK2892E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU57P-2FSVK2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU57P-2FSVK2892E reliable?

The price and inventory of XCVU57P-2FSVK2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU57P-2FSVK2892E is usually 5 days.

3.What payment methods are accepted for XCVU57P-2FSVK2892E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU57P-2FSVK2892E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU57P-2FSVK2892E?

XCVU57P-2FSVK2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU57P-2FSVK2892E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU57P-2FSVK2892E?

For technical support, including XCVU57P-2FSVK2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU57P-2FSVK2892E requirements.

6.How does Aetrix verify that XCVU57P-2FSVK2892E is sourced from the original manufacturer or authorized distributors?

All XCVU57P-2FSVK2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU57P-2FSVK2892E meets industry standards.

7.What is the process for return or replacement of XCVU57P-2FSVK2892E?

All XCVU57P-2FSVK2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU57P-2FSVK2892E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU57P-2FSVK2892E part is unused and in its original packaging.

Return procedure for XCVU57P-2FSVK2892E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCVU57P-2FSVK2892E Tags

  • XCVU57P-2FSVK2892E
  • XCVU57P-2FSVK2892E PDF
  • XCVU57P-2FSVK2892E Datasheet
  • XCVU57P-2FSVK2892E Specifications
  • XCVU57P-2FSVK2892E Images
  • AMD
  • AMD XCVU57P-2FSVK2892E
  • Buy XCVU57P-2FSVK2892E
  • XCVU57P-2FSVK2892E Price
  • XCVU57P-2FSVK2892E Distributor
  • XCVU57P-2FSVK2892E Supplier
  • XCVU57P-2FSVK2892E Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER