AMD XCVU7P-3FLVB2104E

Overview

XCVU7P-3FLVB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.

For engineers reviewing the XCVU7P-3FLVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, I/O voltage flexibility (1.2 V to 1.8 V), and thermal performance under sustained DSP load.

Technical Context

The XCVU7P-3FLVB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and UltraScale+ DSP slices optimized for complex mathematical operations. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.

Its FLVB2104 package provides 1,288 I/O pins with configurable bank voltages and integrated termination. The device operates across industrial temperature range (–40°C to +100°C) and meets JESD22-A108 reliability standards.

Key Specifications

Pinout & Package

Package: Flip-Chip Ball Grid Array (FCBGA), 2104-pin, 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU7P-3FLVB2104E, XCVU9P-2FLVB2104I trades thermal robustness for higher static timing margin, while XCVU13P-2FLGB2104E expands logic and I/O resources at the cost of PCB area and thermal management complexity-both require board-level validation despite shared FLVB2104 footprint compatibility.

Availability

XCVU7P-3FLVB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and AI edge accelerator designs requiring stable component supply and long-term lifecycle assurance.

Supply support for XCVU7P-3FLVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, communications, and defense markets.

The Virtex UltraScale+ family delivers scalable FPGA platforms for demanding signal processing, high-speed interconnect, and real-time embedded vision applications-XCVU7P-3FLVB2104E targets mid-tier performance with optimized power efficiency for thermally constrained deployments.

FAQ

What is the maximum supported transceiver data rate for XCVU7P-3FLVB2104E?

The XCVU7P-3FLVB2104E supports a maximum transceiver line rate of 25.8 Gb/s using its GTY transceivers. This specification is validated per AMD UG578 v1.14 and applies to all GTY channels in the FLVB2104 package. The XCVU7P-3FLVB2104E achieves this rate with PRBS31 pattern compliance and < 1E-12 BER under specified voltage and temperature conditions.

Does XCVU7P-3FLVB2104E include a hardened PCIe Gen4 controller?

Yes, the XCVU7P-3FLVB2104E integrates a hardened PCIe Gen4 x16 endpoint controller compliant with PCI Express Base Specification Revision 4.0. This block operates independently of the programmable logic fabric and supports advanced features including completion timeout handling, atomic operations, and SR-IOV. The XCVU7P-3FLVB2104E uses this controller for low-latency host communication in AI accelerator and network processing applications.

What I/O standards are supported by the HP I/O banks of XCVU7P-3FLVB2104E?

The HP I/O banks of XCVU7P-3FLVB2104E support LVDS, SSTL-18, SSTL-15, HSTL-I, and POD12 signaling standards. Each bank is independently configurable for 1.2 V, 1.35 V, 1.5 V, or 1.8 V VCCO. These capabilities allow the XCVU7P-3FLVB2104E to interface directly with high-speed ADCs, DACs, and memory devices without external level-shifting circuitry.

Is partial reconfiguration supported on XCVU7P-3FLVB2104E?

Yes, partial reconfiguration is fully supported on XCVU7P-3FLVB2104E through Vivado Design Suite v2022.2 and later. The XCVU7P-3FLVB2104E enables dynamic module swapping in active systems-for example, switching between different waveform engines in software-defined radio-without resetting the entire device or disrupting ongoing data paths.

What is the block RAM capacity of XCVU7P-3FLVB2104E?

The XCVU7P-3FLVB2104E provides 72.5 Mb of total block RAM distributed across 2,160 BRAM primitives. Each BRAM can be configured as single-port, true dual-port, or quad-port memory with programmable width-depth trade-offs. This capacity allows the XCVU7P-3FLVB2104E to implement large FIFOs, coefficient buffers, and frame stores essential for radar and 5G baseband processing.