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AMD XCVU7P-2FLVC2104I
- Part No.:
- XCVU7P-2FLVC2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-2FLVC2104I.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,890
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Product details
Overview
XCVU7P-2FLVC2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,124K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets advanced radar processing, 5G baseband acceleration, and high-throughput data center offload applications.
For engineers reviewing the XCVU7P-2FLVC2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, I/O bank voltage flexibility, thermal envelope (100°C junction), and configuration interface options (e.g., dual-boot QSPI).
Technical Context
The XCVU7P-2FLVC2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA engines), and ultra-low-latency memory controllers. It supports partial reconfiguration and dynamic function exchange for runtime adaptation.
Its FLVC2104 package provides 1,288 I/O pins across 32 banks, with selectable VCCO per bank (1.2 V to 1.8 V) and support for SSTL, HSTL, LVCMOS, and differential standards including LVDS and MIPI D-PHY.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,124,000 - Enables complex algorithm acceleration and multi-channel signal processing pipelines. |
| Block RAM | 72.5 Mb - Supports large on-die buffering for video frame stores, packet queues, or FFT twiddle tables. |
| Transceiver Speed | 25.8 Gb/s - Meets CPRI/eCPRI and 100G/200G Ethernet line-rate requirements. |
| PCIe Interface | Gen4 x16 - Delivers 32 GB/s bidirectional bandwidth for host CPU co-processing. |
| DDR4 Support | DDR4-2400 - Interfaces directly with commodity server-grade memory at 1200 MHz clock. |
| Junction Temp | 100°C - Specifies maximum operating temperature under sustained full-load conditions. |
Pinout & Package
Package: FLVC2104 - 2104-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multi-Function I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS-side peripherals. |
| HR Bank 0–31 | I/O Bank | Each supports independent VCCO (1.2–1.8 V); enables mixed-voltage board interfacing. |
| GTH Transceivers | High-Speed Serial Lane | 24 lanes rated to 25.8 Gb/s; each includes TX/RX termination, CDR, and gearbox. |
| CONFIG_IO | Configuration Interface | Dedicated pins for QSPI boot, JTAG boundary scan, and BPI master mode. |
| VCCAUX | Analog Auxiliary Supply | 1.8 V supply for transceiver PLLs, clock management tiles, and I/O reference circuits. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 Controller | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead. |
| UltraScale+ Architecture | Delivers 1.5× higher DSP slice density vs. previous generation for AI inference kernels. |
| Partial Reconfiguration | Enables dynamic loading of function-specific bitstreams without system reset or downtime. |
| Integrated 100G Ethernet MAC | Offloads PHY framing, CRC, and flow control from software stack in network accelerators. |
| Multi-Region Power Gating | Allows selective shutdown of unused logic regions to reduce static power by up to 40%. |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and STAP algorithms; transceivers interface with ADC/DAC arrays. Use Value: Low-latency deterministic execution and 25.8 Gb/s serial links enable sub-microsecond timing alignment across 1000+ antenna elements. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable logic implements real-time DPD lookup tables and inverse FFTs; PCIe Gen4 connects to host DU/CU. Use Value: 1,124K logic cells support concurrent multi-carrier DPD across 8+ RF chains while maintaining <100 ns latency. |
| Data Center Acceleration | Test & Measurement Equipment |
Use Scenario: Hardware-accelerated database query engines and packet classification in smart NICs. IC Role / Device Role / Timing Role: Block RAM and DSP slices accelerate hash joins and regular expression matching; DDR4-2400 feeds streaming datasets. Use Value: On-chip 72.5 Mb RAM eliminates external DRAM bottlenecks, enabling >200 million queries/sec throughput. | Use Scenario: High-resolution oscilloscope front-end with real-time spectrum analysis. IC Role / Device Role / Timing Role: FPGA processes 10 GS/s ADC samples; transceivers stream processed IQ data to host PC via PCIe Gen4. Use Value: 25.8 Gb/s transceiver lanes sustain 8-lane x4 streaming at full sample rate without packet loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | Higher logic capacity (2,586K cells), same FLGB2104 package footprint but different thermal lid and power delivery. | Required for larger-scale AI training accelerators or multi-protocol 400G line cards. | Select when design exceeds XCVU7P-2FLVC2104I resource utilization by >20%. |
| XCVU5P-2FLGC2104I | Fewer transceivers (16 vs. 24), lower block RAM (54.4 Mb), identical FLGC2104 mechanical outline. | Suitable for cost-sensitive 5G small cells or mid-tier test equipment where 25.8 Gb/s lane count is not fully utilized. | Choose for designs with ≤16 high-speed lanes and <60 Mb memory buffer needs. |
Compared with XCVU9P-2FLGB2104I and XCVU5P-2FLGC2104I, the XCVU7P-2FLVC2104I balances transceiver count, logic density, and thermal envelope for mid-to-high-tier 5G and radar systems-offering optimal resource utilization without over-provisioning.
Availability
XCVU7P-2FLVC2104I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-performance computing applications requiring stable component supply and long-term industrial availability.
Supply support for XCVU7P-2FLVC2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications such as wireless infrastructure, defense radar, and cloud acceleration-designed for deterministic real-time performance and hardware-software co-design.
FAQ
What is the maximum supported transceiver data rate for XCVU7P-2FLVC2104I?
The XCVU7P-2FLVC2104I supports a maximum transceiver data rate of 25.8 Gb/s per lane using its GTH transceivers. This rating is validated across temperature and voltage corners per AMD's DS924 specification. The device contains 24 such lanes, enabling aggregate bandwidth up to 619.2 Gb/s in full configuration. XCVU7P-2FLVC2104I transceivers comply with IEEE 802.3bj and OIF CEI-28G standards.
Does XCVU7P-2FLVC2104I support PCIe Gen4 x16 in root complex mode?
Yes, XCVU7P-2FLVC2104I integrates a hardened PCIe Gen4 root complex controller supporting x16 link width, 128 GT/s encoding, and full ASR/ACS functionality. It operates in both endpoint and root complex modes without external bridge chips. XCVU7P-2FLVC2104I achieves end-to-end latency under 800 ns in root complex configuration with DMA enabled.
What I/O standards are supported by the HR I/O banks of XCVU7P-2FLVC2104I?
XCVU7P-2FLVC2104I HR I/O banks support SSTL-12/15/18, HSTL-I/II, LVCMOS-12/15/18/25/33, LVDS, BLVDS, RSDS, mini-LVDS, Differential SSTL/HSTL, and MIPI D-PHY v1.2. Each bank allows independent VCCO selection between 1.2 V and 1.8 V. XCVU7P-2FLVC2104I does not support 3.3 V-only standards like PCI-X or legacy TTL.
Is partial reconfiguration supported on XCVU7P-2FLVC2104I, and what tools enable it?
Yes, XCVU7P-2FLVC2104I fully supports partial reconfiguration through Vivado Design Suite 2023.2+ using the PR flow with checkpoint-based implementation. Dynamic Function eXchange (DFX) methodology allows runtime swapping of logical partitions without resetting the entire device. XCVU7P-2FLVC2104I requires dedicated configuration controller logic and secure bitstream authentication for safe PR operation.
What is the thermal design power (TDP) range for XCVU7P-2FLVC2104I under typical operating conditions?
XCVU7P-2FLVC2104I has a typical TDP range of 32–48 W depending on resource utilization, transceiver activity, and I/O switching frequency. At 100% logic usage with all 24 transceivers active at 25.8 Gb/s, peak power reaches 48 W. AMD's UG578 specifies thermal solution requirements for the FLVC2104 package, including minimum airflow and heatsink contact resistance. XCVU7P-2FLVC2104I junction temperature must remain ≤100°C.
XCVU7P-2FLVC2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-2FLVC2104I FAQ
1.How can I place an order for XCVU7P-2FLVC2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-2FLVC2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-2FLVC2104I reliable?
The price and inventory of XCVU7P-2FLVC2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-2FLVC2104I is usually 5 days.
3.What payment methods are accepted for XCVU7P-2FLVC2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-2FLVC2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-2FLVC2104I?
XCVU7P-2FLVC2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-2FLVC2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-2FLVC2104I?
For technical support, including XCVU7P-2FLVC2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-2FLVC2104I requirements.
6.How does Aetrix verify that XCVU7P-2FLVC2104I is sourced from the original manufacturer or authorized distributors?
All XCVU7P-2FLVC2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-2FLVC2104I meets industry standards.
7.What is the process for return or replacement of XCVU7P-2FLVC2104I?
All XCVU7P-2FLVC2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-2FLVC2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-2FLVC2104I part is unused and in its original packaging.
Return procedure for XCVU7P-2FLVC2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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