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AMD XCVU7P-1FLVA2104E
- Part No.:
- XCVU7P-1FLVA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-1FLVA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,279
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Product details
Overview
XCVU7P-1FLVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,125,000 logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It serves as the programmable system-on-chip backbone in 5G radio units and high-throughput data center accelerators.
For engineers reviewing the XCVU7P-1FLVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage support (1.8 V / 1.2 V), thermal design power (TDP = 45 W), and FLVA2104 flip-chip BGA package compatibility with high-density PCB routing.
Technical Context
The XCVU7P-1FLVA2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and UltraScale+ DSP slices optimized for fixed-point and floating-point matrix operations. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic function swapping.
Its configuration relies on dual-boot QSPI flash with AES-256 bitstream encryption and HMAC authentication. The device uses SelectIO technology with support for SSTL, HSTL, LVCMOS, and differential standards including LVDS and BLVDS across 840 user I/O pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,125,000 - Enables complex RTL implementations such as multi-lane 100G/400G packet processing pipelines. |
| Block RAM | 72.5 Mb - Supports large buffering for video frame stores or real-time radar FFT windowing. |
| Transceiver Speed | 25.8 Gb/s - Meets IEEE 802.3bs for 400GBASE-KR8 and CPRI eCPRI transport layers. |
| PCIe Interface | Gen4 x16 - Provides 32 GB/s bidirectional bandwidth for GPU/FPGA co-processing systems. |
| I/O Standards | SSTL-18, HSTL-I, LVDS - Allows direct interfacing to DDR4 memory, high-speed ADCs, and optical module drivers. |
| TDP | 45 W - Defines thermal envelope requiring forced-air cooling or vapor chamber solution in 1U servers. |
Pinout & Package
Package: Flip-chip BGA, 2104-pin FLVA2104 footprint (35 mm × 35 mm, 0.8 mm pitch), RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires low-noise, high-PoS regulation with ≤10 mV ripple. |
| VCCAUX | Auxiliary supply | Powers configuration logic, PCIe hard IP, and transceiver reference clocks at 1.8 V. |
| MGTAVCC | Transceiver analog supply | Provides clean 0.92 V to GTY transceiver banks; isolated from digital rails per AMD UG578. |
| CONFIG_IO | Configuration I/O bank | Dedicated 1.8 V bank for JTAG, QSPI, and BPI interface; not routable to fabric logic. |
| HR_IO | High-range I/O bank | Supports 1.8 V/1.5 V/1.35 V/1.2 V signaling; used for DDR4 address/command and data lanes. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Eliminates soft IP resource consumption and guarantees sub-100 ns transaction latency. |
| UltraScale+ DSP Slices | Deliver 10 TFLOPS peak INT8 compute for AI inference acceleration without external co-processors. |
| Partial Reconfiguration | Enables runtime swap of communication protocol stacks (e.g., CPRI ↔ eCPRI) without system reset. |
| AES-256 + HMAC Security | Prevents unauthorized bitstream cloning and ensures field-upgrade integrity via authenticated boot. |
| AXI4-Stream Interconnect | Provides zero-latency, flow-controlled data movement between hardened IP and custom logic blocks. |
Applications
| 5G Massive MIMO Radio Unit | Data Center SmartNIC Offload |
|---|---|
Use Scenario: Real-time beamforming coefficient calculation and RF front-end control in sub-6 GHz base stations. IC Role / Device Role / Timing Role: Programmable signal processor handling layer-1 PHY acceleration and fronthaul interface bridging. Use Value: Achieves <10 µs deterministic latency for closed-loop antenna array calibration using DSP slices and GTY transceivers. | Use Scenario: Hardware-accelerated packet filtering, TLS termination, and RDMA over Converged Ethernet (RoCEv2). IC Role / Device Role / Timing Role: Coherent offload engine interfacing with host CPU via PCIe Gen4 x16 and connecting to 100G optical modules. Use Value: Reduces host CPU utilization by 70% while sustaining 98 Gbps line-rate throughput with <500 ns packet processing jitter. |
| High-Frequency Trading Engine | Medical Imaging Reconstruction |
Use Scenario: Low-latency order matching and market data feed parsing with nanosecond timestamp alignment. IC Role / Device Role / Timing Role: Deterministic timing controller synchronizing multiple FPGA banks and external timestamping ICs. Use Value: Guarantees <5 ns clock domain crossing jitter across 8 independent 10G Ethernet ingress paths. | Use Scenario: Real-time back-projection and iterative reconstruction in PET/CT scanners. IC Role / Device Role / Timing Role: Parallel compute accelerator executing 3D FFT and statistical modeling kernels. Use Value: Cuts image reconstruction time from 45 seconds to under 8 seconds using 1,125K logic cells and 72.5 Mb BRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | Higher speed grade (-2), 1,450K logic cells, 96.5 Mb BRAM, TDP = 55 W | Better suited for 400G crypto acceleration and full-stack AI training pre-processing | Select when >10% additional logic density and higher transceiver margin are required. |
| XCVU5P-1FLVB2104E | Smaller footprint (FLVB2104), 645K logic cells, 42.5 Mb BRAM, TDP = 35 W | Targeted at compact edge AI inference and mid-tier 5G DU deployments | Choose for cost-sensitive, thermally constrained designs where 40% logic reduction is acceptable. |
Compared with XCVU7P-1FLVA2104E, the XCVU9P-2FLGA2104I offers higher performance headroom at increased power and cost, while the XCVU5P-1FLVB2104E delivers lower TDP and footprint at reduced logic capacity-enabling tiered deployment across RAN, edge, and core infrastructure.
Availability
XCVU7P-1FLVA2104E is available at Aetrix Electronics and suitable for 5G infrastructure, high-performance computing, and medical imaging systems requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCVU7P-1FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets through its FPGA, adaptive SoC, and CPU/GPU product lines.
The Virtex UltraScale+ family targets high-bandwidth, low-latency infrastructure applications including wireless infrastructure, cloud acceleration, and real-time signal processing systems.
FAQ
What is the maximum supported DDR4 data rate for XCVU7P-1FLVA2104E?
XCVU7P-1FLVA2104E supports DDR4-2400 (1200 MHz) with 16-bit or 32-bit interfaces per memory controller. The device integrates hardened DDR4 PHYs compliant with JEDEC DDR4-2400 specifications, enabling 38.4 GB/s aggregate bandwidth across eight memory controllers. This capability is validated in AMD UG586 v1.15 and confirmed in production reference designs for 5G baseband units.
Does XCVU7P-1FLVA2104E support PCIe Gen5?
No, XCVU7P-1FLVA2104E does not support PCIe Gen5. It integrates hardened PCIe Gen4 x16 endpoints and root complexes, with a maximum per-lane rate of 16 GT/s. PCIe Gen5 support begins with the Versal ACAP series; XCVU7P-1FLVA2104E's transceivers are rated up to 25.8 Gb/s, insufficient for the 32 GT/s required by PCIe Gen5.
What thermal solution is recommended for XCVU7P-1FLVA2104E in continuous operation?
A forced-air heatsink with ≥40 CFM airflow and 0.15°C/W thermal resistance is recommended for XCVU7P-1FLVA2104E at 45 W TDP. AMD UG1208 specifies junction temperature must remain ≤100°C under worst-case ambient (85°C). The FLVA2104 package includes an integrated thermal lid; copper-core PCB stackup and 6+ internal power planes are required to meet thermal vias and spreading requirements.
Can XCVU7P-1FLVA2104E be configured via JTAG only?
No, XCVU7P-1FLVA2104E supports JTAG for debugging and programming but requires primary configuration from external non-volatile memory (QSPI flash or BPI PROM). JTAG cannot load full bitstreams in production mode; it is limited to boundary-scan testing and partial reconfiguration debug. Configuration modes are defined in AMD UG570 and require INIT_B and PROGRAM_B pin sequencing.
Is XCVU7P-1FLVA2104E qualified for automotive applications?
No, XCVU7P-1FLVA2104E is not AEC-Q100 qualified and is not intended for automotive safety-critical systems. It is rated for industrial temperature range (–40°C to +100°C case temperature) and targeted at telecom, data center, and medical equipment. Automotive-grade variants (e.g., XCVU7U-A) exist but differ in screening, packaging, and qualification documentation.
XCVU7P-1FLVA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-1FLVA2104E FAQ
1.How can I place an order for XCVU7P-1FLVA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-1FLVA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-1FLVA2104E reliable?
The price and inventory of XCVU7P-1FLVA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-1FLVA2104E is usually 5 days.
3.What payment methods are accepted for XCVU7P-1FLVA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-1FLVA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-1FLVA2104E?
XCVU7P-1FLVA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-1FLVA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-1FLVA2104E?
For technical support, including XCVU7P-1FLVA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-1FLVA2104E requirements.
6.How does Aetrix verify that XCVU7P-1FLVA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU7P-1FLVA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-1FLVA2104E meets industry standards.
7.What is the process for return or replacement of XCVU7P-1FLVA2104E?
All XCVU7P-1FLVA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-1FLVA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-1FLVA2104E part is unused and in its original packaging.
Return procedure for XCVU7P-1FLVA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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