AMD XCVU57P-3FSVK2892E

Overview

XCVU57P-3FSVK2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,314,880 logic cells, 10,800 DSP slices, and 134.4 GB/s transceiver bandwidth with 32 GTY transceivers operating up to 32.75 Gb/s. It targets high-throughput data center acceleration, radar signal processing, and 5G wireless infrastructure.

For engineers reviewing the XCVU57P-3FSVK2892E datasheet, pinout, applications, or equivalent options, key selection factors include GTY transceiver count and speed, on-chip memory depth, logic cell density, and thermal design power envelope for air-cooled rack deployments.

Technical Context

The XCVU57P-3FSVK2892E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4 x16, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency memory interfaces. Its 2892-pin Flip-Chip BGA package supports 1.2 V core voltage and -40°C to +100°C industrial temperature operation.

It delivers deterministic timing closure for multi-gigabit serial protocols via dedicated clock routing networks and integrated PLL/MMCM resources. The device includes 1,120 block RAMs (each 36 Kb), 1,248 UltraRAM blocks (each 288 Kb), and supports AXI4-Stream and AXI4-Full interconnects for SoC-style integration.

Key Specifications

Pinout & Package

The XCVU57P-3FSVK2892E is housed in a 2892-pin Flip-Chip BGA (FCBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for active cooling integration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU57P-2FSVK2892I and XCVU9P-3FLGA2577E, the XCVU57P-3FSVK2892E provides the highest logic density and transceiver count in the Virtex UltraScale+ family, making it optimal for systems requiring maximum I/O bandwidth and computational throughput within a single FPGA die.

Availability

XCVU57P-3FSVK2892E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, data center acceleration, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCVU57P-3FSVK2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications including wired/wireless communications, defense electronics, and scientific instrumentation.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU57P-3FSVK2892E?

The XCVU57P-3FSVK2892E supports GTY transceivers operating up to 32.75 Gb/s per lane. This rating is guaranteed under industrial temperature conditions (-40°C to +100°C) and with proper PCB stackup, power integrity, and reference clock jitter below 0.3 ps RMS. The XCVU57P-3FSVK2892E achieves this performance using adaptive equalization and decision feedback equalization (DFE) built into each GTY channel.

Does the XCVU57P-3FSVK2892E include hardened PCIe Gen4 IP?

Yes, the XCVU57P-3FSVK2892E integrates a hardened PCIe Gen4 x16 endpoint block compliant with PCI-SIG specifications. It supports link training, power management states (L0s/L1), and advanced error reporting. The XCVU57P-3FSVK2892E enables direct memory access (DMA) with sub-500 ns latency and maintains coherency with host CPU caches via CXL-compatible extensions in select configurations.

What is the total on-chip memory capacity of the XCVU57P-3FSVK2892E?

The XCVU57P-3FSVK2892E provides 1,120 block RAMs (each 36 Kb) and 1,248 UltraRAM blocks (each 288 Kb), totaling approximately 360 Mb of UltraRAM plus 40.3 Mb of block RAM. This memory hierarchy supports mixed workloads: block RAM for low-latency control structures and UltraRAM for deep streaming buffers. The XCVU57P-3FSVK2892E allows independent read/write ports and asynchronous clock domains across both memory types.

Is the XCVU57P-3FSVK2892E qualified for industrial temperature operation?

Yes, the XCVU57P-3FSVK2892E is rated for industrial temperature range (-40°C to +100°C case temperature) and is supplied in the FSVK2892E package variant. Thermal management must maintain junction temperature below 125°C under full utilization. The XCVU57P-3FSVK2892E includes on-die temperature sensors and dynamic thermal throttling controls accessible via JTAG or ICAP interface.

What configuration modes does the XCVU57P-3FSVK2892E support?

The XCVU57P-3FSVK2892E supports master SPI, slave SPI, BPI, and PCIe configuration modes. It also enables fallback configuration from secondary flash and supports partial reconfiguration via ICAP. Configuration bitstreams can be encrypted using AES-256 keys stored in eFUSE, and authenticated using HMAC-SHA256. The XCVU57P-3FSVK2892E validates integrity before loading and halts on mismatch.