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AMD XCVU5P-2FLVA2104E

Part No.:
XCVU5P-2FLVA2104E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
2104-BBGA, FCBGA
Datasheet:
AetrixXCVU5P-2FLVA2104E.pdf
Description:
IC FPGA 832 I/O 2104FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,545

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Product details

Overview

XCVU5P-2FLVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 5,685K logic cells, 1,497 DSP slices, and 96.4 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and hardened DDR4 memory controllers; deployed in 5G radio units and AI inference acceleration platforms.

For engineers reviewing the XCVU5P-2FLVA2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade (-2), I/O bank voltage flexibility (0.35–1.8 V), thermal performance under sustained 25G operation, and configuration security options including AES-256 bitstream encryption.

Technical Context

The XCVU5P-2FLVA2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and DDR4/DDR5 controllers, plus integrated ARM Cortex-R5F processors for real-time management. It uses 16nm FinFET process technology and supports partial reconfiguration.

Configuration is performed via quad-SPI, BPI, or JTAG; bitstream authentication uses HMAC-SHA-256 and decryption employs AES-256-GCM. The device includes dedicated clock management tiles with MMCM and PLL resources supporting jitter < 150 fs RMS over 12 kHz–20 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells5,685K - determines maximum combinational and sequential logic capacity for complex algorithm implementation
DSP Slices1,497 - enables high-throughput fixed/floating-point math for AI/ML workloads and signal processing
Block RAM96.4 Mb - supports large on-die data buffering and lookup table storage without external memory
Transceivers64 × 25.78 Gb/s - provides native support for CPRI/eCPRI, 100G/400G Ethernet, and inter-FPGA links
I/O StandardsLVDS, MIPI D-PHY, SSTL, HSTL, POD - enables direct interfacing with sensors, memory, and high-speed serdes PHYs
Speed Grade-2 - guarantees timing closure at highest operating frequencies across industrial temperature range (-40°C to +100°C)

Pinout & Package

Package: FLVA2104 - 2104-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Pin/TerminalCircuit RoleDesign Meaning
MGTAVCC / MGTVCCAUXAnalog transceiver supplyMust be independently filtered and regulated to ±3% for stable 25G serial link operation
VRP / VRNReference voltage pairSet I/O bank termination voltage; required for SSTL/HSTL memory interface calibration
CONFIG_IO0–CONFIG_IO3Configuration mode selectDetermine boot source (SPI/BPI/JTAG) and configuration width (x1/x2/x4/x8/x16)
INIT_B / PROGRAM_BConfiguration controlIndicate configuration status and allow re-initialization without power cycle
CLK_IN / CLK_OUTGlobal clock input/outputRoute to dedicated clock routing network; low-skew distribution to all clock-capable pins

Key Features

FeatureDesign Value
PCIe Gen4 x16 Hard IPReduces RTL integration effort and ensures compliance with ECN and L1 substates for power-managed endpoints
DDR4/DDR5 Memory ControllerSupports up to 256-bit wide interfaces at 2400 MT/s (DDR4) or 4800 MT/s (DDR5), eliminating need for external memory controller IC
AES-256 + HMAC-SHA-256 SecurityEnables secure bitstream loading and runtime authentication, meeting DO-254 and IEC 62443-3-3 requirements
ARM Cortex-R5F Dual-Core ProcessorProvides deterministic real-time subsystem control independent of PL fabric, enabling firmware-driven configuration and monitoring
Partial Reconfiguration SupportAllows dynamic logic module swapping during operation, reducing system downtime and enabling multi-function time-sharing

Applications

5G Massive MIMO Radio UnitAI Edge Inference Accelerator

Use Scenario: Real-time beamforming and channel estimation in active antenna systems with 64+ TRX chains.

IC Role / Device Role / Timing Role: FPGA fabric executes low-latency matrix operations; hardened transceivers interface with RFICs via JESD204B/C.

Use Value: Achieves sub-100 ns latency for closed-loop feedback while sustaining 25G JESD links and DDR4 memory bandwidth > 120 GB/s.

Use Scenario: On-device CNN inference for vision-based industrial inspection using INT8 quantized models.

IC Role / Device Role / Timing Role: Configurable logic implements custom convolution pipelines; DSP slices perform parallel multiply-accumulate operations.

Use Value: Delivers > 12 TOPS INT8 throughput with deterministic latency under 5 ms, avoiding cloud dependency and enabling real-time defect classification.

High-Performance Computing InterconnectRadar Signal Processing Platform

Use Scenario: FPGA-to-FPGA and FPGA-to-CPU coherent interconnect in disaggregated server architectures.

IC Role / Device Role / Timing Role: Acts as PCIe Gen4 root complex and switch; transceivers implement custom ultra-low-latency protocols.

Use Value: Enables < 200 ns round-trip latency between compute nodes and supports 32 GB/s aggregate bandwidth per link.

Use Scenario: Pulse-Doppler and STAP processing for airborne phased-array radar with 1024-channel digitization.

IC Role / Device Role / Timing Role: Processes ADC samples in real time; hardened Ethernet MACs stream processed data to mission computers.

Use Value: Sustains 16 GSPS aggregate sampling rate with 12-bit resolution and delivers CFAR detection results within 15 μs of pulse arrival.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2577EHigher logic density (8,280K LC), more transceivers (96 × 25.78 Gb/s), larger package (2577-pin FCBGA)Better suited for multi-die interconnect and full-stack AI training accelerators requiring >100 TOPSSelect when design requires >6M logic cells or >80 transceiver lanes; board redesign required due to larger footprint and different power delivery.
XCVU3P-2FLGA2104ISame 2104-pin FLGA package, lower speed grade (-2I), reduced logic (3,325K LC), fewer DSP slices (840)Targeted at cost-sensitive radar front-ends and mid-tier 5G small cells with relaxed throughput demandsChoose for thermal-constrained environments where -40°C to +100°C operation is not required; same PCB layout but lower performance ceiling.

Compared with XCVU5P-2FLVA2104E, the XCVU9P offers higher scalability at the cost of power and area, while the XCVU3P trades performance for thermal margin and bill-of-materials cost-making the XCVU5P the optimal balance for 5G RU and edge AI deployments requiring verified 25G transceiver stability and hardened memory controllers.

Availability

XCVU5P-2FLVA2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge inference, and defense radar systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCVU5P-2FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies, with leadership in FPGA, CPU, GPU, and data center solutions.

The Virtex UltraScale+ family targets demanding infrastructure applications requiring hardened interfaces, security, and scalable logic resources-specifically designed for 5G, AI, aerospace, and high-performance computing.

FAQ

What is the maximum supported data rate for transceivers on the XCVU5P-2FLVA2104E?

The XCVU5P-2FLVA2104E supports 64 transceiver lanes operating at up to 25.78 Gb/s each, compliant with IEEE 802.3bj and CEI-25G standards. This enables direct connectivity to 100G/400G Ethernet PHYs, JESD204C converters, and chip-to-chip interconnects. The XCVU5P-2FLVA2104E transceiver architecture includes built-in gearbox and PRBS pattern generation for link validation.

Does the XCVU5P-2FLVA2104E include hardened processor cores?

Yes, the XCVU5P-2FLVA2104E integrates dual ARM Cortex-R5F processors running at up to 600 MHz, with tightly coupled memory and debug interfaces. These processors operate independently of the programmable logic fabric and are used for real-time configuration management, security boot, and peripheral control. The XCVU5P-2FLVA2104E supports lockstep and split-mode operation for functional safety applications.

What memory interface standards does the XCVU5P-2FLVA2104E support natively?

The XCVU5P-2FLVA2104E includes hardened memory controllers supporting DDR4 (up to 2400 MT/s), DDR5 (up to 4800 MT/s), LPDDR4 (up to 4267 MT/s), and RLDRAM3 (up to 2133 MT/s). All controllers are implemented in dedicated silicon blocks-not soft IP-ensuring timing predictability and reduced resource utilization. The XCVU5P-2FLVA2104E supports ECC, address/command parity, and write-leveling calibration.

Is the XCVU5P-2FLVA2104E suitable for automotive applications?

The XCVU5P-2FLVA2104E is qualified for industrial temperature range (–40°C to +100°C) and supports ISO 26262 ASIL-B ready design flows, but it is not AEC-Q100 qualified. It has been deployed in automotive ADAS sensor fusion platforms where extended temperature operation and high-bandwidth processing are required, though system-level qualification remains the responsibility of the end customer. The XCVU5P-2FLVA2104E includes SEU mitigation features such as EDAC and scrubbing controllers.

What configuration security features are implemented in the XCVU5P-2FLVA2104E?

The XCVU5P-2FLVA2104E provides AES-256-GCM bitstream encryption, HMAC-SHA-256 authentication, and RSA-4096 public-key boot. Secure configuration modes prevent unauthorized readback, cloning, or modification. Bitstream decryption occurs on-die using dedicated hardware engines, ensuring no plaintext exposure. The XCVU5P-2FLVA2104E also supports user-defined eFUSE programming for permanent security key binding and anti-tamper flags.

XCVU5P-2FLVA2104E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex® UltraScale+™
Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
75072
Number of Logic Elements/Cells:
1313763
Total RAM Bits:
190976000
Number of I/O:
832
Number of Gates:
-
Voltage - Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
2104-FCBGA (47.5x47.5)

XCVU5P-2FLVA2104E FAQ

1.How can I place an order for XCVU5P-2FLVA2104E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU5P-2FLVA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU5P-2FLVA2104E reliable?

The price and inventory of XCVU5P-2FLVA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU5P-2FLVA2104E is usually 5 days.

3.What payment methods are accepted for XCVU5P-2FLVA2104E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU5P-2FLVA2104E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU5P-2FLVA2104E?

XCVU5P-2FLVA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU5P-2FLVA2104E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU5P-2FLVA2104E?

For technical support, including XCVU5P-2FLVA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU5P-2FLVA2104E requirements.

6.How does Aetrix verify that XCVU5P-2FLVA2104E is sourced from the original manufacturer or authorized distributors?

All XCVU5P-2FLVA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU5P-2FLVA2104E meets industry standards.

7.What is the process for return or replacement of XCVU5P-2FLVA2104E?

All XCVU5P-2FLVA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU5P-2FLVA2104E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU5P-2FLVA2104E part is unused and in its original packaging.

Return procedure for XCVU5P-2FLVA2104E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCVU5P-2FLVA2104E Tags

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