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AMD XCVU5P-2FLVB2104I
- Part No.:
- XCVU5P-2FLVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU5P-2FLVB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,068
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Product details
Overview
XCVU5P-2FLVB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 5,685K logic cells, 1,152 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal conditioning.
For engineers reviewing the XCVU5P-2FLVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-2), I/O bank voltage flexibility (1.2 V to 1.8 V), and thermal design power (TDP) of 47 W under typical operation.
Technical Context
The XCVU5P-2FLVB2104I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated RFSoC analog-to-digital converters in select variants - though this specific FLVB2104I package variant does not include RF-ADC blocks. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path control.
Configuration is performed via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C case temperature) and requires multi-rail power sequencing (VCCINT, VCCAUX, VCCO, VRP).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 5,685K - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 1,152 - enables parallel fixed/floating-point computation for beamforming or neural network inference |
| Block RAM | 96.4 Mb - supports large on-chip buffering for video frame storage or packet queuing |
| GTY Transceivers | 48 lanes @ 25.8 Gb/s - provides high-bandwidth serial connectivity for optical interconnect or backplane links |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - allows direct interface to image sensors, memory, and high-speed serdes PHYs |
| Speed Grade | -2 - guarantees timing closure at highest operating frequencies for critical paths |
| TDP | 47 W (typical) - defines thermal management requirements for heatsink and airflow design |
Pinout & Package
This device is packaged in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via solder balls and thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to programmable logic and CLB fabric; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, clocking, and transceiver analog circuitry |
| VCCO_0 | I/O bank power | Configurable 1.2–1.8 V per bank to match external interface voltage levels |
| MGTAVCC | GTY analog supply | 1.0 V analog rail for GTY transceiver PLLs and serializers/deserializers |
| INIT_B | Configuration status | Open-drain output indicating bitstream loading progress and CRC pass/fail |
| PROGRAM_B | Configuration trigger | Active-low input that initiates FPGA reconfiguration and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Root Port | Hard IP block enabling direct host CPU coherency without external switch or bridge logic |
| UltraScale+ Memory Controller | Native DDR4/LPDDR4 support up to 2400 MT/s with ECC and address/command parity |
| Partial Reconfiguration | Allows dynamic logic module swapping during runtime for multi-mode system operation |
| AES-256 Bitstream Encryption | Protects intellectual property against physical readout or cloning attacks |
| AXI4-Stream Interface | Enables zero-overhead streaming between IP blocks for pipelined signal processing |
Applications
| Radar Signal Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes matched filtering, CFAR detection, and beam steering algorithms with deterministic latency. Use Value: 48 GTY transceivers enable direct connection to ADC/DAC arrays sampling at 4 GSPS, reducing interface complexity and jitter. | Use Scenario: Low-latency inference engine for vision-based autonomous vehicle perception pipelines. IC Role / Device Role / Timing Role: Configurable logic implements custom CNN layers with fused batch normalization and quantization-aware activation. Use Value: 1,152 DSP slices deliver >12 TOPS INT8 throughput while maintaining sub-100 µs inference latency. |
| 5G Massive MIMO Baseband | High-Speed Test Equipment |
Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR macrocell base stations. IC Role / Device Role / Timing Role: Real-time adaptive filter execution using LMS/NLMS algorithms synchronized to OFDM symbol boundaries. Use Value: 96.4 Mb block RAM stores coefficient history and channel impulse response buffers for 64-antenna configurations. | Use Scenario: Protocol-aware pattern generation and analysis in 100 GbE and PCIe Gen4 compliance test platforms. IC Role / Device Role / Timing Role: Programmable logic generates precise PRBS sequences and validates eye diagrams with sub-bit-period alignment. Use Value: -2 speed grade ensures setup/hold timing margins for 25.8 Gb/s serial link margin testing at extended temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | Higher logic density (8,550K cells), more GTY lanes (64), higher TDP (62 W) | Better suited for full-stack AI training accelerators requiring larger on-chip memory and wider interconnect | Select when XCVU5P-2FLVB2104I resource utilization exceeds 85% across multiple design iterations |
| XCVU3P-2FLGB2104I | Fewer logic cells (3,325K), reduced GTY count (32 lanes), lower TDP (34 W) | Targeted at cost-sensitive 5G small cell or edge AI inference where bandwidth and compute scale are constrained | Choose when application fits within reduced resources and thermal envelope without sacrificing critical I/O or transceiver performance |
Compared with XCVU5P-2FLVB2104I, the XCVU9P offers headroom for future feature expansion but demands greater cooling and board area; the XCVU3P reduces BOM and thermal cost but constrains real-time processing depth and interface scalability.
Availability
XCVU5P-2FLVB2104I is available at Aetrix Electronics and suitable for radar signal processing, AI inference acceleration, and 5G massive MIMO baseband applications requiring stable component supply across long production lifecycles.
Supply support for XCVU5P-2FLVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, GPU, and CPU design.
The Virtex UltraScale+ family targets high-throughput, low-latency infrastructure applications including wired/wireless communications, aerospace, and defense systems requiring deterministic real-time processing.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU5P-2FLVB2104I?
The XCVU5P-2FLVB2104I supports GTY transceivers rated up to 25.8 Gb/s per lane. This rate is guaranteed under industrial temperature conditions and with proper reference clock jitter compliance (≤ 500 fs RMS). The XCVU5P-2FLVB2104I implements 48 such lanes, enabling aggregate bandwidth exceeding 1.2 Tb/s for applications like optical transport or high-resolution sensor fusion.
Does the XCVU5P-2FLVB2104I include integrated RF-ADC or RF-DAC blocks?
No, the XCVU5P-2FLVB2104I does not include integrated RF-ADC or RF-DAC blocks. Those features are present only in the RFSoC variants (e.g., Zynq UltraScale+ RFSoC series). The XCVU5P-2FLVB2104I is a pure programmable logic device with hardened transceivers and memory controllers, intended for digital signal processing and protocol acceleration.
What configuration modes are supported by the XCVU5P-2FLVB2104I?
The XCVU5P-2FLVB2104I supports multiple configuration modes including master/slave SPI (quad-capable), JTAG, and BPI. Configuration can be initiated via PROGRAM_B or automatically on power-up using mode pins. The XCVU5P-2FLVB2104I also supports fallback configuration and dual-boot capability using external flash devices.
Is the XCVU5P-2FLVB2104I pin-compatible with other Virtex UltraScale+ devices in the same package?
No, the XCVU5P-2FLVB2104I is not pin-compatible with other Virtex UltraScale+ devices in the FLVB2104 package. While the 2104-ball FCBGA footprint is shared, ball assignments for power, I/O banks, and transceivers differ across speed grades and density variants. PCB layout must be validated specifically for the XCVU5P-2FLVB2104I.
What is the industrial temperature rating for the XCVU5P-2FLVB2104I?
The XCVU5P-2FLVB2104I is rated for industrial temperature operation from –40°C to +100°C case temperature. This rating applies to the I-grade device suffix and is verified per JEDEC JESD22-A104. Thermal design must ensure junction temperature remains within limits using appropriate heatsinking and airflow, especially under sustained 47 W TDP conditions.
XCVU5P-2FLVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 75072
- Number of Logic Elements/Cells:
- 1313763
- Total RAM Bits:
- 190976000
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU5P-2FLVB2104I FAQ
1.How can I place an order for XCVU5P-2FLVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU5P-2FLVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU5P-2FLVB2104I reliable?
The price and inventory of XCVU5P-2FLVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU5P-2FLVB2104I is usually 5 days.
3.What payment methods are accepted for XCVU5P-2FLVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU5P-2FLVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU5P-2FLVB2104I?
XCVU5P-2FLVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU5P-2FLVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU5P-2FLVB2104I?
For technical support, including XCVU5P-2FLVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU5P-2FLVB2104I requirements.
6.How does Aetrix verify that XCVU5P-2FLVB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU5P-2FLVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU5P-2FLVB2104I meets industry standards.
7.What is the process for return or replacement of XCVU5P-2FLVB2104I?
All XCVU5P-2FLVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU5P-2FLVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU5P-2FLVB2104I part is unused and in its original packaging.
Return procedure for XCVU5P-2FLVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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