AMD XCVU5P-3FLVC2104E

Overview

XCVU5P-3FLVC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,272K logic cells, 84.2 GMAC/s DSP performance, and 96 GB/s transceiver bandwidth with 25.8 Gb/s GTY transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, targeting 5G infrastructure and high-end test equipment.

For engineers reviewing the XCVU5P-3FLVC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed, available HP/HR I/O banks, on-chip memory resources (URAM/BRAM), and thermal design power under worst-case switching activity.

Technical Context

The XCVU5P-3FLVC2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4 PHY), and multi-rate GTY transceivers supporting protocols including CPRI, JESD204B/C, and OTN. It uses 16nm FinFET process technology and supports partial reconfiguration.

Configuration is performed via quad-SPI or BPI flash, or through JTAG. The device includes integrated system monitoring (temperature, voltage, current) and supports IEEE 1149.1/1532 boundary-scan for production testing.

Key Specifications

Pinout & Package

The XCVU5P-3FLVC2104E is housed in a 2104-pin Flip-Chip Land Grid Array (FC-LGA) package with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation via soldered thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU5P-3FLVC2104E, the XCVU9P-2FLGA2104I offers greater scalability for future-proofing but increases thermal and board-level complexity, while the XCVU7P-2FLVA2104I reduces cost and power at the expense of transceiver count and DSP throughput-making it viable only where those resources are underutilized.

Availability

XCVU5P-3FLVC2104E is available at Aetrix Electronics and suitable for 5G infrastructure, high-speed test equipment, and optical transport network deployments requiring stable component supply across long product lifecycles.

Supply support for XCVU5P-3FLVC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.

The Virtex UltraScale+ family delivers scalable FPGA platforms for infrastructure applications demanding extreme bandwidth, deterministic latency, and hardware adaptability-including 5G, cloud networking, and defense electronics.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU5P-3FLVC2104E?

The XCVU5P-3FLVC2104E supports GTY transceivers operating up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G Ethernet (CAUI-4), CPRI Option 10, and JESD204C. Performance depends on PCB stack-up, connector quality, and reference clock jitter; full 25.8 Gb/s operation requires ≤0.3 ps RMS jitter on the GTY reference clock. The XCVU5P-3FLVC2104E datasheet specifies AC characteristics across all speed grades and temperature ranges.

Does the XCVU5P-3FLVC2104E include a hardened DDR4 memory controller?

Yes, the XCVU5P-3FLVC2104E integrates a hardened DDR4 memory controller supporting two independent 64-bit interfaces at up to 2400 Mbps. It includes on-die termination, dynamic write leveling, read/write leveling, and ECC support. The controller connects via AXI4 interface and is configured through Vivado IP Integrator. The XCVU5P-3FLVC2104E does not require external memory controller IP for standard DDR4 operation.

What configuration modes are supported by the XCVU5P-3FLVC2104E?

The XCVU5P-3FLVC2104E supports master SPI, slave serial, JTAG, and BPI configuration modes. Quad-SPI mode enables fast boot from single or dual parallel flash devices. Configuration bitstream can be compressed and authenticated using AES-256 and HMAC-SHA256. The XCVU5P-3FLVC2104E also supports fallback configuration and multi-boot with golden image recovery.

Is partial reconfiguration supported on the XCVU5P-3FLVC2104E?

Yes, the XCVU5P-3FLVC2104E fully supports partial reconfiguration (PR) using Vivado Design Suite. PR allows dynamic swapping of logic modules in predefined reconfigurable partitions without disrupting operation of the static region. The XCVU5P-3FLVC2104E maintains full PR timing closure, secure bitstream delivery, and hierarchical design flow compatibility.

What is the thermal design power (TDP) of the XCVU5P-3FLVC2104E under typical operating conditions?

The XCVU5P-3FLVC2104E has a typical thermal design power of 49 W at 85°C junction temperature with worst-case switching activity. This value is derived from Xilinx Power Estimator (XPE) v2023.1 using default settings and includes core, I/O, and transceiver contributions. Actual power varies based on design utilization, clock frequencies, and I/O standards. The XCVU5P-3FLVC2104E requires a heatsink and forced airflow for sustained operation above 40 W.