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AMD XCVU7P-1FLVB2104I
- Part No.:
- XCVU7P-1FLVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-1FLVB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,577
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Product details
Overview
XCVU7P-1FLVB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets advanced radar processing, 5G baseband acceleration, and AI inference at the edge.
For engineers reviewing the XCVU7P-1FLVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (32), I/O bank voltage flexibility (1.2 V to 1.8 V), thermal design power (195 W), and package-specific routing constraints for FLVB2104.
Technical Context
The XCVU7P-1FLVB2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and UltraScale+ DSP slices optimized for fixed-point and floating-point matrix operations. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.
Its configuration relies on dual-boot QSPI flash support and JTAG boundary-scan compliance per IEEE 1149.1. The device uses SelectIO technology with SSTL, HSTL, and LVCMOS I/O standards across 24 configurable I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| Block RAM | 72.5 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM |
| Transceivers | 32 × 25.8 Gb/s - enables 100G Ethernet, CPRI/eCPRI, and high-speed serial backplane links |
| Max I/O Count | 832 - supports wide parallel interfaces (e.g., DDR4 x72) and multi-protocol pin multiplexing |
| Package | FLVB2104 - 2104-pin flip-chip BGA, 35 mm × 35 mm, 0.8 mm pitch, with thermal lid and underfill support |
| TDP | 195 W - defines minimum heatsink thermal resistance (≤ 0.21 °C/W) and airflow requirements |
Pinout & Package
FLVB2104 is a 2104-pin flip-chip ball grid array with 35 mm × 35 mm footprint, 0.8 mm pitch, and integrated thermal lid. It supports 24 I/O banks, 8 configuration banks, and dedicated power/ground ball patterns for signal integrity and power delivery stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | Supplies 0.85 V ±3% to programmable logic and CLB fabric; requires low-noise regulation |
| VCCAUX | Auxiliary supply | Provides 1.8 V to configuration logic, PCIe hard IP, and clock management tiles |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V ±2% to GTY transceiver analog circuitry; sensitive to ripple & noise |
| VRP/VRN | Reference voltage pair | Defines termination voltage for differential I/O standards (e.g., SSTL12_DCI); must be stable & filtered |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces latency and resource usage vs. soft-core implementations; supports SR-IOV and ATS |
| UltraScale+ DSP Slices | Deliver 10.4 TMAC/s peak throughput for INT8/FP16 convolution kernels in AI workloads |
| Partial Reconfiguration | Enables dynamic function swapping without full system reset; verified for radar waveform updates |
| AXI4-Stream Support | Allows zero-copy data movement between IP blocks and memory-mapped peripherals |
| Multi-Standard I/O | Per-bank voltage selection (1.2–1.8 V) simplifies interface to DDR4, QSFP+, and ADC/DAC devices |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; GTY transceivers interface to RF SoCs. Use Value: 25.8 Gb/s transceivers enable direct JESD204B/C connectivity to high-speed ADCs/DACs, eliminating intermediate SerDes. | Use Scenario: Layer 1 PHY acceleration for 5G NR gNodeB units with 64T64R antenna arrays. IC Role / Device Role / Timing Role: Hardened 100G Ethernet MAC and PCIe Gen4 x16 handle fronthaul transport and host CPU offload. Use Value: 72.5 Mb block RAM buffers multi-carrier OFDM symbols across 100+ subframes before FFT processing. |
| AI Edge Inference Accelerator | High-Performance Test Equipment |
Use Scenario: Low-latency object detection on UAV-mounted vision systems using YOLOv5-tiny. IC Role / Device Role / Timing Role: DSP slices perform INT8 matrix multiplication; AXI4-Stream pipelines feed sensor data to CNN engine. Use Value: 10.4 TMAC/s throughput sustains 120 FPS inference at <500 µs end-to-end latency. | Use Scenario: High-speed digital pattern generation and analysis in ATE platforms. IC Role / Device Role / Timing Role: Configurable I/O banks drive 1.6 Gb/s parallel vectors; transceivers capture eye-diagram data at 25.8 Gb/s. Use Value: 832 I/O pins support simultaneous multi-site testing of ASICs with wide bus interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLVB2104I | Higher speed grade (-2), 1,452K logic cells, 102.4 Mb BRAM, 220 W TDP | Better suited for sustained 100G+ packet processing with larger buffer depth | Select when >1.2× logic density or >20% higher BRAM is required for target algorithm partitioning |
| XCVU5P-1FLVB2104I | Lower logic count (742K), 42.5 Mb BRAM, 32 GTY transceivers retained, 145 W TDP | Optimized for cost-sensitive 5G small cells and mid-tier test equipment | Choose when transceiver count is critical but logic/BRAM headroom allows down-bin |
Compared with XCVU7P-1FLVB2104I, the XCVU9P-2FLVB2104I delivers higher deterministic timing margin and deeper on-chip memory for complex buffering, while the XCVU5P-1FLVB2104I reduces thermal load and BOM cost where full Virtex UltraScale+ P-series capacity is unused.
Availability
XCVU7P-1FLVB2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and AI edge inference requiring stable component supply across long-lifecycle industrial and defense programs.
Supply support for XCVU7P-1FLVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.
The Virtex UltraScale+ family was designed for infrastructure acceleration in 5G wireless, aerospace radar, and real-time AI inference-emphasizing transceiver bandwidth, logic density, and deterministic low-latency processing.
FAQ
What is the maximum supported data rate for transceivers on the XCVU7P-1FLVB2104I?
The XCVU7P-1FLVB2104I integrates 32 GTY transceivers each capable of 25.8 Gb/s operation. This supports protocols including 100G Ethernet (4×25G), CPRI Option 10, and JESD204C. Actual achievable rates depend on PCB stackup, reference clock jitter, and equalization settings configured in Vivado.
Does the XCVU7P-1FLVB2104I support partial reconfiguration?
Yes, the XCVU7P-1FLVB2104I fully supports partial reconfiguration via Vivado Design Suite. Verified use cases include dynamic radar waveform updates and runtime protocol switching in 5G fronthaul. Configuration frames can be loaded into designated reconfigurable partitions without resetting the entire device.
What I/O standards are supported by the XCVU7P-1FLVB2104I?
The XCVU7P-1FLVB2104I supports SSTL, HSTL, LVCMOS, and differential standards including LVDS and BLVDS across its 24 I/O banks. Each bank operates independently at 1.2 V, 1.35 V, 1.5 V, or 1.8 V, enabling direct interfacing to DDR4, QSFP28 modules, and high-speed ADCs without level shifters.
What is the thermal design power (TDP) of the XCVU7P-1FLVB2104I?
The XCVU7P-1FLVB2104I has a specified thermal design power of 195 W under worst-case operating conditions. This value guides heatsink selection, airflow requirements, and board-level thermal vias. Actual power consumption varies with logic utilization, transceiver activity, and I/O toggle rate.
Is the XCVU7P-1FLVB2104I pin-compatible with other Virtex UltraScale+ packages?
No, the XCVU7P-1FLVB2104I uses the FLVB2104 package exclusively. While other Virtex UltraScale+ devices share the FLVB2104 footprint (e.g., XCVU5P/XCVU9P), pin functions and bank assignments differ significantly. Migration requires full PCB redesign and I/O constraint validation in Vivado.
XCVU7P-1FLVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-1FLVB2104I FAQ
1.How can I place an order for XCVU7P-1FLVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-1FLVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-1FLVB2104I reliable?
The price and inventory of XCVU7P-1FLVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-1FLVB2104I is usually 5 days.
3.What payment methods are accepted for XCVU7P-1FLVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-1FLVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-1FLVB2104I?
XCVU7P-1FLVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-1FLVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-1FLVB2104I?
For technical support, including XCVU7P-1FLVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-1FLVB2104I requirements.
6.How does Aetrix verify that XCVU7P-1FLVB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU7P-1FLVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-1FLVB2104I meets industry standards.
7.What is the process for return or replacement of XCVU7P-1FLVB2104I?
All XCVU7P-1FLVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-1FLVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-1FLVB2104I part is unused and in its original packaging.
Return procedure for XCVU7P-1FLVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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