AMD XCVU5P-3FLVA2104E

Overview

XCVU5P-3FLVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 5,685K logic cells, 1,472 DSP slices, and 96.4 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces; deployed in high-end radar signal processing systems.

For engineers reviewing the XCVU5P-3FLVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, embedded memory capacity, and thermal performance in air-cooled 2U chassis deployments.

Technical Context

The XCVU5P-3FLVA2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus 25G multi-gigabit transceivers supporting PAM4 and NRZ modulation. It integrates dual ARM Cortex-A53 processors for real-time control and system management.

Configuration is performed via quad-SPI or BPI flash, with support for partial reconfiguration and bitstream encryption using AES-256 and HMAC-SHA-256. The device operates across extended industrial temperature range (–40°C to +100°C junction).

Key Specifications

Pinout & Package

Package: Flip-Chip Ball Grid Array (FCBGA) with 2104 I/O pins, 35mm × 35mm body, 0.8mm pitch, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU5P-3FLVA2104E, the XCVU9P-2FLGA2104I offers greater logic headroom at higher static power, while the XCVU7P-2FLVA2104I delivers identical I/O and transceiver capability at reduced logic density and cost-enabling tiered product family scaling without PCB redesign.

Availability

XCVU5P-3FLVA2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and avionics mission computing requiring stable component supply over 10-year production lifecycles.

Supply support for XCVU5P-3FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications, with deep expertise in FPGA architecture and system-on-chip integration.

The Virtex UltraScale+ family was engineered for high-throughput, low-latency signal and packet processing in defense radar, 5G infrastructure, and safety-certifiable avionics platforms.

FAQ

What is the maximum supported data rate for transceivers on the XCVU5P-3FLVA2104E?

The XCVU5P-3FLVA2104E supports GTY transceivers rated up to 25.78125 Gbps, compliant with IEEE 802.3by for 25GbE KR/KR4 and CPRI Option 10. This rate is achievable across all 64 transceiver quads in the device when operating within specified voltage and temperature limits. The XCVU5P-3FLVA2104E transceiver architecture includes built-in PRBS generators and error detectors for link validation.

Does the XCVU5P-3FLVA2104E include a hard processor system?

Yes, the XCVU5P-3FLVA2104E integrates a dual-core ARM Cortex-A53 processor subsystem running at up to 1.5 GHz, with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, and AXI coherency. This hard processor system is fully independent of the programmable logic fabric and supports Linux, FreeRTOS, and bare-metal execution. The XCVU5P-3FLVA2104E enables tightly coupled software-defined hardware acceleration.

What configuration modes are supported by the XCVU5P-3FLVA2104E?

The XCVU5P-3FLVA2104E supports master SPI, slave serial, slave parallel, and JTAG configuration modes. Quad-SPI flash is the primary boot method, with fallback to BPI or JTAG for debug and field updates. Configuration security features include AES-256 bitstream encryption and HMAC-SHA-256 authentication. The XCVU5P-3FLVA2104E also supports partial reconfiguration via ICAP for dynamic logic updates.

Is the XCVU5P-3FLVA2104E qualified for extended temperature operation?

Yes, the XCVU5P-3FLVA2104E is rated for operation from –40°C to +100°C junction temperature and is qualified per MIL-STD-883 Class B for extended industrial use. It meets thermal dissipation requirements for conduction-cooled 2U chassis without forced airflow. The XCVU5P-3FLVA2104E has been validated in avionics and ground radar environments with sustained ambient temperatures up to 85°C.

What memory interface standards does the XCVU5P-3FLVA2104E support?

The XCVU5P-3FLVA2104E supports DDR4-2400, LPDDR4-4266, and RLDRAM3-2133 memory interfaces through dedicated hardened memory controllers. Each controller provides ECC support, write leveling, and read/write calibration. The XCVU5P-3FLVA2104E can manage up to four independent DDR4 interfaces with 72-bit buses (64 data + 8 ECC bits), delivering up to 76.8 GB/s aggregate bandwidth.