AMD XCVU7P-2FLVA2104I

Overview

XCVU7P-2FLVA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,125,720 logic cells, 8,520 DSP slices, and 72.9 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, targeting high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.

For engineers reviewing the XCVU7P-2FLVA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-2), I/O bank voltage flexibility (1.2 V to 1.8 V), and thermal performance in air-cooled 2104-pin flip-chip BGA packaging.

Technical Context

The XCVU7P-2FLVA2104I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines for fixed-point and floating-point arithmetic, and integrated 25.8 Gb/s GTY transceivers supporting PAM4 and NRZ modulation. It includes hardened IP blocks for PCIe Gen4, 100G Ethernet MAC, and DDR4 memory controllers.

Configuration is performed via quad-SPI, BPI, or JTAG interfaces with AES-256 bitstream encryption and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in mission-critical systems.

Key Specifications

Pinout & Package

The XCVU7P-2FLVA2104I is housed in a 2104-pin flip-chip BGA (FLVA) package with 0.8 mm pitch, designed for high-density PCB layouts and efficient thermal transfer via thermal vias to internal copper planes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU7P-2FLVA2104I, the XCVU9P-2FLGA2104I offers scalable logic headroom within identical thermal and mechanical constraints, while the XCVU13P-2FLGA2577I delivers significantly greater I/O and compute density at the cost of larger board footprint and higher power delivery complexity.

Availability

XCVU7P-2FLVA2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply across long product lifecycles.

Supply support for XCVU7P-2FLVA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.

The Virtex UltraScale+ family targets demanding infrastructure applications requiring hardened transceivers, high logic density, and security features - exemplified by the XCVU7P-2FLVA2104I's use in mission-critical signal processing and communications platforms.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU7P-2FLVA2104I?

The XCVU7P-2FLVA2104I supports GTY transceivers rated up to 25.8 Gb/s per lane. This specification is validated across the industrial temperature range and enables compliance with 100G Ethernet KR4, OTU4, and CPRI/eCPRI protocols. The XCVU7P-2FLVA2104I includes 48 such transceiver lanes, configurable in various protocols and lane widths.

Does the XCVU7P-2FLVA2104I support partial reconfiguration?

Yes, the XCVU7P-2FLVA2104I fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows specific logical regions to be updated dynamically without resetting the entire device. The XCVU7P-2FLVA2104I's configuration architecture enables secure, time-deterministic module swaps critical for radar waveform adaptation and 5G protocol stack updates.

What I/O standards are supported by the XCVU7P-2FLVA2104I?

The XCVU7P-2FLVA2104I supports LVDS, SSTL, HSTL, MIPI D-PHY, and differential signaling standards across its 96 I/O banks. Voltage levels range from 1.2 V to 1.8 V per bank, enabling direct interfacing with high-speed ADCs, DDR4 memory, and optical module drivers. Each bank's VCCO and reference pins define its electrical behavior, and the XCVU7P-2FLVA2104I enforces strict bank-level isolation rules.

Is AES-256 bitstream encryption available on the XCVU7P-2FLVA2104I?

Yes, the XCVU7P-2FLVA2104I includes hardware-accelerated AES-256 bitstream encryption with HMAC authentication. This feature protects intellectual property and prevents unauthorized configuration. Keys are stored in on-chip eFUSE or external secure memory, and the XCVU7P-2FLVA2104I validates bitstream integrity before loading, rejecting tampered or corrupted images.

What is the thermal design power (TDP) range for the XCVU7P-2FLVA2104I?

The XCVU7P-2FLVA2104I has a typical thermal design power ranging from 22 W (minimal configuration) to 48 W (fully utilized logic, DSP, and transceivers). Its FLVA2104 package supports thermal vias and heat spreader integration, and the XCVU7P-2FLVA2104I's thermal sensor monitors junction temperature in real time for dynamic throttling or fan control.