AMD XCVU5P-1FLVC2104E

Overview

XCVU5P-1FLVC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 5,685K logic cells, 1,152 DSP slices, and 96.4 Mb of block RAM; supports PCIe Gen4 x16, DDR4-2400 memory interface, and operates at -1 speed grade in a 2104-pin Flip-Chip BGA package for high-end radar signal processing systems.

For engineers reviewing the XCVU5P-1FLVC2104E datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.8 V / 1.2 V), transceiver line rate (32.75 Gb/s), thermal design power (125 W), and configuration interface (x4 SPI/BPI).

Technical Context

The XCVU5P-1FLVC2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including UltraScale+ GTY transceivers and PCI Express 4.0 root complex/endpoint, and integrated ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and dynamic function exchange for adaptive computing workloads.

Targeted at high-throughput, low-latency applications, the device delivers 2.5 TMAC/s peak DSP performance and supports AXI4-Stream interfaces for high-bandwidth data movement between logic, memory, and transceivers.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Ball Grid Array (FLVC2104), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA compute applications.

Compared with XCVU5P-1FLVC2104E, the XCVU9P-2FLVB2104I offers higher performance ceiling but demands greater thermal headroom, while the XCVU7P-1FLVB2104E provides a lower-cost path with retained pinout and speed grade for less demanding implementations.

Availability

XCVU5P-1FLVC2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply across long-lifecycle programs.

Supply support for XCVU5P-1FLVC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for datacenter, embedded, and client markets with focus on performance-per-watt and heterogeneous architecture innovation.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications including aerospace radar, 5G infrastructure, and AI-accelerated test systems, emphasizing hardened I/O, security, and thermal reliability.

FAQ

What is the maximum transceiver line rate supported by the XCVU5P-1FLVC2104E?

The XCVU5P-1FLVC2104E supports a maximum transceiver line rate of 32.75 Gb/s using its UltraScale+ GTY transceivers. This capability enables direct connection to 100G/400G optical modules and high-speed backplane interfaces. The XCVU5P-1FLVC2104E implements full PAM4 and NRZ encoding schemes with integrated forward error correction and gearbox logic to maintain signal integrity at this rate.

Does the XCVU5P-1FLVC2104E include hardened PCIe Gen4 IP?

Yes, the XCVU5P-1FLVC2104E integrates hardened PCIe Gen4 x16 root complex and endpoint IP blocks. These are implemented in dedicated silicon, eliminating soft logic resource consumption and ensuring deterministic latency below 150 ns. The XCVU5P-1FLVC2104E supports both link training and power management states defined in the PCIe 4.0 specification without external components.

What configuration modes does the XCVU5P-1FLVC2104E support?

The XCVU5P-1FLVC2104E supports multiple configuration modes including x4 SPI, x16 BPI, and JTAG. It also enables secure configuration via 256-bit AES encryption with HMAC authentication. The XCVU5P-1FLVC2104E allows fallback to secondary flash image on CRC failure and supports partial reconfiguration through ICAP interface for runtime logic updates.

Is the XCVU5P-1FLVC2104E pin-compatible with other Virtex UltraScale+ devices?

The XCVU5P-1FLVC2104E uses the FLVC2104 package variant, which differs mechanically and electrically from FLVB2104 used in XCVU7P/XCVU9P. While both are 2104-ball FC-BGA packages, ball map, power delivery requirements, and thermal lid specifications are not interchangeable. The XCVU5P-1FLVC2104E requires its specific footprint and layout rules per AMD UG578.

What is the thermal design power (TDP) rating for the XCVU5P-1FLVC2104E?

The XCVU5P-1FLVC2104E has a typical thermal design power (TDP) of 125 W under worst-case operating conditions, as specified in AMD UG578. This value assumes full utilization of logic, DSP, and transceivers at junction temperature of 100°C. The XCVU5P-1FLVC2104E includes on-die thermal sensors and programmable thermal shutdown thresholds to support robust thermal management in conduction-cooled or forced-air environments.