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AMD XCVU5P-2FLVB2104E
- Part No.:
- XCVU5P-2FLVB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU5P-2FLVB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,893
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Product details
Overview
XCVU5P-2FLVB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,272K logic cells, 8,520 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data center acceleration and 5G wireless infrastructure.
For engineers reviewing the XCVU5P-2FLVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (64), I/O standard support (LVDS, HSTL, MIPI), thermal design power (TDP = 55 W), and package footprint compatibility with FLVB2104.
Technical Context
The XCVU5P-2FLVB2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers, and integrated RFSoC analog-to-digital converters in select variants - though this specific part excludes RF-ADC blocks. It supports DDR4 memory interfaces up to 2400 MT/s and includes hardened 100G Ethernet MAC cores.
Configuration is performed via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C) and supports partial reconfiguration for dynamic function swapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,272,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 8,520 - enables high-throughput fixed/floating-point computation for AI inference or signal processing |
| Block RAM | 72.5 Mb - provides on-chip memory for buffering, FIFOs, or lookup tables without external DRAM |
| Transceivers | 64 lanes @ 25.8 Gb/s - supports 100G Ethernet, CPRI, or PCIe Gen4 x16 interconnects |
| I/O Standards | LVDS, HSTL, MIPI D-PHY - enables direct interfacing with sensors, memory, and high-speed serial peripherals |
| TDP | 55 W - defines thermal envelope requiring active cooling and PCB copper pour planning |
Pinout & Package
The XCVU5P-2FLVB2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, designed for high-density routing and thermal dissipation in server-class PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0V ±3% input powering logic fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply rail | 1.8V ±3% powering configuration logic, transceivers, and I/O banks |
| MGTAVCC | Transceiver analog supply | 1.0V ±3% dedicated rail for PLLs and SerDes analog circuitry |
| CONFIG_IO | Configuration I/O bank | Supports dual-role pins for JTAG or SPI boot; must be pulled per mode selection |
| HR_IO | High-range I/O bank | Supports 1.8V/2.5V/3.3V standards with programmable slew rate and drive strength |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 hard IP | Reduces RTL integration effort and guarantees timing closure for host interface subsystems |
| DDR4 memory controller | Enables 2400 MT/s operation with ECC support, eliminating need for external memory controller IC |
| AES-256 bitstream encryption | Protects intellectual property against reverse engineering and unauthorized cloning |
| Partial reconfiguration | Allows runtime logic updates without system reset, enabling adaptive compute workloads |
| Industrial temp grade | Validated operation from –40°C to +100°C ambient, suitable for uncontrolled environments |
Applications
| 5G Massive MIMO Baseband Processing | Data Center SmartNIC Offload |
|---|---|
Use Scenario: Real-time beamforming and channel estimation in 64T64R 5G base stations. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling layer-1 PHY functions with deterministic latency. Use Value: 64 × 25.8 Gb/s transceivers enable full radio unit connectivity; 8,520 DSP slices accelerate FFT and matrix operations. | Use Scenario: Accelerating packet classification, TLS termination, and RDMA offload in cloud servers. IC Role / Device Role / Timing Role: Co-processor tightly coupled to CPU via PCIe Gen4 x16, managing network I/O independently. Use Value: Hardened PCIe and DDR4 controllers reduce software stack overhead; 72.5 Mb block RAM buffers bursty traffic flows. |
| AI Inference Acceleration | Test & Measurement High-Speed Digitizer |
Use Scenario: Low-latency inferencing for vision analytics at edge data aggregation points. IC Role / Device Role / Timing Role: Configurable accelerator executing quantized CNN layers with parallelized MAC units. Use Value: 1.27M logic cells implement custom pipeline stages; DSP slices deliver >10 TOPS INT8 throughput. | Use Scenario: Multi-channel 1 GS/s digitization with real-time spectral analysis in portable analyzers. IC Role / Device Role / Timing Role: Time-critical acquisition engine synchronizing ADC sampling, buffering, and FFT computation. Use Value: Deterministic I/O timing and 2400 MT/s DDR4 interface sustain sustained 8 GB/s memory bandwidth for streaming capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | Higher logic density (2,586K cells), 12,288 DSP slices, 115.2 Mb BRAM; higher TDP (85 W) | Required for larger algorithm implementations or multi-function consolidation | Select when XCVU5P-2FLVB2104E resources are insufficient and thermal budget allows |
| XCVU3P-2FLGB2104E | Lower logic count (636K cells), 4,260 DSP slices, 36.2 Mb BRAM; TDP = 35 W | Suitable for cost-optimized or thermally constrained deployments with reduced compute load | Choose when application fits within halved resource budget and lower power envelope is critical |
Compared with XCVU5P-2FLVB2104E, the XCVU9P variant delivers near-double logic and memory capacity at increased thermal cost, while the XCVU3P offers a scaled-down alternative with 50% fewer resources and 36% lower TDP - enabling tiered system design across performance bands.
Availability
XCVU5P-2FLVB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI acceleration, and high-performance test equipment requiring stable component supply and long-term program support.
Supply support for XCVU5P-2FLVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client platforms.
The Virtex UltraScale+ family targets high-throughput, low-latency applications demanding hardened interfaces, massive on-chip memory, and scalable logic resources - especially where ASIC-level performance meets FPGA flexibility.
FAQ
What is the maximum supported DDR4 data rate for XCVU5P-2FLVB2104E?
The XCVU5P-2FLVB2104E supports DDR4 memory interfaces operating at up to 2400 MT/s with built-in controller hard IP. This includes support for ECC, address/command bus training, and write-leveling calibration. The XCVU5P-2FLVB2104E's memory controller is validated for JEDEC-compliant DIMMs and discrete components meeting DDR4-2400 timing specifications.
Does XCVU5P-2FLVB2104E include integrated RF-ADC or RF-DAC blocks?
No, the XCVU5P-2FLVB2104E does not include RF analog-to-digital or digital-to-analog converters. It belongs to the non-RF Virtex UltraScale+ FPGA portfolio. RF-capable variants (e.g., XCVU13P) are explicitly designated with "RF" in their product family naming and datasheet scope - the XCVU5P-2FLVB2104E datasheet confirms absence of RF-ADC/DAC blocks.
What configuration modes are supported by XCVU5P-2FLVB2104E?
The XCVU5P-2FLVB2104E supports multiple configuration modes including master/slave SPI (quad or single), JTAG boundary-scan, and BPI parallel flash. Configuration can be initiated via dedicated CONFIG_IO bank pins, with mode selection determined by hardware strapping. The XCVU5P-2FLVB2104E also supports fallback and multi-boot from external flash devices.
Is XCVU5P-2FLVB2104E qualified for automotive applications?
No, the XCVU5P-2FLVB2104E is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, or ASIL-level functional safety certification. For automotive use cases, AMD offers separate Zynq UltraScale+ MPSoC derivatives - the XCVU5P-2FLVB2104E is intended for data center, communications, and industrial test equipment.
What security features are implemented in XCVU5P-2FLVB2104E?
The XCVU5P-2FLVB2104E includes AES-256 bitstream encryption with HMAC authentication, secure key storage in eFUSE, and tamper-resistant configuration verification. These features protect against unauthorized access, cloning, and malicious bitstream injection. The XCVU5P-2FLVB2104E's security architecture is documented in AMD UG578 and supports secure boot workflows compliant with NIST SP 800-193 guidelines.
XCVU5P-2FLVB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 75072
- Number of Logic Elements/Cells:
- 1313763
- Total RAM Bits:
- 190976000
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU5P-2FLVB2104E FAQ
1.How can I place an order for XCVU5P-2FLVB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU5P-2FLVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU5P-2FLVB2104E reliable?
The price and inventory of XCVU5P-2FLVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU5P-2FLVB2104E is usually 5 days.
3.What payment methods are accepted for XCVU5P-2FLVB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU5P-2FLVB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU5P-2FLVB2104E?
XCVU5P-2FLVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU5P-2FLVB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU5P-2FLVB2104E?
For technical support, including XCVU5P-2FLVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU5P-2FLVB2104E requirements.
6.How does Aetrix verify that XCVU5P-2FLVB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU5P-2FLVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU5P-2FLVB2104E meets industry standards.
7.What is the process for return or replacement of XCVU5P-2FLVB2104E?
All XCVU5P-2FLVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU5P-2FLVB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU5P-2FLVB2104E part is unused and in its original packaging.
Return procedure for XCVU5P-2FLVB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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