My Inquiry
My Account
AMD XCVU7P-1FLVB2104E
- Part No.:
- XCVU7P-1FLVB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-1FLVB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,929
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU7P-1FLVB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,125,720 logic cells, 8,520 DSP slices, and 96.2 Gb/s transceiver bandwidth with 25.8 Gb/s GTY transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, deployed in high-end test equipment and radar signal processing systems.
For engineers reviewing the XCVU7P-1FLVB2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, on-die memory bandwidth, PCIe Gen4 support, and thermal design power for air-cooled 2104-pin flip-chip BGA systems.
Technical Context
The XCVU7P-1FLVB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4), and GTY transceivers supporting PAM4 and NRZ modulation. It uses 16nm FinFET process technology and supports partial reconfiguration.
Configuration is performed via quad-SPI, JTAG, or SelectMAP interfaces. The device includes integrated system monitoring (temperature, voltage, current) and supports IEEE 1149.1/1532 boundary-scan compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,125,720 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 8,520 - dedicated arithmetic units supporting 27×18-bit multiply-accumulate at up to 550 MHz |
| GTY Transceivers | 48 lanes @ 25.8 Gb/s - high-speed serial I/O supporting PCIe Gen4, 100G Ethernet, and CPRI |
| Memory Interface | DDR4-2400 @ 64-bit - integrated controller with ECC support for up to 128 GB addressable memory |
| PCIe Interface | Gen4 x16 hard IP - full-duplex 16-lane root port or endpoint with AXI4 streaming interface |
| Thermal Design Power | 45 W typical - defines cooling requirements for sustained operation under worst-case logic utilization |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as GPIO, SDIO, UART, SPI, or I²C; supports 1.8 V/3.3 V I/O standards |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4, LPDDR4, and GTY transceiver reference clocks; 1.2 V–1.8 V operation |
| GTY_TXN/GTY_TXP | Differential Transmitter Output | 48 pairs for 25.8 Gb/s serial data; requires controlled impedance PCB routing |
| GTY_RXN/GTY_RXP | Differential Receiver Input | 48 pairs with adaptive equalization; supports PRBS31 pattern lock and eye monitoring |
| VCCINT | Core Supply | 0.85 V ±3% supply for logic fabric and CLB; requires low-noise regulation and decoupling |
| VCCAUX | Auxiliary Supply | 1.8 V supply for configuration logic, PCIe block, and clock management tiles |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Reduces integration effort and latency versus soft-core implementations; enables direct CPU-FPGA coherency in CXL-adjacent designs |
| 100G Ethernet MAC + RS-FEC | Offloads line-rate packet processing and forward error correction from host processor in optical transport and data center interconnect |
| Partial Reconfiguration Support | Enables dynamic function swapping without system reset-critical for multi-mode radar and real-time protocol adaptation |
| Integrated System Monitor | Provides real-time die temperature, supply voltage, and current telemetry via I²C or JTAG for thermal-aware runtime management |
| UltraScale+ Memory Controller | Delivers 128 GB/s peak DDR4 bandwidth with on-die termination and write leveling-optimized for burst-intensive signal processing workloads |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with deterministic latency under 500 ns. Use Value: GTY transceivers interface directly to ADC/DAC FMC modules at 25.8 Gb/s; hardened 100G MAC routes sensor fusion data to networked control nodes. | Use Scenario: Automated test equipment for high-speed SerDes validation including jitter tolerance, eye diagram analysis, and PRBS error counting. IC Role / Device Role / Timing Role: Programmable pattern generator and error detector with sub-cycle timing resolution across 48 transceiver lanes. Use Value: On-chip PRBS generators, BER monitors, and adaptive equalizers eliminate external instrumentation for PHY-layer conformance testing. |
| Data Center Acceleration | Optical Transport Networking |
Use Scenario: SmartNIC offload for RDMA, TLS encryption, and packet filtering in cloud infrastructure servers. IC Role / Device Role / Timing Role: PCIe Gen4 x16 endpoint accelerating host CPU workloads while maintaining cache-coherent memory access via CXL-compatible interfaces. Use Value: Hardened PCIe and DDR4 controllers enable <1.2 μs round-trip latency for remote memory access; DSP slices accelerate crypto operations at 100+ Gbps. | Use Scenario: OTN switching and DWDM line-card processing in metro and long-haul optical networks. IC Role / Device Role / Timing Role: Line-side framer and mapper implementing OTU4/OTU3e2 with RS(255,239) FEC and GFP-F encapsulation. Use Value: Integrated 100G Ethernet MAC and GTY transceivers support dual 100G client interfaces with hitless protection switching and OAM frame insertion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLVB2104I | Higher speed grade (-2), 1,425,720 logic cells, 10,200 DSP slices, same package and GTY count | Required for >550 MHz DSP throughput or >200K LUT real-time control loops | Select when timing closure fails at -1 speed grade or when additional logic density is needed for multi-function consolidation |
| XCVU13P-2FLGB2104E | Same speed grade (-2), 1,925,720 logic cells, 12,200 DSP slices, larger 2104-pin FLGB package (37.5 mm × 37.5 mm) | Needed for >128 GB DDR4 capacity or dual 100G + 400G Ethernet aggregation | Choose when board layout allows larger footprint and higher memory bandwidth or transceiver count is insufficient on FLVB |
Compared with XCVU7P-1FLVB2104E, the XCVU9P-2FLVB2104I delivers 26% more logic and 20% more DSP resources at identical pinout but requires tighter power delivery and thermal management; the XCVU13P-2FLGB2104E offers 71% higher logic density and expanded memory interface but mandates PCB redesign due to larger package size.
Availability
XCVU7P-1FLVB2104E is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and optical transport networking requiring stable component supply across extended product lifecycles.
Supply support for XCVU7P-1FLVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and thermally constrained applications in defense electronics, 5G infrastructure, and next-generation test systems.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCVU7P-1FLVB2104E?
The XCVU7P-1FLVB2104E supports up to 25.8 Gb/s per GTY transceiver lane using NRZ encoding, and up to 51.6 Gb/s with PAM4 modulation. This capability enables direct interface with 100G Ethernet QSFP28 modules and high-speed ADC/DAC converters. All 48 GTY lanes in XCVU7P-1FLVB2104E meet this specification under recommended operating conditions and proper PCB layout.
Does XCVU7P-1FLVB2104E include a hardened DDR4 memory controller?
Yes, XCVU7P-1FLVB2104E integrates a hardened DDR4 memory controller supporting 64-bit wide interfaces at up to 2400 MT/s with on-die termination, write leveling, and ECC. It connects directly to external DDR4 components without external PHY, reducing latency and board area. The controller is fully supported in AMD Vivado tools for XCVU7P-1FLVB2104E implementation.
Is XCVU7P-1FLVB2104E compatible with PCIe Gen4 x16 root complex operation?
Yes, XCVU7P-1FLVB2104E includes a hardened PCIe Gen4 x16 endpoint and root complex block compliant with PCI Express Base Specification v4.0. It supports both upstream and downstream traffic, ASPM L0s/L1, and AER reporting. Configuration and link training for XCVU7P-1FLVB2104E are handled entirely by the hard IP without soft logic overhead.
What configuration modes does XCVU7P-1FLVB2104E support?
XCVU7P-1FLVB2104E supports multiple configuration modes: master/slave quad-SPI, JTAG, SelectMAP, and BPI. Quad-SPI mode enables fast boot from serial flash with 4-bit data bus; JTAG is used for debugging and programming during development. All modes are validated for XCVU7P-1FLVB2104E and documented in UG570.
What thermal management provisions are built into XCVU7P-1FLVB2104E?
XCVU7P-1FLVB2104E includes an integrated system monitor with on-die temperature sensors, supply voltage monitors, and current measurement circuits accessible via I²C or JTAG. It supports dynamic thermal throttling and alerts through dedicated pins. These features are factory-calibrated and operational across the full industrial temperature range of XCVU7P-1FLVB2104E.
XCVU7P-1FLVB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-1FLVB2104E FAQ
1.How can I place an order for XCVU7P-1FLVB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-1FLVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-1FLVB2104E reliable?
The price and inventory of XCVU7P-1FLVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-1FLVB2104E is usually 5 days.
3.What payment methods are accepted for XCVU7P-1FLVB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-1FLVB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-1FLVB2104E?
XCVU7P-1FLVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-1FLVB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-1FLVB2104E?
For technical support, including XCVU7P-1FLVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-1FLVB2104E requirements.
6.How does Aetrix verify that XCVU7P-1FLVB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU7P-1FLVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-1FLVB2104E meets industry standards.
7.What is the process for return or replacement of XCVU7P-1FLVB2104E?
All XCVU7P-1FLVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-1FLVB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-1FLVB2104E part is unused and in its original packaging.
Return procedure for XCVU7P-1FLVB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU7P-1FLVB2104E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
