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AMD XCVU5P-1FLVA2104I
- Part No.:
- XCVU5P-1FLVA2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU5P-1FLVA2104I.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,766
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Product details
Overview
XCVU5P-1FLVA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,272K logic cells, 89.2 GMAC/s DSP throughput, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for 5G wireless infrastructure baseband processing.
For engineers reviewing the XCVU5P-1FLVA2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, logic density, on-chip memory bandwidth, and thermal envelope for high-throughput signal processing systems.
Technical Context
The XCVU5P-1FLVA2104I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices, and integrated 25.8 Gb/s GTY transceivers. It supports multi-rate serial protocols including CPRI, eCPRI, and JESD204C across 64 transceiver lanes.
This device includes hardened PCIe Gen4 x16 root port and endpoint blocks, AXI4-Stream interconnects, and dual 100G Ethernet MACs. Its configuration interface supports dual-boot via Quad-SPI and BPI, with AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,272,000 - determines maximum concurrent parallel logic functions and RTL complexity capacity |
| DSP Slices | 4,520 - delivers 89.2 GMAC/s at 500 MHz for real-time filtering and matrix operations |
| Block RAM | 72.5 Mb - provides on-die memory for buffering, FFT twiddle tables, and packet queues |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - enables JESD204C-compliant ADC/DAC interfacing and 100G+ backplane links |
| PCIe Interface | Gen4 x16 - supports host CPU co-processing with 32 GB/s bidirectional bandwidth |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - allows direct connection to high-speed sensors, memory, and RF front-end ICs |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral control and debug |
| GTYP/GTYN[0:63] | Differential Transceiver Pair | Supports 25.8 Gb/s PAM4 or NRZ signaling; each pair requires dedicated reference clock routing |
| PCIE_CLK_P/N | Dedicated PCIe Reference Clock | Provides low-jitter 100 MHz differential clock required for PCIe Gen4 link training |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Three independent voltage domains: 0.85 V core, 1.8 V auxiliary, and programmable I/O (1.2–3.3 V) |
| PROGRAM_B | Configuration Initiation | Active-low signal that triggers FPGA reconfiguration from external flash or host processor |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Eliminates soft IP resource consumption and guarantees deterministic latency for CPU-FPGA data exchange |
| 64 GTY transceivers @ 25.8 Gb/s | Enables single-device 4×100G Ethernet or 8×JESD204C links without retimers or gearbox ICs |
| AES-256 + HMAC security | Prevents unauthorized bitstream cloning and ensures runtime integrity verification during configuration |
| Dual-boot configuration | Allows field-upgradable firmware with fallback to known-good image after failed update |
| UltraScale+ DSP slice | Each slice performs 27×18 multiply-accumulate in one cycle, enabling 5G channel estimation at sub-μs latency |
Applications
| 5G Massive MIMO Baseband Unit | AI Accelerator Co-Processor |
|---|---|
Use Scenario: Real-time beamforming, precoding, and channel estimation across 64+ antenna elements in FR1/FR2 bands. IC Role / Device Role / Timing Role: Primary signal processing engine implementing Layer 1 PHY algorithms with deterministic sub-microsecond latency. Use Value: 1,272K logic cells and 4,520 DSP slices enable concurrent execution of 32 independent MU-MIMO streams at 200 MHz clock rate. | Use Scenario: Offloading convolution and matrix multiplication from CPU/GPU in edge inference servers. IC Role / Device Role / Timing Role: High-bandwidth data mover and compute accelerator interfacing with DDR4, HBM2, and NVMe SSDs via AXI4-Stream. Use Value: 64 GTY transceivers provide 160 GB/s aggregate I/O bandwidth to sustain 128 TOPS INT8 throughput without PCIe bottleneck. |
| High-Speed Test Equipment | Multi-Radar Sensor Fusion |
Use Scenario: Generating and analyzing multi-GHz modulated waveforms for semiconductor ATE and 5G component validation. IC Role / Device Role / Timing Role: Real-time waveform synthesis engine synchronized to ultra-low-jitter 100 MHz PCIe reference clock. Use Value: 72.5 Mb block RAM stores 128 MSamples of complex IQ data; GTY lanes stream samples directly to 12-bit, 6.4 GS/s DACs. | Use Scenario: Time-synchronized fusion of LIDAR, millimeter-wave radar, and camera data in autonomous vehicle ECUs. IC Role / Device Role / Timing Role: Deterministic timing hub distributing <1 ns skew clocks to multiple sensor interfaces and managing timestamp alignment. Use Value: Hardened PCIe Gen4 x16 connects to central AI domain controller while GTY lanes handle 10 Gb/s radar echo streams from four ADAS SoCs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | Higher speed grade (-2), 2,586K logic cells, 115.2 GMAC/s, same package and GTY count | Required for >250 MHz system clocks or tighter timing closure in 5G massive MIMO schedulers | Select when design exceeds timing budget of -1 speed grade or requires additional DSP resources |
| XCVU7P-1FLVA2104I | Fewer logic cells (1,024K), reduced DSP slices (3,520), identical GTY count and PCIe Gen4 support | Suitable for mid-tier 5G small cells or radar ECU where cost and power constrain logic utilization | Choose for lower-power deployments with <85% logic utilization and no need for full 1,272K cell capacity |
Compared with XCVU9P-2FLGA2104I and XCVU7P-1FLVA2104I, the XCVU5P-1FLVA2104I offers optimal balance of logic density, DSP throughput, and thermal envelope for 5G FR1 baseband units operating at 200 MHz sustained clock frequency.
Availability
XCVU5P-1FLVA2104I is available at Aetrix Electronics and suitable for 5G wireless infrastructure, AI acceleration platforms, and high-speed test equipment requiring stable component supply and long-term production continuity.
Supply support for XCVU5P-1FLVA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, adaptive SoC, and AI acceleration technologies.
The Virtex UltraScale+ family targets high-throughput, low-latency signal processing in 5G, aerospace, and test & measurement systems, emphasizing hardened I/O, security, and thermal efficiency.
FAQ
What is the maximum supported transceiver data rate for XCVU5P-1FLVA2104I?
The XCVU5P-1FLVA2104I supports GTY transceivers up to 25.8 Gb/s per lane using PAM4 or NRZ modulation. This rate is validated across all 64 transceiver lanes under industrial temperature conditions and is specified in AMD's DS922 documentation. The XCVU5P-1FLVA2104I achieves this performance without requiring external retimers in JESD204C or CPRI applications.
Does XCVU5P-1FLVA2104I support PCIe Gen4 x16 in endpoint mode?
Yes, the XCVU5P-1FLVA2104I includes a hardened PCIe Gen4 x16 endpoint block compliant with PCI Express Base Specification Revision 4.0. It supports both root port and endpoint configurations, with full link training, error reporting, and Advanced Error Reporting (AER) features enabled in the Xilinx Vivado 2023.1 toolchain for the XCVU5P-1FLVA2104I.
What configuration modes are supported by XCVU5P-1FLVA2104I?
The XCVU5P-1FLVA2104I supports Quad-SPI, BPI, and JTAG configuration modes. Dual-boot capability is implemented via two independent bitstream images stored in external flash, allowing fail-safe updates. Configuration security includes AES-256 bitstream encryption and HMAC authentication, both mandatory for secure boot operation of the XCVU5P-1FLVA2104I.
What is the total block RAM capacity of XCVU5P-1FLVA2104I?
The XCVU5P-1FLVA2104I contains 72.5 Mb of total block RAM, distributed across 2,160 BRAM primitives. Each BRAM can be configured as 36 Kb dual-port memory or split into two 18 Kb memories. This capacity is used for FIFOs, coefficient storage, and protocol buffers in 5G PHY layer implementations on the XCVU5P-1FLVA2104I.
Is XCVU5P-1FLVA2104I pin-compatible with other Virtex UltraScale+ FPGAs in the FLVA2104 package?
No, the XCVU5P-1FLVA2104I is not pin-compatible with other Virtex UltraScale+ devices in the 2104-pin FCBGA package. While mechanical footprint and power ballout are identical, I/O bank assignments, GTY placement, and configuration pin locations differ between XCVU5P, XCVU7P, and XCVU9P variants. Board-level reuse requires redesign of signal routing and power delivery for the XCVU5P-1FLVA2104I.
XCVU5P-1FLVA2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 75072
- Number of Logic Elements/Cells:
- 1313763
- Total RAM Bits:
- 190976000
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU5P-1FLVA2104I FAQ
1.How can I place an order for XCVU5P-1FLVA2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU5P-1FLVA2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU5P-1FLVA2104I reliable?
The price and inventory of XCVU5P-1FLVA2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU5P-1FLVA2104I is usually 5 days.
3.What payment methods are accepted for XCVU5P-1FLVA2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU5P-1FLVA2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU5P-1FLVA2104I?
XCVU5P-1FLVA2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU5P-1FLVA2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU5P-1FLVA2104I?
For technical support, including XCVU5P-1FLVA2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU5P-1FLVA2104I requirements.
6.How does Aetrix verify that XCVU5P-1FLVA2104I is sourced from the original manufacturer or authorized distributors?
All XCVU5P-1FLVA2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU5P-1FLVA2104I meets industry standards.
7.What is the process for return or replacement of XCVU5P-1FLVA2104I?
All XCVU5P-1FLVA2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU5P-1FLVA2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU5P-1FLVA2104I part is unused and in its original packaging.
Return procedure for XCVU5P-1FLVA2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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