AMD XCVU7P-1FLVA2104I
- Part No.:
- XCVU7P-1FLVA2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-1FLVA2104I.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCVU7P-1FLVA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,125,000 logic cells, 8,520 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.
For engineers reviewing the XCVU7P-1FLVA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (32 GTY), I/O voltage support (0.35–1.8 V), and thermal design power (TDP) of 49.5 W under typical configuration.
Technical Context
The XCVU7P-1FLVA2104I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers, and integrated RFSoC analog-to-digital converters in select variants - though this specific part excludes RF-ADC blocks. It supports DDR4 memory interfaces up to 2400 MT/s and includes hardened 100G Ethernet MAC cores.
Configuration occurs via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device operates across industrial temperature range (–40°C to +100°C) and requires multi-rail power sequencing (VCCINT, VCCAUX, VCCO, VMGTAVCC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,125,000 - determines maximum combinational/sequential logic capacity for complex algorithm acceleration |
| DSP Slices | 8,520 - enables concurrent execution of >10K MAC operations per cycle for real-time filtering |
| Block RAM | 72.5 Mb - supports large on-chip buffering for video frame storage or packet queuing |
| GTY Transceivers | 32 lanes @ 25.8 Gb/s - delivers 825.6 Gb/s aggregate serial bandwidth for optical interconnect |
| I/O Standards | Supports LVDS, SSTL, HSTL, MIPI, and differential signaling - enables direct interface to ADCs, DACs, and FPGAs |
| TDP | 49.5 W - defines minimum heatsink requirement and airflow specification for board-level thermal management |
Pinout & Package
This device is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Pin assignment follows AMD's UltraScale+ pinout standard for FLVA2104 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as GPIO, SDIO, UART, SPI, or I²C - used for peripheral control and boot interface |
| HR_IO_L[0:71] | High-Range I/O Bank | Supports 1.8 V/1.5 V/1.35 V/1.25 V/1.0 V signaling - connects to DDR4 memory and high-speed ADCs |
| HP_IO_L[0:95] | High-Performance I/O Bank | LVDS-2.5/LVDS-1.8 compatible - routes GTY transceiver reference clocks and data lanes |
| VCCINT | Core Power Supply | 0.85 V ±3% supply - powers CLB, BRAM, and DSP logic; requires low-noise regulation |
| VMGTAVCC | Analog Transceiver Supply | 1.0 V ±2% supply - powers GTY PLLs and CDR circuits; isolated from digital rails |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Root Port | Hardened endpoint supporting 16 GTY lanes at 16 GT/s - eliminates soft IP latency and resource overhead |
| UltraScale+ Memory Controller | Native DDR4/DDR3/LPDDR4 controller with ECC and 2400 MT/s rate - reduces external memory controller complexity |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized configuration - required for defense and telecom security compliance |
| Partial Reconfiguration Support | Enables dynamic logic swapping without system reset - critical for adaptive radio and real-time protocol switching |
| Multi-Rail Power Sequencing | Defined startup order (VCCAUX → VCCINT → VMGTAVCC) ensures reliable configuration and transceiver lock |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne SAR systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; GTY transceivers interface with wideband ADC/DAC arrays. Use Value: 8,520 DSP slices enable 2× faster Doppler spectrum computation versus prior Virtex-7 generation. | Use Scenario: Layer 1 PHY processing for 64T64R massive MIMO radios operating at 3.5 GHz. IC Role / Device Role / Timing Role: Hosts channel estimation, precoding, and OFDM modulation/demodulation; PCIe Gen4 x16 links to host CPU. Use Value: Hardened 100G Ethernet MAC allows fronthaul transport over eCPRI without external PHY chips. |
| High-Frequency Trading Engine | Test & Measurement Instrumentation |
Use Scenario: Sub-microsecond latency market data parsing and order execution in FPGA-accelerated trading platforms. IC Role / Device Role / Timing Role: Low-latency packet parser and deterministic scheduler; HR I/O drives custom 10G/25G SerDes interfaces. Use Value: 49.5 W TDP enables air-cooled deployment in dense 1U server chassis without liquid cooling. | Use Scenario: Modular oscilloscope front-end with 10 GS/s sampling and real-time waveform analysis. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and histogram-based jitter measurement engine. Use Value: 72.5 Mb block RAM buffers 128 million samples for deep memory capture and post-processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | Higher speed grade (–2), 2,072K logic cells, 12,288 DSP slices, 102.4 Mb BRAM | Required for >100 Gb/s packet classification or full 5G NR stack offload | Select when >1.5× logic density or >40% more DSP resources are needed; increases TDP to 62.1 W |
| XCVU5P-1FLVB2104I | Smaller footprint (FLVB2104), 645K logic cells, 5,400 DSP slices, 42.5 Mb BRAM | Suitable for mid-tier 5G small cell or LIDAR point cloud processing | Choose for cost-sensitive designs where 32 GTY lanes remain essential but logic utilization stays below 60% |
Compared with XCVU7P-1FLVA2104I, the XCVU9P-2FLGA2104I delivers higher throughput at increased power and cost, while the XCVU5P-1FLVB2104I offers reduced capacity in identical 2104-ball form factor - enabling PCB reuse with logic downgrades.
Availability
XCVU7P-1FLVA2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-frequency trading infrastructure requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU7P-1FLVA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and aerospace markets.
The Virtex UltraScale+ family targets high-throughput, low-latency systems demanding hardened interfaces, advanced DSP, and secure reconfigurability - especially in defense radar, 5G infrastructure, and financial computing.
FAQ
What is the maximum supported DDR4 data rate for XCVU7P-1FLVA2104I?
XCVU7P-1FLVA2104I supports DDR4 memory interfaces up to 2400 MT/s using its hardened memory controller. This capability is verified in AMD UG576 v1.14 and applies to all HR I/O banks configured for SSTL-12. The controller includes built-in write leveling, read leveling, and training sequences to ensure signal integrity at full rate.
Does XCVU7P-1FLVA2104I include integrated RF-ADC or RF-DAC blocks?
No, XCVU7P-1FLVA2104I does not include RF-ADC or RF-DAC blocks. Those features are exclusive to the Zynq UltraScale+ RFSoC variants (e.g., ZU28DR). The XCVU7P-1FLVA2104I is a pure FPGA with GTY transceivers only - analog signal acquisition must be handled by external ADC/DAC components interfaced via its high-speed I/O banks.
What power supply sequencing is required for reliable configuration of XCVU7P-1FLVA2104I?
XCVU7P-1FLVA2104I requires strict power sequencing: VCCAUX must ramp first (≥1.0 V), followed by VCCINT (0.85 V), then VMGTAVCC (1.0 V), and finally VCCO banks. Deviation risks configuration failure or GTY PLL unlock. AMD DS923 specifies tolerances of ±2% on VCCINT and ±3% on VMGTAVCC during steady-state operation.
Can XCVU7P-1FLVA2104I be used as a PCIe Gen4 endpoint in a root complex system?
Yes, XCVU7P-1FLVA2104I implements a hardened PCIe Gen4 x16 endpoint capable of operating in root complex mode. Its integrated DMA engines and AXI4-Stream interfaces allow direct memory access to host DRAM without CPU intervention. Configuration is managed through standard PCIe enumeration and BAR mapping as defined in AMD PG213 v1.12.
Is partial reconfiguration supported on XCVU7P-1FLVA2104I, and what tools enable it?
Yes, XCVU7P-1FLVA2104I fully supports partial reconfiguration using Vivado Design Suite 2023.2 or later. The feature allows dynamic swapping of logical partitions (e.g., modulation schemes or filter coefficients) while maintaining system uptime. Bitstream encryption remains active during reconfiguration, preserving security integrity for XCVU7P-1FLVA2104I deployments in regulated environments.
XCVU7P-1FLVA2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-1FLVA2104I FAQ
1.How can I place an order for XCVU7P-1FLVA2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-1FLVA2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-1FLVA2104I reliable?
The price and inventory of XCVU7P-1FLVA2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-1FLVA2104I is usually 5 days.
3.What payment methods are accepted for XCVU7P-1FLVA2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-1FLVA2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-1FLVA2104I?
XCVU7P-1FLVA2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-1FLVA2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-1FLVA2104I?
For technical support, including XCVU7P-1FLVA2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-1FLVA2104I requirements.
6.How does Aetrix verify that XCVU7P-1FLVA2104I is sourced from the original manufacturer or authorized distributors?
All XCVU7P-1FLVA2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-1FLVA2104I meets industry standards.
7.What is the process for return or replacement of XCVU7P-1FLVA2104I?
All XCVU7P-1FLVA2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-1FLVA2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-1FLVA2104I part is unused and in its original packaging.
Return procedure for XCVU7P-1FLVA2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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