AMD XCVU5P-L2FLVB2104E

Overview

XCVU5P-L2FLVB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 5,685K logic cells, 1,492 DSP slices, and 96.4 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces; deployed in AI acceleration, high-throughput data processing, and radar signal conditioning systems.

For engineers reviewing the XCVU5P-L2FLVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (25.78125 Gbps), I/O bank voltage support (0.35–1.8 V), thermal design power (TDP) at 45 W, and configuration interface (JTAG + Quad-SPI).

Technical Context

The XCVU5P-L2FLVB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, and integrated ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and dynamic function exchange for adaptive compute workloads.

Configuration is performed via Master SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device operates across -40°C to +100°C junction temperature range and meets industrial-grade reliability requirements per AMD specification DS929.

Key Specifications

Pinout & Package

Package: Flip-Chip Ball Grid Array (FCBGA) with 2104-pin footprint, 35 mm × 35 mm body size, 0.8 mm ball pitch, and industrial-grade thermal performance (θ_JA = 5.2°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU9P-L2FLGB2104E and XCVU3P-L2FLGB2104E, the XCVU5P-L2FLVB2104E delivers optimal balance of transceiver count (16×25G), DSP density (1,492 slices), and thermal envelope (45 W) for mid-scale AI and radar systems requiring field-upgradable functionality without board redesign.

Availability

XCVU5P-L2FLVB2104E is available at Aetrix Electronics and suitable for AI inference acceleration, phased-array radar signal conditioning, and 5G fronthaul processing requiring stable component supply across extended product lifecycles.

Supply support for XCVU5P-L2FLVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and aerospace applications.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and thermally constrained systems requiring hardened interfaces, real-time processing, and security-enforced configuration.

FAQ

What is the maximum supported transceiver data rate for XCVU5P-L2FLVB2104E?

The XCVU5P-L2FLVB2104E supports a maximum transceiver line rate of 25.78125 Gbps per lane, validated for 25G Ethernet, CPRI, and eCPRI protocols. This rate is achieved using GTH transceivers with integrated CDR and adaptive equalization. All 16 transceiver lanes on the XCVU5P-L2FLVB2104E meet this specification under industrial temperature and voltage conditions per DS929.

Does XCVU5P-L2FLVB2104E include a hard processor system?

Yes, the XCVU5P-L2FLVB2104E integrates a dual-core ARM Cortex-R5F processor subsystem operating at up to 600 MHz. It features lockstep execution, private L1 cache, and tightly coupled memory. This PS domain is electrically and logically isolated from the programmable logic and runs independently of the XCVU5P-L2FLVB2104E fabric, enabling concurrent real-time control and hardware acceleration.

What I/O standards does XCVU5P-L2FLVB2104E support?

The XCVU5P-L2FLVB2104E supports LVCMOS, SSTL, HSTL, MIPI D-PHY, LVDS, and BLVDS across its HR and HP I/O banks. Voltage ranges span 0.35 V to 1.8 V, with independent bank-level VCCO control. Each bank is configured at power-up via configuration memory, and no external level shifters are required for mixed-voltage interfaces within these specifications.

Is XCVU5P-L2FLVB2104E compatible with Vivado Design Suite 2023.1?

Yes, XCVU5P-L2FLVB2104E is fully supported in Vivado Design Suite 2023.1, including synthesis, implementation, timing analysis, and bitstream generation. Device-specific IP cores-such as PCIe Gen4 Subsystem, DDR4 Memory Interface, and 25G Ethernet PCS/PMA-are included and validated for this part number. Device files and constraints templates ship with the installation.

What is the thermal design power (TDP) of XCVU5P-L2FLVB2104E?

The thermal design power (TDP) of XCVU5P-L2FLVB2104E is 45 W, measured under worst-case operating conditions defined in AMD DS929. This value reflects typical usage with 70% logic utilization, active transceivers, and DDR4 memory controller traffic. Thermal solution sizing must account for θ_JA = 5.2°C/W and junction temperature limits of 100°C.