AMD XCVU5P-2FLVA2104I

Overview

XCVU5P-2FLVA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,249,200 logic cells, 7,220 DSP slices, and 88.2 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems requiring deterministic low-latency data path handling.

For engineers reviewing the XCVU5P-2FLVA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (25.78125 Gbps), I/O bank voltage support (0.35–1.8 V), thermal design power (TDP) at 75 W, and package-specific I/O count (1,092 user I/Os).

Technical Context

The XCVU5P-2FLVA2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MAC, and memory controllers, and integrated 25G multi-rate transceivers compliant with IEEE 802.3by and CEI-25G-LR standards. Its UltraScale+ architecture enables time-critical deterministic routing via dedicated clock networks and low-skew interconnect.

It supports partial reconfiguration, AXI4-Stream and AXI4-Lite interfaces, and dual-boot configuration via Quad-SPI or BPI. Configuration security includes AES-256 bitstream encryption and HMAC authentication, meeting DO-254 and IEC 62443-3-3 requirements for safety-critical deployments.

Key Specifications

Pinout & Package

The XCVU5P-2FLVA2104I is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid. I/O banks are organized into 12 groups supporting mixed-voltage operation (0.35 V to 1.8 V) with dedicated VCCO, VREF, and VRP pins per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU9P-2FLGA2104I and XCVU3P-2FLGA2104I, the XCVU5P-2FLVA2104I delivers optimal balance of 25G transceiver count, DSP throughput, and thermal envelope for mid-tier phased-array radar and 5G baseband applications-avoiding overdesign while ensuring deterministic latency.

Availability

XCVU5P-2FLVA2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and high-energy physics data acquisition requiring stable component supply across extended production lifecycles.

Supply support for XCVU5P-2FLVA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications with focus on performance-per-watt efficiency.

The Virtex UltraScale+ family targets high-bandwidth, low-latency signal processing in mission-critical infrastructure-designed for deterministic timing, hardware security, and long-lifecycle reliability in radar, communications, and scientific instrumentation.

FAQ

What is the maximum supported transceiver line rate for XCVU5P-2FLVA2104I?

The XCVU5P-2FLVA2104I supports a maximum transceiver line rate of 25.78125 Gbps per lane, compliant with IEEE 802.3by and CEI-25G-LR standards. This enables direct interfacing with 25G Ethernet PHYs, JESD204B v1.1 ADCs/DACs, and CPRI/eCPRI fronthaul links. The XCVU5P-2FLVA2104I implements 32 such transceiver lanes in its FLVA2104 package variant.

Does XCVU5P-2FLVA2104I support PCIe Gen4 x16 root complex functionality?

Yes, the XCVU5P-2FLVA2104I integrates hardened PCIe Gen4 root complex and endpoint IP blocks capable of full x16 lane width operation at 16 GT/s. It supports Address Translation Services (ATS), Page Request Interface (PRI), and Access Control Services (ACS), enabling direct GPU or accelerator coherency in data center acceleration platforms. The XCVU5P-2FLVA2104I does not require soft logic implementation for PCIe protocol stack compliance.

What I/O standards are supported by the HP I/O banks on XCVU5P-2FLVA2104I?

The HP (High-Performance) I/O banks on the XCVU5P-2FLVA2104I support DDR4 SDRAM interfaces at 2400 Mbps using SSTL12 I/O standard, as well as POD12, POD12_DCI, and HSTL_I_12. These banks provide calibrated output drive strength and on-die termination for impedance-controlled signaling critical in memory subsystems. The XCVU5P-2FLVA2104I's HP banks are electrically validated for JEDEC-compliant DDR4 UDIMM and RDIMM interfaces.

Is partial reconfiguration supported on XCVU5P-2FLVA2104I, and what tools enable it?

Yes, partial reconfiguration is fully supported on the XCVU5P-2FLVA2104I using Vivado Design Suite 2023.1 or later. It enables dynamic module swapping-such as updating radar waveform generators or DPD coefficients-without resetting the entire device. The XCVU5P-2FLVA2104I's configuration logic includes dedicated ICAP and PCAP interfaces for secure, low-latency bitstream loading during operation.

What thermal management guidance applies to XCVU5P-2FLVA2104I in continuous operation?

The XCVU5P-2FLVA2104I has a specified thermal design power (TDP) of 75 W under typical operating conditions. AMD recommends a 4-layer PCB with internal copper planes, thermal vias under the package's thermal lid, and forced-air cooling delivering ≥200 LFM airflow. Junction temperature must be maintained below 100°C; the XCVU5P-2FLVA2104I includes on-die thermal sensors accessible via I2C for closed-loop fan control.