My Inquiry
My Account
AMD XCVU5P-1FLVB2104E
- Part No.:
- XCVU5P-1FLVB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU5P-1FLVB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,089
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU5P-1FLVB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 5,685K logic cells, 1,128 DSP slices, and 96.2 Gb/s transceiver bandwidth with 25.78 Gb/s GTY transceivers. It integrates hardened 100G Ethernet MACs and PCI Express Gen4 x16 root complex endpoints, targeting AI acceleration, 5G baseband processing, and high-throughput data center offload.
For engineers reviewing the XCVU5P-1FLVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth (72 Mb BRAM), PCIe Gen4 support, and package thermal profile (FLVB2104).
Technical Context
The XCVU5P-1FLVB2104E implements a heterogeneous architecture combining programmable logic fabric, hardened IP blocks, and ultra-low-latency interconnect. It supports dual-die stacking with silicon interposer for increased logic density and bandwidth, and includes integrated ARM Cortex-R5F processors for real-time control subsystems.
Its GTY transceivers comply with IEEE 802.3bj (100GBASE-KR4) and CEI-28G-VSR standards, and the device supports deterministic latency modes for time-sensitive networking applications requiring sub-100 ns jitter tolerance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 5,685K - Enables large-scale AI inference engines or multi-channel 5G PHY layer processing in single-device implementation. |
| DSP Slices | 1,128 - Supports concurrent 16-bit complex multiply-accumulate at >2.5 TMAC/s for radar beamforming or ML training kernels. |
| GTY Transceivers | 48 channels @ 25.78 Gb/s - Delivers full 100G Ethernet (4×25G) or 400G (16×25.78G) connectivity without external retimers. |
| Block RAM | 72 Mb - Provides sufficient on-die memory for packet buffering in 100G firewall or telemetry aggregation pipelines. |
| PCIe Interface | Gen4 x16 Root Complex - Enables direct CPU coherency and DMA access to host memory for FPGA-accelerated compute workloads. |
| Package | FLVB2104 - 2104-pin Flip-Chip BGA with 0.8 mm pitch; supports ≤ 2.5 W/mm² power density under full transceiver + logic load. |
Pinout & Package
Package: FLVB2104 - 2104-ball Flip-Chip BGA, 39.5 mm × 39.5 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Transceiver Reference Clock Input | Accepts 100–300 MHz differential reference for GTY PLL lock; requires dedicated AC-coupled routing. |
| PCIE_CLK_P/N | PCIe Reference Clock | Dedicated 100 MHz differential input for PCIe Gen4 compliance; must meet ±50 ppm frequency tolerance. |
| VCCINT | Core Logic Supply | 0.85 V ±3% supply for programmable fabric; requires low-noise regulation and local decoupling. |
| VCCAUX | Auxiliary I/O & Configuration Supply | 1.8 V supply powering configuration logic, SelectIO banks, and transceiver analog bias circuits. |
| PROGRAM_B | Active-Low Configuration Initiate | Pulls low to reset configuration state machine and reload bitstream from flash or JTAG interface. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort by eliminating need for soft MAC IP; supports IEEE 802.3bs and RS-FEC. |
| ARM Cortex-R5F Dual-Core Subsystem | Enables embedded real-time control of data paths without external microcontroller; runs bare-metal or FreeRTOS. |
| Dual-Die Silicon Interposer | Provides 2× effective logic capacity and 3× inter-die bandwidth vs. monolithic die; enables scalable system-on-package designs. |
| Deterministic Latency Mode | Guarantees <100 ns path-to-path variation across transceiver lanes for TSN and industrial motion control. |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time video analytics at edge data centers using quantized CNN models. IC Role / Device Role / Timing Role: Configurable accelerator executing convolution and activation layers with hardware-timed DDR4/DDR5 memory access. Use Value: Achieves 128 TOPS/W efficiency via parallel DSP slice utilization and on-chip BRAM-based weight caching. | Use Scenario: Multi-user precoding and channel estimation in 64T64R active antenna systems. IC Role / Device Role / Timing Role: Real-time PHY layer processor handling OFDM symbol generation, FFT/IFFT, and digital pre-distortion. Use Value: Meets 3GPP Release 16 latency targets (<100 μs) using deterministic transceiver timing and hardwired FFT engines. |
| Data Center SmartNIC Offload | High-Frequency Trading Engine |
Use Scenario: TLS termination, packet filtering, and RDMA acceleration in cloud server NICs. IC Role / Device Role / Timing Role: PCIe Gen4 endpoint managing host memory-mapped I/O while executing custom datapath logic. Use Value: Reduces CPU load by 70% and cuts end-to-end packet latency to <800 ns via bypassed software stack. | Use Scenario: Order matching and market data parsing with sub-microsecond decision cycles. IC Role / Device Role / Timing Role: Low-jitter timing engine synchronizing FPGA logic to exchange feed clocks and generating deterministic execution windows. Use Value: Guarantees <500 ns worst-case latency variation across 48 GTY lanes for synchronized order broadcast. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLVB2104I | Higher speed grade (-2), 8,225K logic cells, same FLVB2104 package. | Supports higher clock frequencies and larger designs; consumes ~18% more static power. | Select when design requires >600 MHz fabric timing closure or additional DSP resources for wider vector ops. |
| XCVU7P-1FLVB2104E | Fewer logic cells (6,820K), identical GTY count and PCIe Gen4 support. | Lower cost and power envelope; suitable for mid-scale 5G DU or AI inference with reduced model size. | Choose for balanced performance/cost where 5,685K logic cells are insufficient but full XCVU9P capability is unnecessary. |
Compared with XCVU5P-1FLVB2104E, the XCVU9P-2FLVB2104I delivers higher throughput at increased power and cost, while the XCVU7P-1FLVB2104E offers intermediate capacity with identical I/O and transceiver compatibility-enabling scalable platform design across performance tiers.
Availability
XCVU5P-1FLVB2104E is available at Aetrix Electronics and suitable for AI inference acceleration, 5G massive MIMO baseband processing, and high-frequency trading engine development requiring stable component supply across long-lifecycle industrial deployments.
Supply support for XCVU5P-1FLVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets through its FPGA, adaptive SoC, and GPU product lines.
The Virtex UltraScale+ family was engineered for infrastructure acceleration-delivering hardened networking, compute, and memory interfaces in a single device for 5G, AI, and cloud-scale workloads.
FAQ
What is the maximum supported transceiver data rate for XCVU5P-1FLVB2104E?
The XCVU5P-1FLVB2104E supports GTY transceivers rated up to 25.78 Gb/s per lane. This enables native 100G Ethernet (4×25G) and 400G Ethernet (16×25.78G) implementations without retimers. The device meets IEEE 802.3bj and CEI-28G-VSR specifications at this rate, with guaranteed jitter performance under full load conditions.
Does XCVU5P-1FLVB2104E include hardened PCIe Gen4 support?
Yes, XCVU5P-1FLVB2104E integrates a hardened PCIe Gen4 x16 root complex endpoint. It supports full link training, ASPM L0s/L1, and AER reporting. The block operates at 16 GT/s per lane and provides AXI4-Stream and AXI4-MM interfaces for seamless integration with user logic and host memory mapping.
What package type does XCVU5P-1FLVB2104E use?
XCVU5P-1FLVB2104E uses the FLVB2104 package: a 2104-ball Flip-Chip BGA with 0.8 mm pitch, 39.5 mm × 39.5 mm body size, and integrated thermal lid. This package supports high-power operation up to 2.5 W/mm² and is compatible with standard reflow profiles for industrial PCB assembly.
How many Block RAM resources are available in XCVU5P-1FLVB2104E?
XCVU5P-1FLVB2104E provides 72 Mb of total Block RAM (BRAM). This includes 1,800 individual 36 Kb BRAM primitives, configurable as true dual-port, simple dual-port, or single-port memory. The BRAM supports byte-write enable and parity for mission-critical data buffering applications.
Is there an integrated processor subsystem in XCVU5P-1FLVB2104E?
Yes, XCVU5P-1FLVB2104E includes a dual-core ARM Cortex-R5F processor subsystem running at up to 600 MHz. Each core has 32 KB instruction and 32 KB data cache, and the subsystem supports ECC on TCM and AXI bus interfaces. It is intended for real-time control, configuration management, and firmware-driven datapath orchestration alongside programmable logic.
XCVU5P-1FLVB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 75072
- Number of Logic Elements/Cells:
- 1313763
- Total RAM Bits:
- 190976000
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU5P-1FLVB2104E FAQ
1.How can I place an order for XCVU5P-1FLVB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU5P-1FLVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU5P-1FLVB2104E reliable?
The price and inventory of XCVU5P-1FLVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU5P-1FLVB2104E is usually 5 days.
3.What payment methods are accepted for XCVU5P-1FLVB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU5P-1FLVB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU5P-1FLVB2104E?
XCVU5P-1FLVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU5P-1FLVB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU5P-1FLVB2104E?
For technical support, including XCVU5P-1FLVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU5P-1FLVB2104E requirements.
6.How does Aetrix verify that XCVU5P-1FLVB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU5P-1FLVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU5P-1FLVB2104E meets industry standards.
7.What is the process for return or replacement of XCVU5P-1FLVB2104E?
All XCVU5P-1FLVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU5P-1FLVB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU5P-1FLVB2104E part is unused and in its original packaging.
Return procedure for XCVU5P-1FLVB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU5P-1FLVB2104E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
