AMD XCVU7P-2FLVB2104E
- Part No.:
- XCVU7P-2FLVB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-2FLVB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,986
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU7P-2FLVB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 13,248 DSP slices, and 96.4 Mb of block RAM; it supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces for advanced acceleration in data center and HPC applications.
For engineers reviewing the XCVU7P-2FLVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (24x 25.78 Gb/s), I/O voltage support (0.35–1.8 V), thermal design power (TDP) of 55 W, and FLVB2104 flip-chip BGA package with 2104 pins.
Technical Context
The XCVU7P-2FLVB2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-fast transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic system adaptation.
Configuration is performed via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication ensure secure boot. The device targets latency-critical compute offload and real-time signal processing where deterministic timing closure and high I/O bandwidth are required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - Enables large-scale RTL implementations including multi-core accelerators and full-stack protocol stacks. |
| DSP Slices | 13,248 - Supports concurrent 27×18-bit multiply-accumulate operations at >1 THz effective throughput for AI inference kernels. |
| Block RAM | 96.4 Mb - Provides on-die memory for frame buffering, lookup tables, and pipeline staging without external DRAM latency. |
| Transceivers | 24 × 25.78 Gb/s - Delivers 618.7 Gb/s aggregate serial bandwidth for 100G/200G optical interconnect or NVMe-oF fabric. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - Enables direct interfacing to image sensors, memory controllers, and high-speed serdes without level-shifting. |
| TDP | 55 W - Defines active cooling requirements and PCB copper weight for thermal vias and heatsink mounting. |
Pinout & Package
Package: Flip-chip BGA, 2104-pin FLVB2104 footprint (35 mm × 35 mm, 0.8 mm pitch), RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires low-noise regulation and local decoupling near each power ball group. |
| VCCAUX | Auxiliary supply | Provides 1.8 V to configuration logic, PCIe hard IP, and transceiver reference circuits. |
| MGTAVCC | Transceiver analog supply | Delivers clean 0.92 V to high-speed SerDes analog front-end; isolated from digital supplies. |
| IO_LxYy_YY | Configurable I/O bank | Supports per-bank voltage selection (0.35–1.8 V); each bank independently configurable for interface compatibility. |
| CLK_IN | Dedicated clock input | Accepts differential LVDS or single-ended CMOS clocks up to 1.2 GHz for global clock distribution network. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort by eliminating soft PCIe controller synthesis; guarantees compliance and timing closure. |
| 25.78 Gb/s Transceivers | Enables native 100G Ethernet (4×25G) or 200G InfiniBand without gearbox logic or retimers. |
| UltraScale+ Memory Controller | Supports DDR4-2400 with ECC, achieving 38.4 GB/s peak bandwidth for memory-bound workloads. |
| Secure Boot with AES-HMAC | Prevents unauthorized bitstream loading and ensures runtime integrity verification during configuration. |
Applications
| Data Center Acceleration | HPC Compute Offload |
|---|---|
Use Scenario: Real-time video transcoding and AI inference serving in cloud infrastructure. IC Role / Device Role / Timing Role: Programmable accelerator executing custom kernels with deterministic latency under 10 µs. Use Value: 24×25G transceivers enable direct 100G NIC attachment; 13,248 DSP slices deliver >20 TOPS INT8 throughput. | Use Scenario: FPGA-accelerated molecular dynamics simulation on GPU clusters. IC Role / Device Role / Timing Role: Co-processor managing parallelized force calculations and memory-intensive neighbor lists. Use Value: 96.4 Mb block RAM eliminates off-chip DRAM access bottlenecks; PCIe Gen4 x16 provides 16 GT/s host interface bandwidth. |
| Radar Signal Processing | 5G Baseband Unit |
Use Scenario: Phased-array radar beamforming and pulse-Doppler processing in airborne systems. IC Role / Device Role / Timing Role: Real-time digital frontend handling ADC/DAC interface, FFT, and CFAR detection. Use Value: 2,586K logic cells implement multi-channel FFT engines; LVDS I/O supports 1 GSPS ADC interfacing. | Use Scenario: Massive MIMO precoding and channel estimation in 5G gNodeB baseband units. IC Role / Device Role / Timing Role: Hardware accelerator for Layer 1 PHY processing including LDPC decoding and OFDM modulation. Use Value: 25.78 Gb/s transceivers connect directly to Fronthaul eCPRI links; hardened 100G Ethernet MAC enables backhaul integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | Higher speed grade (-2 vs -2), extended temperature range (-40°C to +100°C), 3,372K logic cells, 16,320 DSP slices. | Targeted at aerospace and defense deployments requiring industrial temp operation and higher gate count. | Select when additional logic capacity and extended thermal margin are required; same FLGB2104 package but different thermal lid specification. |
| XCVU13P-2FLGB2104E | 3,720K logic cells, 17,280 DSP slices, 122.9 Mb BRAM, same speed grade (-2) and commercial temp range. | Suitable for next-generation AI training accelerators needing larger on-die memory and compute density. | Choose for scaling beyond XCVU7P capacity while retaining compatible pinout and I/O voltage support. |
Compared with XCVU7P-2FLVB2104E, the XCVU9P-2FLGB2104I offers wider temperature tolerance and higher logic density for ruggedized systems, while the XCVU13P-2FLGB2104E delivers greater BRAM and DSP resources for memory- and compute-bound AI workloads-both retain PCIe Gen4 and 25G transceiver compatibility.
Availability
XCVU7P-2FLVB2104E is available at Aetrix Electronics and suitable for data center acceleration, HPC compute offload, and 5G infrastructure requiring stable component supply across multi-year production cycles.
Supply support for XCVU7P-2FLVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client platforms.
The Virtex UltraScale+ family was designed for high-throughput, low-latency hardware acceleration in infrastructure-class applications including cloud networking, radar, and wireless baseband.
FAQ
What is the maximum supported transceiver data rate for XCVU7P-2FLVB2104E?
The XCVU7P-2FLVB2104E supports transceivers operating at up to 25.78 Gb/s per lane. This enables native 100G Ethernet (4×25G), PCIe Gen4, and CPRI/eCPRI fronthaul interfaces. All 24 transceiver quads are rated for this speed grade under commercial temperature conditions, and the device includes built-in PRBS generators and error detectors for link validation.
Does XCVU7P-2FLVB2104E include hardened PCIe Gen4 IP?
Yes, the XCVU7P-2FLVB2104E integrates hardened PCIe Gen4 x16 root port and endpoint IP blocks. These are fully compliant with PCI-SIG specifications, support ASPM and LTR, and require no soft logic implementation. Configuration is managed through dedicated AXI4-Lite registers, and the IP supports both 128b/130b encoding and automatic equalization tuning.
What I/O standards does XCVU7P-2FLVB2104E support?
XCVU7P-2FLVB2104E supports LVDS, MIPI D-PHY, SSTL-12/15/18, HSTL-I/II, and differential signaling standards including TMDS and RSDS. Each of its 24 I/O banks is independently configurable for voltage levels between 0.35 V and 1.8 V, enabling direct connection to DDR4 memory, image sensors, and high-speed serial interfaces without external level shifters.
Is XCVU7P-2FLVB2104E pin-compatible with other Virtex UltraScale+ devices?
No, XCVU7P-2FLVB2104E uses the FLVB2104 package, which is not pin-compatible with FLGA2577 or FLGB2104 variants. While I/O banking structure and signal naming follow UltraScale+ conventions, physical pin assignments differ across packages. Migration to XCVU9P or XCVU13P requires PCB redesign due to distinct ball maps and thermal lid mechanical interfaces.
What configuration modes are supported by XCVU7P-2FLVB2104E?
XCVU7P-2FLVB2104E supports master SPI, slave SPI, BPI, JTAG, and SelectMAP configuration modes. Quad-SPI mode allows fast bitstream loading from serial flash; JTAG is used for debugging and boundary-scan testing. Secure configuration options include AES-256 bitstream encryption and HMAC-based authentication, enforced during every power-on or reconfiguration cycle.
XCVU7P-2FLVB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-2FLVB2104E FAQ
1.How can I place an order for XCVU7P-2FLVB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-2FLVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-2FLVB2104E reliable?
The price and inventory of XCVU7P-2FLVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-2FLVB2104E is usually 5 days.
3.What payment methods are accepted for XCVU7P-2FLVB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-2FLVB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-2FLVB2104E?
XCVU7P-2FLVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-2FLVB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-2FLVB2104E?
For technical support, including XCVU7P-2FLVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-2FLVB2104E requirements.
6.How does Aetrix verify that XCVU7P-2FLVB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU7P-2FLVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-2FLVB2104E meets industry standards.
7.What is the process for return or replacement of XCVU7P-2FLVB2104E?
All XCVU7P-2FLVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-2FLVB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-2FLVB2104E part is unused and in its original packaging.
Return procedure for XCVU7P-2FLVB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU7P-2FLVB2104E Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
