AMD XCVU5P-1FLVA2104E

Overview

XCVU5P-1FLVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 5,685K logic cells, 1,152 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, high-speed data acquisition, and 5G wireless infrastructure.

For engineers reviewing the XCVU5P-1FLVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal performance in FLVA2104 package, and support for partial reconfiguration in real-time systems.

Technical Context

The XCVU5P-1FLVA2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, DDR4 PHY, 100G Ethernet MAC), and scalable memory interfaces. It supports up to 1,152 user I/Os across 24 selectable I/O banks with independent VCCO and VREF per bank.

Its GTY transceivers operate at 25.8 Gb/s with built-in PRBS generators/checkers and PMA-level equalization. The device uses 16 nm FinFET process technology and includes integrated configuration security features including AES-256 bitstream encryption and HMAC authentication.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU9P-2FLGA2104I, the XCVU5P-1FLVA2104E offers balanced performance and power for mainstream high-end applications; compared with XCVU3P-1FLGA2104E, it delivers 70% more logic and 68% more DSP while maintaining identical board layout and thermal envelope.

Availability

XCVU5P-1FLVA2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and defense electronics requiring stable component supply across long production cycles.

Supply support for XCVU5P-1FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and heterogeneous integration.

The Virtex UltraScale+ family targets high-throughput, low-latency applications in wired/wireless communications, aerospace, and advanced test equipment where programmability meets hardened IP efficiency.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU5P-1FLVA2104E?

The XCVU5P-1FLVA2104E supports GTY transceivers operating at up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G Ethernet (4×25G), 400G Ethernet (16×25.8G), and CPRI/eCPRI. The transceiver PMA includes adaptive equalization and programmable pre-emphasis to maintain signal integrity over backplane and cable channels. XCVU5P-1FLVA2104E achieves this performance using AMD's 16 nm FinFET process and calibrated reference clock paths.

Does the XCVU5P-1FLVA2104E support PCIe Gen4 x16 root complex functionality?

Yes, the XCVU5P-1FLVA2104E includes a hardened PCIe Gen4 x16 root complex controller with AXI4 interface, supporting both endpoint and root complex modes. It complies with PCI Express Base Specification Rev 4.0 and supports ASPM L0s/L1, AER, and MSI-X. XCVU5P-1FLVA2104E enables direct CPU-FPGA communication with <100 ns round-trip latency in high-performance computing platforms.

What I/O standards are supported by the HP I/O banks on the XCVU5P-1FLVA2104E?

The HP I/O banks on the XCVU5P-1FLVA2104E support LVCMOS, SSTL, HSTL, POD, and differential standards including LVDS, BLVDS, RSDS, and TMDS. Each bank operates independently at VCCO voltages from 1.2 V to 1.8 V, enabling mixed-interface designs such as DDR4 memory (1.2 V) alongside 1.8 V legacy peripherals. XCVU5P-1FLVA2104E also supports dynamic I/O standard switching under configuration control.

Is partial reconfiguration supported on the XCVU5P-1FLVA2104E, and what tools enable it?

Yes, partial reconfiguration is fully supported on the XCVU5P-1FLVA2104E using AMD Vivado Design Suite v2022.2 or later. The feature allows dynamic replacement of logical partitions without resetting the entire device, enabling runtime adaptation in radar, telecom, and instrumentation systems. XCVU5P-1FLVA2104E provides dedicated configuration logic and secure bitstream loading paths to ensure safe, authenticated partial bitstream updates.

What thermal management features are integrated into the XCVU5P-1FLVA2104E package?

The XCVU5P-1FLVA2104E uses a 2104-pin FCBGA package with integrated thermal lid and copper heat spreader. It includes an on-die thermal diode for real-time junction temperature monitoring via I2C or JTAG. The package supports JEDEC-standard conduction-cooled mounting and is rated for 100°C maximum junction temperature under specified airflow and PCB thermal vias. XCVU5P-1FLVA2104E thermal design guidelines require ≥6×6 array of 10-mil thermal vias under the die area.