AMD XCVU5P-2FLVC2104E

Overview

XCVU5P-2FLVC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 5,685K logic cells, 1,472 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, high-speed data acquisition, and 5G wireless infrastructure.

For engineers reviewing the XCVU5P-2FLVC2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic capacity, on-chip memory depth, power delivery requirements, and thermal management for high-clock-rate operation.

Technical Context

The XCVU5P-2FLVC2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate GTY transceivers. It supports dynamic function exchange (DFX) and partial reconfiguration for runtime adaptability.

Targeting high-bandwidth, low-latency systems, the device delivers up to 2.5 TMAC/s AI inference throughput using INT8 arithmetic and supports AXI4-Stream interfaces for seamless integration with external processors and memory subsystems.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Land Grid Array (FLGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCVU5P-2FLVC2104E, the XCVU9P offers headroom for future scalability but increases power and cost, while the XCVU3P reduces BOM and thermal load at the expense of transceiver count and compute density-making each optimal for distinct performance tiers within the same system architecture.

Availability

XCVU5P-2FLVC2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and high-speed test equipment requiring stable component supply across multi-year production cycles.

Supply support for XCVU5P-2FLVC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets.

The Virtex UltraScale+ family targets high-bandwidth, low-latency systems demanding hardened connectivity, massive parallelism, and reconfigurable acceleration for next-generation infrastructure.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU5P-2FLVC2104E?

The XCVU5P-2FLVC2104E supports GTY transceivers operating at up to 25.8 Gb/s per lane. This enables direct interface with QSFP28 and OSFP modules for 100G/200G Ethernet and InfiniBand EDR applications. The transceiver architecture includes built-in PRBS generators, eye diagram monitors, and adaptive equalization for reliable high-speed serial links.

Does the XCVU5P-2FLVC2104E include a hardened PCIe Gen4 controller?

Yes, the XCVU5P-2FLVC2104E integrates a hardened PCIe Gen4 x16 endpoint/root port controller. It complies fully with PCI Express Base Specification Revision 4.0 and supports Advanced Error Reporting (AER), Address Translation Services (ATS), and Process Address Space ID (PASID). This eliminates the need for soft IP and ensures deterministic timing and low latency.

What memory interfaces does the XCVU5P-2FLVC2104E support natively?

The XCVU5P-2FLVC2104E supports DDR4, DDR3, LPDDR4, and RLDRAM3 memory interfaces through its UltraScale+ Memory Interface Generator (MIG). Maximum data rates reach 2,400 MT/s for DDR4 and 4,266 MT/s for LPDDR4. All configurations include optional ECC, write leveling, and read/write calibration for robust operation in industrial environments.

Is partial reconfiguration supported on the XCVU5P-2FLVC2104E?

Yes, the XCVU5P-2FLVC2104E supports Dynamic Function eXchange (DFX) for partial reconfiguration. This allows runtime updates to specific logic regions without resetting the entire device or interrupting active I/O or transceiver links. DFX is enabled via Vivado Design Suite and requires proper partitioning and checkpoint-based bitstream generation.

What thermal management considerations apply to the XCVU5P-2FLVC2104E in continuous operation?

The XCVU5P-2FLVC2104E requires active thermal management under full utilization, with a maximum junction temperature of 100°C. Its 35 mm × 35 mm FLGA package includes an integrated thermal lid. Recommended cooling includes forced-air convection with ≥100 CFM airflow or vapor chamber heatsinks. Thermal interface material (TIM) with ≤0.15 °C·in²/W resistance is required for reliable long-term operation.