AMD XCVU7P-2FLVA2104E
- Part No.:
- XCVU7P-2FLVA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-2FLVA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCVU7P-2FLVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,128K logic cells, 72.5 Mb of block RAM, 100+ 28 Gbps GTY transceivers, and integrated hardened PCIe Gen4 x16 controller - deployed in 5G wireless infrastructure baseband processing and radar signal conditioning systems.
For engineers reviewing the XCVU7P-2FLVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, system-level PCIe Gen4 integration, deterministic timing closure for multi-die interconnects, and thermal performance under sustained DSP load.
Technical Context
The XCVU7P-2FLVA2104E implements a heterogeneous multi-die architecture with four FPGA dies interconnected via AMD's UltraScale+ silicon interposer. It supports deterministic latency through hardened AXI-Stream interfaces and includes dual 64-bit DDR4 memory controllers with ECC support.
Its GTY transceivers are configurable for PAM4 or NRZ signaling up to 28.1 Gbps per lane, and the device integrates a hardened 100G Ethernet MAC with RS-FEC. The -2 speed grade guarantees timing closure at 750 MHz for critical paths in high-throughput packet processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,128,000 - enables large-scale digital signal processing pipelines with parallel FFT, filtering, and beamforming logic |
| Block RAM | 72.5 Mb - supports multi-channel buffering for real-time 5G NR frame processing without external memory bottleneck |
| GTY Transceivers | 100+ lanes @ 28.1 Gbps - delivers full-duplex 100G+ backplane connectivity for fronthaul and midhaul aggregation |
| PCIe Interface | Hardened Gen4 x16 - eliminates soft IP overhead and ensures sub-100 ns host-to-FPGA latency for control plane offload |
| Speed Grade | -2 - guarantees timing closure at 750 MHz on critical datapaths in radar pulse compression engines |
| Memory Controllers | Dual 64-bit DDR4 w/ ECC - provides 51.2 GB/s sustained bandwidth with error resilience for baseband memory mapping |
Pinout & Package
Package: FLVA2104 - 2104-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, or GPIO for management interface and boot configuration |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V / 1.5 V / 1.35 V LVDS, SSTL, and HSTL for high-speed SerDes reference clocks and data capture |
| GTY_RXN/P[0:99] | Differential Transceiver Input | Accepts 28.1 Gbps NRZ or PAM4 signals; each pair requires dedicated AC-coupling and impedance-controlled routing |
| GTY_TXN/P[0:99] | Differential Transceiver Output | Drives 28.1 Gbps serial lanes with programmable pre-emphasis and common-mode voltage control |
| DDR4_CK_N/P[0:1] | Dual DDR4 Clock Pair | Provides differential 1.2 V CK/CK# to two independent 64-bit DDR4 interfaces with 0.5 ps skew tolerance |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Multi-Die Architecture | Four FPGA dies on single interposer enable scalable compute density while maintaining signal integrity across die boundaries |
| Hardened 100G Ethernet MAC | Offloads PHY framing, scrambling, and RS-FEC decoding - reduces soft logic usage by ~220K LUTs vs. soft IP implementation |
| UltraScale+ Memory Controller | Dual DDR4 controllers deliver 51.2 GB/s aggregate bandwidth with on-die ECC correction for mission-critical buffer storage |
| PCIe Gen4 x16 Hard IP | Guarantees deterministic 16 GT/s link initialization and recovery without firmware intervention or soft logic arbitration |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of radar waveform generators during active beam steering without system reset or downtime |
Applications
| 5G Massive MIMO Baseband Unit | Phased Array Radar Signal Processor |
|---|---|
Use Scenario: Real-time OFDM symbol processing, channel estimation, and precoding for 64T64R antenna arrays. IC Role / Device Role / Timing Role: Primary baseband accelerator handling Layer 1 PHY functions with deterministic sub-microsecond latency. Use Value: 100+ GTY lanes enable direct fronthaul interface to remote radio units; hardened PCIe Gen4 allows low-latency control plane access from server host. | Use Scenario: Pulse compression, Doppler FFT, and adaptive beamforming for airborne surveillance radar. IC Role / Device Role / Timing Role: Real-time signal conditioning engine synchronizing ADC/DAC sampling with RF front-end timing. Use Value: Dual DDR4 controllers sustain 51.2 GB/s memory bandwidth for multi-millisecond chirp buffers; -2 speed grade ensures timing closure under temperature-varying flight conditions. |
| High-Throughput Network Packet Broker | AI-Accelerated Test Equipment Platform |
Use Scenario: Line-rate packet classification, deep packet inspection, and flow steering across 100G+ ports. IC Role / Device Role / Timing Role: Programmable forwarding engine implementing custom match-action tables and stateful session tracking. Use Value: Hardened 100G Ethernet MAC handles RS-FEC and scrambling in hardware, freeing LUT resources for custom parsing logic. | Use Scenario: Real-time protocol emulation and stimulus generation for 400G Ethernet compliance testing. IC Role / Device Role / Timing Role: Reconfigurable test pattern generator synchronized to precision reference clocks and jitter injection sources. Use Value: GTY transceivers support both NRZ and PAM4 modes - enabling validation of DUTs across multiple IEEE 802.3bs/cd/ay standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU7P-1FLVA2104I | Lower -1 speed grade; reduced max frequency (650 MHz) and lower GTY voltage margin | Suitable for cost-sensitive 5G small cell BBU where thermal headroom is constrained | Select when deterministic 750 MHz timing closure is not required and power envelope is prioritized |
| XCVU9P-2FLGA2577E | Larger package (2577-pin FLGA), +25% logic cells (1,408K), +32% GTY lanes (132), no PCIe Gen4 hard IP | Targeted at AI inference acceleration and multi-chip radar fusion where PCIe host interface is handled externally | Choose when higher logic density and transceiver count outweigh need for integrated PCIe Gen4 root complex |
Compared with XCVU7P-2FLVA2104E, the -1 variant trades timing margin for thermal efficiency, while the XCVU9P-2FLGA2577E expands raw capacity but removes hardened PCIe - making XCVU7P-2FLVA2104E optimal for PCIe-hosted 100G+ signal processing systems requiring deterministic latency.
Availability
XCVU7P-2FLVA2104E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for XCVU7P-2FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems.
The Virtex UltraScale+ family targets high-bandwidth, low-latency signal processing in communications infrastructure and defense electronics - optimized for deterministic timing, hardened protocol stacks, and multi-die scalability.
FAQ
What is the maximum operating frequency supported by the XCVU7P-2FLVA2104E?
The XCVU7P-2FLVA2104E carries the -2 speed grade, guaranteeing timing closure for critical paths up to 750 MHz. This rating applies specifically to synchronous logic paths within the FPGA fabric and accounts for worst-case voltage and temperature conditions defined in AMD's characterization profile. The actual achievable frequency depends on design topology, placement, and routing - but the -2 grade ensures predictable performance in radar and 5G baseband applications where deterministic latency is mandatory. XCVU7P-2FLVA2104E meets this spec across its full commercial temperature range.
Does the XCVU7P-2FLVA2104E include a hardened PCIe Gen4 controller?
Yes, the XCVU7P-2FLVA2104E integrates a fully hardened PCIe Gen4 x16 root complex controller. It supports link training, power management states (L0–L2), and advanced error reporting (AER) without consuming programmable logic resources. This hard IP delivers sub-100 ns host-to-FPGA latency and eliminates soft-core synthesis variability. XCVU7P-2FLVA2104E uses this controller for high-throughput control plane communication in 5G baseband units and radar test platforms.
How many GTY transceivers does the XCVU7P-2FLVA2104E support, and what protocols are they qualified for?
The XCVU7P-2FLVA2104E supports 100+ GTY transceiver lanes, each capable of NRZ signaling up to 28.1 Gbps or PAM4 up to 56 Gbps. These lanes are qualified for 100G Ethernet (IEEE 802.3bj/cm), PCIe Gen4, and CPRI/eCPRI. Each GTY bank includes dedicated clocking, calibration circuitry, and programmable equalization. XCVU7P-2FLVA2104E leverages these for fronthaul aggregation and high-speed instrument synchronization.
What memory interfaces are built into the XCVU7P-2FLVA2104E?
The XCVU7P-2FLVA2104E includes two independent hardened DDR4 memory controllers, each supporting a 64-bit data bus with ECC, operating at up to 1200 MHz (2400 MT/s). They provide 51.2 GB/s aggregate bandwidth and support address/command parity, write leveling, and read/write leveling. XCVU7P-2FLVA2104E uses these controllers for real-time buffering of multi-channel 5G symbols and radar chirp data with fault resilience.
Is partial reconfiguration supported on the XCVU7P-2FLVA2104E?
Yes, the XCVU7P-2FLVA2104E supports Dynamic Function eXchange (DFX) for verified, time-bound partial reconfiguration. This capability allows runtime updates of specific logic regions - such as radar waveform generators or 5G numerology blocks - without resetting the entire device or interrupting active data paths. XCVU7P-2FLVA2104E implements DFX using dedicated configuration circuitry and secure bitstream authentication, meeting DO-254 and IEC 61508 requirements for safety-critical deployments.
XCVU7P-2FLVA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-2FLVA2104E FAQ
1.How can I place an order for XCVU7P-2FLVA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-2FLVA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-2FLVA2104E reliable?
The price and inventory of XCVU7P-2FLVA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-2FLVA2104E is usually 5 days.
3.What payment methods are accepted for XCVU7P-2FLVA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-2FLVA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-2FLVA2104E?
XCVU7P-2FLVA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-2FLVA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-2FLVA2104E?
For technical support, including XCVU7P-2FLVA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-2FLVA2104E requirements.
6.How does Aetrix verify that XCVU7P-2FLVA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU7P-2FLVA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-2FLVA2104E meets industry standards.
7.What is the process for return or replacement of XCVU7P-2FLVA2104E?
All XCVU7P-2FLVA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-2FLVA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-2FLVA2104E part is unused and in its original packaging.
Return procedure for XCVU7P-2FLVA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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