AMD XCVU7P-2FLVB2104I
- Part No.:
- XCVU7P-2FLVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-2FLVB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,277
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Product details
Overview
XCVU7P-2FLVB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 13,920 DSP slices, and 96.2 Gb/s GTY transceiver bandwidth. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, deployed in AI acceleration and high-throughput data center compute blades.
For engineers reviewing the XCVU7P-2FLVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.8 V / 1.2 V), thermal design power (TDP = 55 W), and package-specific I/O bank configuration for high-speed SerDes routing.
Technical Context
The XCVU7P-2FLVB2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4 PHY), and multi-rate GTY transceivers operating from 0.5 to 32.75 Gb/s. It supports AXI4-Stream and AXI4-Lite interfaces for system-level interconnect.
Configuration is performed via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device targets partial reconfiguration and time-critical deterministic latency paths in real-time networking and hardware-accelerated inference pipelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 – determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 13,920 – enables parallel multiply-accumulate operations for matrix math in AI workloads |
| GTY Transceivers | 40 lanes @ up to 32.75 Gb/s – supports 100G Ethernet, CPRI, and high-speed backplane links |
| Memory Interface | DDR4-2400 controller with 16 banks – delivers 128 GB/s peak memory bandwidth |
| I/O Standards | Supports LVDS, SSTL, HSTL, MIPI at 1.8 V / 1.2 V – ensures compatibility with diverse peripheral signaling |
| TDP | 55 W – defines thermal envelope for heatsink and airflow design in dense compute modules |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced lid, and 35 × 35 mm body size.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 0 | Configurable as GPIO, SDIO, UART, SPI, or I²C; voltage-referenced to VCCO_0 |
| GTYP0_Q0_CLK[0:1] | GTY Transceiver Reference Clock Input | Differential pair driving PLL reference for lanes 0–7; requires 100 Ω termination |
| VRP/VRN | Reference Voltage Pins | Provide precision reference for differential I/O standards (e.g., LVDS, MIPI) |
| VCCINT | Core Power Supply | 1.0 V ±3% supply for FPGA fabric and CLB logic; requires low-noise regulation |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating bitstream load success or failure |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Endpoint | Reduces RTL integration effort and guarantees sub-100 ns transaction latency without soft IP overhead |
| 100G Ethernet MAC + RS-FEC | Enables line-rate packet processing with forward error correction for optical transport compliance |
| AES-256 + HMAC-SHA256 Bitstream Encryption | Prevents reverse engineering and unauthorized configuration on untrusted platforms |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during operation for multi-function time-sliced workloads |
| UltraScale+ Memory Controller IP | Provides calibrated DDR4-2400 interface with built-in training and error detection (ECC optional) |
Applications
| AI Inference Accelerator | 5G Radio Unit (RU) |
|---|---|
Use Scenario: Real-time low-latency inference on video streams in edge servers. IC Role / Device Role / Timing Role: Configurable accelerator fabric executing quantized CNN kernels with direct PCIe Gen4 host interface. Use Value: Delivers >20 TOPS/W efficiency using DSP-rich architecture and memory bandwidth-optimized DDR4 controller. | Use Scenario: Massive MIMO baseband processing in open RAN compliant radio units. IC Role / Device Role / Timing Role: Baseband processor implementing OFDM modulation/demodulation and layer-1 PHY functions. Use Value: GTY transceivers interface directly to RFICs at 24.33 Gb/s; hardened 100G Ethernet handles fronthaul traffic. |
| Data Center SmartNIC | High-Frequency Trading Engine |
Use Scenario: Offloading TLS encryption, packet filtering, and RDMA acceleration in cloud infrastructure. IC Role / Device Role / Timing Role: PCIe-attached co-processor with deterministic sub-microsecond latency path from host CPU. Use Value: Hardened PCIe Gen4 x16 and AXI4-Stream interfaces eliminate protocol translation delay in critical data paths. | Use Scenario: Ultra-low-latency order matching and market data parsing in financial exchanges. IC Role / Device Role / Timing Role: Deterministic timing engine synchronizing to PTP grandmaster clocks with <5 ns jitter. Use Value: GTY transceivers lock to 10 MHz OCXO references; fabric timing closure supports <8 ns clock-to-out. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | Higher logic density (3,324K LC), 20% more DSP slices, same package footprint | Better suited for larger AI models requiring >2.8M LC; higher TDP (65 W) | Select when additional logic resources are required without changing PCB layout |
| XCVU5P-2FLVB2104I | Fewer GTY lanes (32 vs 40), reduced DSP count (10,320), identical I/O and package | Targeted at cost-sensitive 25G/50G systems where full 100G bandwidth is not needed | Choose for lower-power, lower-bandwidth deployments with identical board footprint |
Compared with XCVU9P-2FLGB2104I and XCVU5P-2FLVB2104I, the XCVU7P-2FLVB2104I balances transceiver count, DSP capacity, and thermal envelope for mid-tier AI and 100G networking-enabling optimal BOM cost without over-provisioning logic or power.
Availability
XCVU7P-2FLVB2104I is available at Aetrix Electronics and suitable for AI inference accelerators, 5G radio units, and data center SmartNICs requiring stable component supply across multi-year production cycles.
Supply support for XCVU7P-2FLVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI processors for data center, communications, and embedded markets.
The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for AI acceleration, 5G infrastructure, and high-performance computing-designed to replace ASICs in evolving workloads.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCVU7P-2FLVB2104I?
The XCVU7P-2FLVB2104I supports GTY transceiver data rates up to 32.75 Gb/s per lane. This capability enables implementation of 100G Ethernet (4×25G or 2×50G), CPRI eCPRI, and high-speed chip-to-chip interfaces. The XCVU7P-2FLVB2104I achieves this using adaptive equalization and precise clock recovery circuits integrated into each GTY block.
Does XCVU7P-2FLVB2104I support partial reconfiguration?
Yes, the XCVU7P-2FLVB2104I fully supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logic modules while the rest of the design remains operational-critical for time-sliced workloads like multi-standard wireless basebands. The XCVU7P-2FLVB2104I includes dedicated configuration logic and secure bitstream partitioning to ensure isolation and integrity during runtime updates.
What memory interfaces are natively supported by XCVU7P-2FLVB2104I?
The XCVU7P-2FLVB2104I integrates a hardened DDR4 memory controller supporting up to DDR4-2400 with 16 banks and ECC capability. It also supports LPDDR4 and RLDRAM3 via soft IP or external PHYs. The XCVU7P-2FLVB2104I's memory controller includes calibration logic, write leveling, and read leveling to ensure reliable operation across process, voltage, and temperature variations.
Is XCVU7P-2FLVB2104I pin-compatible with other Virtex UltraScale+ devices in the FLVB2104 package?
Yes, the XCVU7P-2FLVB2104I shares the same 2104-pin FCBGA package footprint and I/O bank assignment with XCVU5P-2FLVB2104I and XCVU9P-2FLGB2104I. However, GTY transceiver placement and power delivery requirements differ between variants. The XCVU7P-2FLVB2104I maintains consistent MIO, HP, and HR bank pinouts, enabling mechanical and layout reuse across the FLVB2104 family.
What security features are implemented in XCVU7P-2FLVB2104I?
The XCVU7P-2FLVB2104I includes AES-256 bitstream encryption, HMAC-SHA256 authentication, and tamper-resistant configuration monitoring. Secure boot ensures only signed bitstreams execute, and debug access can be permanently disabled. These protections are enforced in hardware and apply to both full and partial reconfiguration of the XCVU7P-2FLVB2104I, meeting DO-254 and FIPS 140-2 Level 3 requirements.
XCVU7P-2FLVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-2FLVB2104I FAQ
1.How can I place an order for XCVU7P-2FLVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-2FLVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-2FLVB2104I reliable?
The price and inventory of XCVU7P-2FLVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-2FLVB2104I is usually 5 days.
3.What payment methods are accepted for XCVU7P-2FLVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-2FLVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-2FLVB2104I?
XCVU7P-2FLVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-2FLVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-2FLVB2104I?
For technical support, including XCVU7P-2FLVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-2FLVB2104I requirements.
6.How does Aetrix verify that XCVU7P-2FLVB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU7P-2FLVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-2FLVB2104I meets industry standards.
7.What is the process for return or replacement of XCVU7P-2FLVB2104I?
All XCVU7P-2FLVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-2FLVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-2FLVB2104I part is unused and in its original packaging.
Return procedure for XCVU7P-2FLVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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