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AMD XCVU57P-L2FSVK2892E
- Part No.:
- XCVU57P-L2FSVK2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU57P-L2FSVK2892E.pdf
- Description:
- IC FPGA VIRTEX-UP LP 2892BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,301
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Product details
Overview
XCVU57P-L2FSVK2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,724K logic cells, 11,520 DSP slices, and 112.5 Gb/s transceiver bandwidth (32×3.125–28.0 Gb/s). It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, deployed in AI acceleration and high-throughput data center compute blades.
For engineers reviewing the XCVU57P-L2FSVK2892E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage support, thermal envelope (2892-pin FC-BGA, 35×35 mm), and configuration interface compatibility with BPI or SPI.
Technical Context
The XCVU57P-L2FSVK2892E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated hard IP blocks including dual 100G Ethernet MACs, PCIe Gen4 x16 root port/endpoint, and quad 72-bit DDR4 memory controllers running up to 2400 MT/s. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic function swapping.
Configuration is performed via master SPI or BPI mode using external flash; bitstream encryption and HMAC authentication are supported. The device operates across -2L (industrial) temperature range with junction temperature up to 100°C and requires multi-rail power sequencing (VCCINT=0.85 V, VCCAUX=1.8 V, VCCO=1.2–1.8 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,724K - Enables large-scale RTL implementations such as multi-core SoC subsystems or real-time signal processing pipelines. |
| DSP Slices | 11,520 - Supports concurrent execution of >10k MAC operations per cycle for AI inference kernels. |
| Transceivers | 32 lanes, 3.125–28.0 Gb/s - Meets 100G Ethernet (4×25G), 200G (4×50G PAM4), and CPRI/eCPRI fronthaul requirements. |
| Memory Controller | 4×72-bit DDR4 @ 2400 MT/s - Delivers >172 GB/s aggregate memory bandwidth for streaming data applications. |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - Enables direct interfacing with image sensors, ADCs, and high-speed serial peripherals. |
| Configuration | Master SPI/BPI with AES-256 & HMAC - Ensures secure bitstream loading and anti-cloning protection in field-deployed systems. |
Pinout & Package
Package: 2892-pin Flip-Chip Ball Grid Array (FC-BGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O Bank 65 | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V operation for peripheral control. |
| GTYP[0:31] | High-speed transceiver banks | Each pair supports differential AC-coupled signaling at up to 28 Gb/s; requires precise PCB trace length matching. |
| DDR4_CK[0:3] | DDR4 clock outputs | Differential clocks for four independent 72-bit DDR4 channels; routed with matched length and controlled impedance. |
| CONFIG_IO | Configuration mode select | Pulled high for Master SPI mode; pulled low for BPI mode - determines boot source and interface timing. |
| VCCINT | Core logic supply | 0.85 V ±3% regulated input; requires low-noise, high-current VRM with <10 mV ripple for stable LUT/DSP operation. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces latency and FPGA resource usage for host CPU offload tasks compared to soft IP implementations. |
| Partial Reconfiguration Support | Enables runtime swapping of functional modules without system reset - critical for mission-critical telecom and radar systems. |
| UltraScale+ DSP Slice Architecture | 27×18 multiplier + 48-bit accumulator per slice allows fused multiply-add (FMA) in single cycle for neural network layers. |
| Integrated 100G Ethernet MAC | Eliminates need for external MAC PHY chips, reducing BOM cost and board area in optical transport line cards. |
| Secure Boot with AES-256 | Prevents unauthorized firmware execution by validating encrypted bitstream integrity before configuration. |
Applications
| AI Inference Accelerator | Data Center SmartNIC |
|---|---|
Use Scenario: Real-time video analytics on edge servers using INT8 convolutional neural networks. IC Role / Device Role / Timing Role: Programmable logic fabric executes custom CNN pipelines; transceivers feed frame data from 4×10G SFP+ ports. Use Value: Achieves 128 TOPS INT8 throughput with deterministic sub-10 µs latency per inference batch. | Use Scenario: Offloading TCP/IP stack, RDMA, and packet filtering in cloud hypervisor environments. IC Role / Device Role / Timing Role: Acts as PCIe-attached co-processor; hardened PCIe Gen4 x16 and 100G MAC handle host interface and wire-speed packet processing. Use Value: Reduces CPU utilization by 40% while sustaining 100 Gbps line-rate forwarding with <500 ns jitter. |
| Radar Signal Processor | 5G Massive MIMO Baseband Unit |
Use Scenario: Pulse-Doppler processing and CFAR detection in airborne AESA radar systems. IC Role / Device Role / Timing Role: Configurable logic implements FFT, beamforming, and tracking algorithms; DDR4 controller buffers raw ADC samples. Use Value: Processes 8-channel 1.2 GS/s ADC streams with real-time phase coherence maintained across all channels. | Use Scenario: Digital pre-distortion (DPD) and OFDM modulation/demodulation in 64T64R active antenna units. IC Role / Device Role / Timing Role: FPGA fabric hosts adaptive DPD lookup tables and I/Q data path; GTY transceivers interface with RFIC JESD204B links. Use Value: Enables 200 MHz instantaneous bandwidth with ACLR < -55 dBc using real-time feedback loop compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU57P-L2FSVA2104E | 2104-pin FC-BGA, smaller package (27×27 mm); reduced I/O count (528 vs. 832) and memory bandwidth (2×72-bit DDR4). | Suitable for space-constrained embedded systems where full 2892-pin I/O and 4-channel DDR4 are not required. | Select when board area and thermal budget are constrained but same logic/DSP capacity is needed. |
| XCVU9P-L2FSVA2104E | Lower logic density (2,586K cells), fewer DSP slices (8,520), no hardened 100G MAC; supports only PCIe Gen3 x16. | Targeted at mid-tier compute acceleration and prototyping platforms with lower bandwidth demands. | Choose for cost-sensitive designs requiring Gen3 PCIe and moderate transceiver count (20 lanes). |
Compared with XCVU57P-L2FSVK2892E, the XCVU57P-L2FSVA2104E offers identical logic and DSP resources in a smaller footprint but sacrifices I/O scalability and memory bandwidth, while the XCVU9P-L2FSVA2104E reduces both performance tier and hard IP integration - making it suitable for less demanding workloads.
Availability
XCVU57P-L2FSVK2892E is available at Aetrix Electronics and suitable for AI accelerator cards, 5G baseband units, and high-end radar signal processors requiring stable component supply across extended product lifecycles.
Supply support for XCVU57P-L2FSVK2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and aerospace markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency applications such as real-time AI inference, 5G infrastructure, and defense-grade signal processing - with emphasis on hardened connectivity and memory subsystems.
FAQ
What is the maximum operating junction temperature for XCVU57P-L2FSVK2892E?
The XCVU57P-L2FSVK2892E is rated for industrial temperature range (-40°C to +100°C junction). Its thermal design requires active cooling and proper PCB copper pour under the 35×35 mm FC-BGA package to maintain safe operation at full logic and transceiver utilization. The XCVU57P-L2FSVK2892E datasheet specifies 100°C as the absolute maximum junction temperature under continuous load.
Does XCVU57P-L2FSVK2892E support partial reconfiguration?
Yes, the XCVU57P-L2FSVK2892E fully supports partial reconfiguration through Vivado Design Suite tools. This capability enables dynamic module swapping during runtime without resetting the entire device - essential for applications like adaptive radar waveform generation and multi-standard wireless base stations. The XCVU57P-L2FSVK2892E implements dedicated configuration logic and frame-based bitstream addressing to ensure safe, atomic updates.
What configuration modes does XCVU57P-L2FSVK2892E support?
The XCVU57P-L2FSVK2892E supports Master SPI, Slave Serial, and BPI configuration modes. Master SPI is most common for compact flash-based boot; BPI is used for parallel NOR flash with higher throughput. Configuration mode is selected via CONFIG_IO pin state at power-up. The XCVU57P-L2FSVK2892E also supports fallback configuration and dual-boot via external multiplexer control.
Which DDR4 memory speeds are supported by XCVU57P-L2FSVK2892E?
The XCVU57P-L2FSVK2892E supports DDR4-2400 (1200 MHz clock, 2400 MT/s data rate) across all four 72-bit channels. It implements write-leveling, read-leveling, and gate training to meet JEDEC DDR4 timing specifications. The XCVU57P-L2FSVK2892E memory controller does not support DDR4-3200 or LPDDR4; those require newer Versal or Alveo devices.
Is XCVU57P-L2FSVK2892E pin-compatible with other Virtex UltraScale+ devices?
No, the XCVU57P-L2FSVK2892E uses a unique 2892-pin FC-BGA package (35×35 mm) and is not pin-compatible with other Virtex UltraScale+ variants such as the 2104-pin XCVU57P-L2FSVA2104E or XCVU9P series. Pin assignments, power rail distribution, and I/O bank placement differ significantly. Migration between packages requires full PCB redesign and signal integrity revalidation. The XCVU57P-L2FSVK2892E must be treated as a distinct layout entity.
XCVU57P-L2FSVK2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162960
- Number of Logic Elements/Cells:
- 2851800
- Total RAM Bits:
- 74344038
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU57P-L2FSVK2892E FAQ
1.How can I place an order for XCVU57P-L2FSVK2892E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU57P-L2FSVK2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU57P-L2FSVK2892E reliable?
The price and inventory of XCVU57P-L2FSVK2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU57P-L2FSVK2892E is usually 5 days.
3.What payment methods are accepted for XCVU57P-L2FSVK2892E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU57P-L2FSVK2892E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU57P-L2FSVK2892E?
XCVU57P-L2FSVK2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU57P-L2FSVK2892E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU57P-L2FSVK2892E?
For technical support, including XCVU57P-L2FSVK2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU57P-L2FSVK2892E requirements.
6.How does Aetrix verify that XCVU57P-L2FSVK2892E is sourced from the original manufacturer or authorized distributors?
All XCVU57P-L2FSVK2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU57P-L2FSVK2892E meets industry standards.
7.What is the process for return or replacement of XCVU57P-L2FSVK2892E?
All XCVU57P-L2FSVK2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU57P-L2FSVK2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU57P-L2FSVK2892E part is unused and in its original packaging.
Return procedure for XCVU57P-L2FSVK2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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