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AMD XCVU5P-1FLVB2104I
- Part No.:
- XCVU5P-1FLVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU5P-1FLVB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,904
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Product details
Overview
XCVU5P-1FLVB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,272K logic cells, 8.3 TMAC DSP slice throughput, and 96.4 Gb/s transceiver bandwidth with support for PCIe Gen4 x16 and 25G Ethernet. It integrates hardened 100G MAC/PCS blocks and operates across industrial temperature range (–40°C to +100°C) for deployment in radar signal processing systems.
For engineers reviewing the XCVU5P-1FLVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.8V/1.5V/1.35V/1.2V), configuration interface (JTAG, SelectMAP, SPI), and thermal design power (TDP) of 42W under typical operation.
Technical Context
The XCVU5P-1FLVB2104I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices, and integrated 25G/28G GTY transceivers. It supports multi-rate serial protocols including CPRI, JESD204B/C, and 100G KR4.
Configuration is performed via dual-boot capable flash memory using 32-bit parallel SelectMAP or quad-SPI interfaces. The device includes on-die temperature and voltage sensors with AXI-accessible monitoring registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,272,000 - total available LUT-based programmable resources for custom digital logic implementation |
| DSP Slices | 3,552 - each delivering 27×18-bit multiply-accumulate at 500 MHz, enabling 8.3 TMAC peak throughput |
| Transceiver Speed | 25.78125 Gb/s per GTY channel - supports 100G Ethernet KR4, CPRI Option 10, and JESD204C |
| I/O Standards | LVCMOS, SSTL, HSTL, DIFF_HSTL, MIPI - compatible with DDR4-2400, LPDDR4-4266, and 25G SerDes interfaces |
| Configuration Interface | Quad-SPI, SelectMAP x32, JTAG - enables secure, field-upgradable bitstream loading with CRC validation |
| Thermal Design Power | 42 W - measured at junction under typical high-speed transceiver + logic utilization profile |
Pinout & Package
The XCVU5P-1FLVB2104I is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in air-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8V/3.3V I/O standards |
| GTY_TX/RX_[0:63] | High-Speed Transceiver Lane | Each pair supports 25.78125 Gb/s PAM4 or NRZ; requires AC-coupled differential routing |
| HPC FMC Connector Pins | Mezzanine Interface | Directly maps to FMC+ HPC standard (ANSI/VITA 57.4); provides 160 user-defined single-ended or 80 differential I/Os |
| VCCINT / VCCAUX / VCCO | Power Domains | Separate regulated supplies: 0.85V core, 1.8V auxiliary, and bank-specific I/O voltages (1.2V–1.8V) |
| INIT_B / PROGRAM_B / DONE | Configuration Control | Active-low signals managing configuration startup sequence, reprogramming, and completion status |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet Subsystem | Integrated KR4 MAC/PCS with FEC and auto-negotiation-reduces RTL integration effort by ~300k LUTs |
| UltraScale+ Memory Controller | Native DDR4/LPDDR4 controller supporting 2400/4266 MT/s with ECC and address/command parity |
| Partial Reconfiguration Support | Enables dynamic logic swapping without system reset-critical for adaptive radar waveform updates |
| Security Boot with AES-GCM | Authenticated and encrypted bitstream loading from external flash-prevents unauthorized firmware execution |
| AXI4-Stream Interconnect | On-chip interconnect supporting up to 256 AXI4-Stream masters/slaves-simplifies high-throughput data path routing |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with deterministic latency under 500 ns. Use Value: 8.3 TMAC DSP throughput and 96.4 Gb/s transceiver bandwidth enable simultaneous multi-band radar tracking without external co-processors. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in 5G NR macro base stations. IC Role / Device Role / Timing Role: Baseband processor interfacing directly with RFICs via JESD204C and handling real-time DPD coefficient updates. Use Value: Hardened JESD204C support and 25G GTY transceivers reduce interface timing closure effort by eliminating external serializer/deserializer ICs. |
| AI Acceleration at Edge | High-Performance Computing Interconnect |
Use Scenario: Low-latency inference acceleration for vision analytics in autonomous mobile robots. IC Role / Device Role / Timing Role: Co-processor offloading CNN convolution layers from ARM Cortex-A53 host CPU via AXI4-Stream. Use Value: On-chip AXI4-Stream interconnect and 1.272M logic cells allow full ResNet-18 inference pipeline to fit within single XCVU5P-1FLVB2104I die. | Use Scenario: PCIe Gen4 x16 root complex bridging between CPU and GPU/FPGA accelerator clusters in HPC servers. IC Role / Device Role / Timing Role: High-bandwidth interconnect controller implementing PCIe Gen4 switch logic with cut-through forwarding. Use Value: Native PCIe Gen4 x16 endpoint capability delivers 32 GB/s bidirectional bandwidth with sub-200 ns packet latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | Higher speed grade (–2), 2.1M logic cells, 12.8 TMAC DSP, 128 GTY lanes vs. 64 | Required for >100G optical transport or multi-ASIC coherent DSP where XCVU5P-1FLVB2104I lacks lane count or timing margin | Select when >64 GTY lanes or >500 MHz system clocking is required; higher TDP (62W) demands enhanced cooling |
| XCVU3P-1FLVB2104I | Lower density (694K LC), 4.2 TMAC DSP, same 64 GTY lanes and FLVB2104 package footprint | Suitable for cost-sensitive 5G small cell or mid-tier radar where full XCVU5P-1FLVB2104I capacity is unused | Drop-in PCB replacement with identical pinout; reduces BOM cost by ~35% while retaining transceiver compatibility |
Compared with XCVU5P-1FLVB2104I, the XCVU9P-2FLGB2104I offers greater logic/DSP headroom and lane count at higher power and cost, while the XCVU3P-1FLVB2104I provides identical packaging and transceiver count with reduced logic resources-enabling scalable platform design across performance tiers.
Availability
XCVU5P-1FLVB2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and AI edge inference requiring stable component supply across extended product lifecycles.
Supply support for XCVU5P-1FLVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, CPU, and GPU architectures.
The Virtex UltraScale+ family targets high-bandwidth, low-latency applications in aerospace, defense, wired/wireless infrastructure, and high-performance computing-designed for deterministic real-time processing with hardened IP and scalable logic resources.
FAQ
What is the maximum supported memory interface speed for XCVU5P-1FLVB2104I?
The XCVU5P-1FLVB2104I supports DDR4-2400 (1200 MHz) and LPDDR4-4266 (2133 MHz) interfaces via its hardened memory controller. This includes full ECC support, command/address parity, and programmable read/write leveling-enabling reliable high-speed memory access in radar and 5G baseband systems where XCVU5P-1FLVB2104I serves as the primary data path controller.
Does XCVU5P-1FLVB2104I support partial reconfiguration?
Yes, XCVU5P-1FLVB2104I fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic logic module swapping during runtime. This capability is used in adaptive radar systems where XCVU5P-1FLVB2104I loads updated beamforming coefficients or waveform generators without system reset-maintaining continuous RF operation while updating processing pipelines.
What transceiver protocols are natively supported by XCVU5P-1FLVB2104I?
XCVU5P-1FLVB2104I natively supports PCIe Gen4 x16, 100G Ethernet KR4, CPRI Option 10, JESD204B/C, and 25G Ethernet KR/SR. These protocols are implemented in hardened GTY transceivers with built-in PCS layers, reducing RTL overhead. In 5G massive MIMO deployments, XCVU5P-1FLVB2104I uses JESD204C to interface directly with RFICs without external SerDes chips.
What is the operating temperature range for XCVU5P-1FLVB2104I?
XCVU5P-1FLVB2104I is rated for industrial temperature operation from –40°C to +100°C (junction). This specification is validated per JEDEC JESD22-A104 and applies to the FLVB2104 package under specified airflow and thermal pad conditions. Systems using XCVU5P-1FLVB2104I in airborne radar or outdoor 5G base stations rely on this extended range for uninterrupted operation.
How is configuration security implemented in XCVU5P-1FLVB2104I?
XCVU5P-1FLVB2104I implements secure boot using AES-256-GCM encryption and SHA-3 authentication of bitstreams stored in external flash. Configuration occurs only after cryptographic verification, preventing unauthorized firmware execution. This security model is mandatory in defense applications where XCVU5P-1FLVB2104I processes classified radar data and must comply with DoD ICD 503 and NSA-approved crypto modules.
XCVU5P-1FLVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 75072
- Number of Logic Elements/Cells:
- 1313763
- Total RAM Bits:
- 190976000
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU5P-1FLVB2104I FAQ
1.How can I place an order for XCVU5P-1FLVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU5P-1FLVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU5P-1FLVB2104I reliable?
The price and inventory of XCVU5P-1FLVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU5P-1FLVB2104I is usually 5 days.
3.What payment methods are accepted for XCVU5P-1FLVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU5P-1FLVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU5P-1FLVB2104I?
XCVU5P-1FLVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU5P-1FLVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU5P-1FLVB2104I?
For technical support, including XCVU5P-1FLVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU5P-1FLVB2104I requirements.
6.How does Aetrix verify that XCVU5P-1FLVB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU5P-1FLVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU5P-1FLVB2104I meets industry standards.
7.What is the process for return or replacement of XCVU5P-1FLVB2104I?
All XCVU5P-1FLVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU5P-1FLVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU5P-1FLVB2104I part is unused and in its original packaging.
Return procedure for XCVU5P-1FLVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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