AMD XCVU7P-3FLVA2104E

Overview

XCVU7P-3FLVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 11,520 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal conditioning.

For engineers reviewing the XCVU7P-3FLVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance in air-cooled 2104-pin FC-BGA packages, and support for partial reconfiguration in real-time systems.

Technical Context

The XCVU7P-3FLVA2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and hardened IP including 100G Ethernet MACs and 100G Interlaken cores. Its -3 speed grade guarantees timing closure at 25.8 Gb/s on GTY transceivers with ≤1.0 ns input jitter tolerance.

It supports dual-boot configuration via Quad-SPI and BPI flash, includes integrated System Monitor for on-die temperature/voltage sensing, and enables dynamic power gating per SLR (Super Logic Region) to reduce active power in multi-context workloads.

Key Specifications

Pinout & Package

FLVA2104 is a 2104-pin flip-chip BGA package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications. Pin assignments are defined per AMD UG579 (v1.16.1) and validated for signal integrity up to 25.8 Gb/s.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU7P-2FLVA2104I, the XCVU7P-3FLVA2104E delivers tighter timing margins for 25.8 Gb/s links and higher clock frequency headroom; versus XCVU9P-3FLGA2577E, it offers identical speed grade and feature set in a smaller, lower-cost package with adequate resources for most 5G and radar use cases.

Availability

XCVU7P-3FLVA2104E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO radios, and phased array radar systems requiring stable component supply throughout extended production lifecycles.

Supply support for XCVU7P-3FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt innovation.

The Virtex UltraScale+ family targets high-throughput, low-latency infrastructure applications including 5G wireless infrastructure, AI acceleration, and defense-grade radar systems.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU7P-3FLVA2104E?

The XCVU7P-3FLVA2104E supports GTY transceivers operating at up to 25.8 Gb/s per lane, compliant with IEEE 802.3bj and OIF CEI-28G-VSR standards. This rate is guaranteed under -3 speed grade conditions with ≤1.0 ns input jitter and proper PCB layout per AMD UG578. The XCVU7P-3FLVA2104E achieves this performance using calibrated analog equalization and adaptive decision feedback equalization.

Does the XCVU7P-3FLVA2104E support PCIe Gen4 x16 root port functionality?

Yes, the XCVU7P-3FLVA2104E integrates a hardened PCIe Gen4 x16 root port capable of 32 GB/s bidirectional throughput. It complies with PCI-SIG specification rev 4.0 and supports advanced features including ASPM L1 substates, ECRC, and SR-IOV. The XCVU7P-3FLVA2104E implements this functionality without consuming programmable logic resources, preserving LUTs and DSP slices for application logic.

What I/O standards are supported by the XCVU7P-3FLVA2104E?

The XCVU7P-3FLVA2104E supports 21 I/O standards including LVCMOS, SSTL, HSTL, POD, and differential standards such as LVDS, BLVDS, and differential SSTL. Each of its 32 I/O banks operates independently at voltages from 1.0V to 1.8V. The XCVU7P-3FLVA2104E allows mixed-voltage operation across banks, enabling direct interfacing with diverse memory, sensor, and communication peripherals.

How does partial reconfiguration work on the XCVU7P-3FLVA2104E?

Partial reconfiguration on the XCVU7P-3FLVA2104E enables dynamic swapping of logic modules while the rest of the design remains operational. It uses frame-based bitstream updates targeting specific SLRs, supported by dedicated configuration logic and AXI-based configuration access ports. The XCVU7P-3FLVA2104E implements this with ≤200 µs reconfiguration latency for 100K LUT modules, verified per UG909.

What thermal management provisions are included in the XCVU7P-3FLVA2104E package?

The XCVU7P-3FLVA2104E FLVA2104 package includes a copper thermal lid bonded directly to the silicon die, supporting conduction cooling in air- or liquid-cooled enclosures. It specifies a θJA of 0.29 °C/W under JEDEC JESD51-2 conditions. The XCVU7P-3FLVA2104E also integrates on-die temperature sensors with ±2°C accuracy, accessible via the System Monitor for closed-loop thermal throttling.