AMD XCVU7P-2FLVC2104E

Overview

XCVU7P-2FLVC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 84.8 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It serves as the system-level programmable logic fabric in high-bandwidth data center accelerators and radar signal processors.

For engineers reviewing the XCVU7P-2FLVC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, I/O voltage flexibility (0.6–1.8 V), and thermal design power (TDP) envelope for air-cooled rack deployments.

Technical Context

The XCVU7P-2FLVC2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA engines), and ultra-fast serial transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Its FLVC2104 package provides 920 I/O pins with selectable bank voltages, configurable I/O standards (LVDS, SSTL, HSTL), and dedicated clock routing networks optimized for deterministic timing closure in multi-gigabit SerDes applications.

Key Specifications

Pinout & Package

Package: FLVC2104 - 2104-ball Fine-Pitch Flip-Chip BGA with 0.8 mm pitch, 35 mm × 35 mm body, and thermal lid for enhanced heat dissipation in high-power FPGA applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU9P-2FLGB2104I and XCKU15P-2FLVD1517I, the XCVU7P-2FLVC2104E delivers optimal balance of transceiver performance, logic density, and thermal efficiency for air-cooled 100G+ accelerator cards-avoiding overdesign while meeting strict 55 W TDP limits.

Availability

XCVU7P-2FLVC2104E is available at Aetrix Electronics and suitable for data center accelerators, 5G infrastructure equipment, and aerospace radar systems requiring stable component supply across multi-year production cycles.

Supply support for XCVU7P-2FLVC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through its FPGA, adaptive SoC, and CPU/GPU product lines.

The Virtex UltraScale+ family targets high-throughput, low-latency applications including AI inference acceleration, 5G baseband processing, and real-time radar signal analysis.

FAQ

What is the maximum supported DDR4 data rate for XCVU7P-2FLVC2104E?

The XCVU7P-2FLVC2104E supports DDR4-2400 (1200 MHz clock, 2400 MT/s data rate) with full JEDEC compliance, including write leveling, read leveling, and ZQ calibration. This enables direct connection to standard server-grade DDR4 DIMMs without external memory controllers. The XCVU7P-2FLVC2104E implements hardened DDR4 PHY with on-die termination and dynamic impedance control for signal integrity across 32-bit wide interfaces.

Does XCVU7P-2FLVC2104E support PCIe Gen4 x16 in root complex mode?

Yes, the XCVU7P-2FLVC2104E integrates a hardened PCIe Gen4 root complex supporting x16 lane width, full ASPM L0s/L1 power states, and ACS (Access Control Services). It complies with PCI-SIG v4.0 specification and passes compliance testing at 16 GT/s per lane. The XCVU7P-2FLVC2104E also supports endpoint mode and switch configurations via configuration space reprogramming.

What thermal solution is recommended for XCVU7P-2FLVC2104E in continuous 55 W operation?

A 35 mm × 35 mm copper-core heatsink with ≥0.15 °C/W thermal resistance and forced airflow of ≥200 LFPM is recommended for sustained 55 W operation of the XCVU7P-2FLVC2104E. The FLVC2104 package includes a soldered thermal lid compatible with standard vapor chamber attachments. Thermal simulation data for the XCVU7P-2FLVC2104E is provided in UG578 v1.14, Table 3-12.

Can XCVU7P-2FLVC2104E perform partial reconfiguration while maintaining active transceiver links?

Yes, the XCVU7P-2FLVC2104E supports concurrent partial reconfiguration and live transceiver operation. Critical SerDes blocks (including PLLs, CDRs, and PCS layers) reside outside reconfigurable partitions and retain lock during bitstream reload. This capability is validated in XAPP1312 for 25.8 Gb/s PAM4 links operating under continuous traffic during region swap. The XCVU7P-2FLVC2104E requires proper floorplanning and use of the ICAP interface with CRC-protected configuration frames.

What I/O standards are supported on HR I/O banks of XCVU7P-2FLVC2104E?

The HR I/O banks of the XCVU7P-2FLVC2104E support LVCMOS, LVTTL, SSTL, HSTL, POD, and differential standards including LVDS, BLVDS, RSDS, and TMDS across 0.6–1.8 V VCCO range. Each bank is independently configurable, and DCI (Digitally Controlled Impedance) supports series and parallel termination for impedance matching. The XCVU7P-2FLVC2104E documentation specifies 24 distinct I/O standards with precise timing models in DS923.