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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCVU7P-3FLVC2104E

Name: XCVU7P-3FLVC2104E
Brand: AMD
SKU: XCVU7P-3FLVC2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCVU7P-3FLVC2104E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU7P-3FLVC2104E.pdf

Description:: IC FPGA 416 I/O 2104FCBGA

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Product details

Overview

XCVU7P-3FLVC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,128K logic cells, 72.5 Mb of block RAM, 100 GTH/GTY transceivers supporting up to 32.75 Gb/s, and integrated hardened PCIe Gen4 x16 controller. It targets high-bandwidth data center acceleration, radar signal processing, and 5G wireless infrastructure.

For engineers reviewing the XCVU7P-3FLVC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage support (0.85–1.8 V), thermal performance in FLVC2104 package, and PCIe Gen4 compliance for accelerator card designs.

Technical Context

The XCVU7P-3FLVC2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), and hardened IP including 100G Ethernet MAC, 100G Interlaken, and DDR4 memory controllers. Its transceivers support PAM4 and NRZ modulation with built-in PRBS generators and error detectors.

This device uses AMD's 16nm FinFET process and supports partial reconfiguration, dynamic function exchange, and AXI4-Stream interfaces for real-time data path adaptation in compute-intensive systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	1,128,000 - determines maximum combinational/sequential logic capacity for custom datapath implementation
Block RAM	72.5 Mb - supports large on-chip buffering for video frame stores or packet buffering in networking
Transceivers	100 × GTH/GTY - enables 100G+ serial connectivity with protocol flexibility across PCIe, Ethernet, and CPRI
Max Transceiver Rate	32.75 Gb/s - meets line-rate requirements for 400G Ethernet FEC and 5G fronthaul interfaces
PCIe Interface	Hardened Gen4 x16 - eliminates soft IP resource overhead and guarantees deterministic latency for host CPU offload
I/O Standards	Supports 0.85–1.8 V - allows direct interfacing with DDR4, LPDDR4, and ASICs without level-shifting

Pinout & Package

The XCVU7P-3FLVC2104E is housed in a 2104-pin Flip-Chip Land Grid Array (FLC) package with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation in air-cooled accelerator modules.

Pin/Terminal	Circuit Role	Design Meaning
VCCINT	Core power supply	Supplies 0.85 V to FPGA fabric; requires low-noise regulation and tight tolerance (±3%)
VCCAUX	Auxiliary power supply	Provides 1.8 V to configuration logic, transceiver PLLs, and I/O banks
MGTAVCC	Transceiver analog supply	Delivers 0.95 V to high-speed serial PHY; sensitive to ripple and must be filtered separately
HR_IO_Lx	High-range I/O bank	Supports 1.8/1.5/1.35/1.2/1.0 V standards; configurable per bank for mixed-voltage interface design
PCIE_CLK_P/N	Dedicated PCIe reference clock input	Accepts 100 MHz differential clock; required for Gen4 link training and compliance

Key Features

Feature	Design Value
Hardened PCIe Gen4 x16	Reduces integration effort and ensures full compliance without consuming LUT resources or introducing timing uncertainty
100G Interlaken core	Enables deterministic, low-latency packet transport between FPGAs or ASICs in multi-chip systems
UltraScale+ DSP slices	Delivers 10.9 TMAC/s peak throughput for real-time FFT, filtering, and beamforming in radar and wireless
Partial reconfiguration	Allows runtime logic updates without system reset-critical for adaptive radio and cloud-based accelerator orchestration
AXI4-Stream interfaces	Standardizes high-throughput data movement between IP blocks, simplifying verification and reuse across projects

Applications

Data Center Acceleration	5G Radio Unit (RU)
Use Scenario: Offloading encryption, compression, and AI inference tasks from CPU in hyperscale servers. IC Role / Device Role / Timing Role: Programmable accelerator with PCIe Gen4 host interface and high-bandwidth DDR4 memory subsystem. Use Value: Achieves 3× higher throughput than CPU-only implementations while maintaining sub-100 ns PCIe transaction latency.	Use Scenario: Real-time massive MIMO precoding and channel estimation in Open RAN base stations. IC Role / Device Role / Timing Role: Baseband processor implementing Layer 1 PHY functions with deterministic timing via hard IP and clock domain crossing controls. Use Value: Supports 64T64R configurations at 100 MHz bandwidth with <1 μs processing latency per slot.
Phased Array Radar	Test & Measurement Equipment
Use Scenario: Digital beamforming and pulse-Doppler processing in airborne surveillance radar systems. IC Role / Device Role / Timing Role: High-speed signal processor with synchronized multi-channel ADC/DAC interfaces and low-jitter clocking. Use Value: Enables simultaneous processing of 128 RF channels with coherent phase alignment across all paths.	Use Scenario: Protocol-aware packet generation and analysis in 400G Ethernet test platforms. IC Role / Device Role / Timing Role: Line-rate traffic generator with 100G Interlaken and 100G Ethernet MAC hard cores. Use Value: Validates switch ASIC behavior under real-world burst patterns and error injection conditions at full 400G line rate.

Data Center Acceleration

5G Radio Unit (RU)

Use Scenario: Offloading encryption, compression, and AI inference tasks from CPU in hyperscale servers.

IC Role / Device Role / Timing Role: Programmable accelerator with PCIe Gen4 host interface and high-bandwidth DDR4 memory subsystem.

Use Value: Achieves 3× higher throughput than CPU-only implementations while maintaining sub-100 ns PCIe transaction latency.

Use Scenario: Real-time massive MIMO precoding and channel estimation in Open RAN base stations.

IC Role / Device Role / Timing Role: Baseband processor implementing Layer 1 PHY functions with deterministic timing via hard IP and clock domain crossing controls.

Use Value: Supports 64T64R configurations at 100 MHz bandwidth with <1 μs processing latency per slot.

Phased Array Radar

Test & Measurement Equipment

Use Scenario: Digital beamforming and pulse-Doppler processing in airborne surveillance radar systems.

IC Role / Device Role / Timing Role: High-speed signal processor with synchronized multi-channel ADC/DAC interfaces and low-jitter clocking.

Use Value: Enables simultaneous processing of 128 RF channels with coherent phase alignment across all paths.

Use Scenario: Protocol-aware packet generation and analysis in 400G Ethernet test platforms.

IC Role / Device Role / Timing Role: Line-rate traffic generator with 100G Interlaken and 100G Ethernet MAC hard cores.

Use Value: Validates switch ASIC behavior under real-world burst patterns and error injection conditions at full 400G line rate.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA accelerator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCVU7P-2FLVC2104I	Lower speed grade (-2 vs -3), reduced max transceiver rate (25.8 Gb/s), lower static power	Suitable for cost-sensitive 100G applications where Gen4 PCIe or 32 Gb/s transceivers are not required	Select when thermal budget or BOM cost constraints outweigh need for highest serial bandwidth
XCVU9P-3FLGA2577E	Larger die (2,028K LC), 2577-pin FC-BGA, higher I/O count (832), increased transceiver count (128)	Targeted at multi-ASIC interconnect and ultra-high-throughput test equipment requiring >100G aggregate I/O	Choose when XCVU7P-3FLVC2104E logic or I/O resources are insufficient for full system integration

Compared with XCVU7P-2FLVC2104I, the XCVU7P-3FLVC2104E delivers higher serial bandwidth and deterministic PCIe Gen4 latency; compared with XCVU9P-3FLGA2577E, it offers better power efficiency and smaller footprint for space-constrained accelerator cards.

Availability

XCVU7P-3FLVC2104E is available at Aetrix Electronics and suitable for data center acceleration, 5G infrastructure, and radar signal processing requiring stable component supply across long production cycles.

Supply support for XCVU7P-3FLVC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.

The Virtex UltraScale+ family was engineered for compute-intensive, high-bandwidth applications demanding hardened interfaces, scalable logic density, and low-latency I/O-especially in 5G, aerospace, and accelerated computing.

FAQ

What is the maximum supported transceiver data rate for XCVU7P-3FLVC2104E?

The XCVU7P-3FLVC2104E supports up to 32.75 Gb/s per transceiver lane using GTY or GTH transceivers in NRZ mode. This enables full compliance with IEEE 802.3bs 400GBASE-KR8 and OIF CEI-11G-LR standards. The XCVU7P-3FLVC2104E achieves this rate with built-in equalization and clock recovery circuits that meet jitter tolerance requirements without external retiming.

Does XCVU7P-3FLVC2104E include a hardened PCIe Gen4 controller?

Yes, the XCVU7P-3FLVC2104E integrates a hardened PCIe Gen4 x16 endpoint/root port controller with full link training, LTSSM, and TLP handling. This eliminates the need for soft IP implementation and guarantees sub-100 ns transaction latency. The XCVU7P-3FLVC2104E also supports ACS, ARI, and SR-IOV features required for virtualized data center environments.

What I/O voltage standards does XCVU7P-3FLVC2104E support?

The XCVU7P-3FLVC2104E supports I/O voltages from 0.85 V to 1.8 V across its HR and HP I/O banks, including LVCMOS, SSTL, HSTL, and differential standards like LVDS and BLVDS. Each bank is independently configurable, enabling mixed-voltage board designs. The XCVU7P-3FLVC2104E's I/O architecture complies with JEDEC JESD79-4 for DDR4 and JESD209-4 for LPDDR4 interfaces.

Is partial reconfiguration supported on XCVU7P-3FLVC2104E?

Yes, the XCVU7P-3FLVC2104E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic swapping of logic regions without resetting the entire device. This capability is validated for use cases such as adaptive radio waveform updates and cloud-based accelerator workload migration. The XCVU7P-3FLVC2104E provides dedicated configuration ports and secure bitstream authentication for safe runtime updates.

What is the total block RAM capacity of XCVU7P-3FLVC2104E?

The XCVU7P-3FLVC2104E provides 72.5 Mb of total block RAM, distributed across 2,880 BRAM primitives (each 36 Kb). This capacity supports large on-chip buffers-for example, storing two full 4K@60fps YUV422 frames or buffering 128 concurrent 100G Ethernet flows. The XCVU7P-3FLVC2104E allows true dual-port access and byte-write enable for flexible memory mapping in streaming applications.

XCVU7P-3FLVC2104E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex® UltraScale+™

Package/Case:: 2104-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 98520

Number of Logic Elements/Cells:: 1724100

Total RAM Bits:: 260812800

Number of I/O:: 416

Number of Gates:: -

Voltage - Supply:: 0.873V ~ 0.927V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 2104-FCBGA (47.5x47.5)

XCVU7P-3FLVC2104E FAQ

1.How can I place an order for XCVU7P-3FLVC2104E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU7P-3FLVC2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU7P-3FLVC2104E reliable?

The price and inventory of XCVU7P-3FLVC2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-3FLVC2104E is usually 5 days.

3.What payment methods are accepted for XCVU7P-3FLVC2104E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-3FLVC2104E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU7P-3FLVC2104E?

XCVU7P-3FLVC2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU7P-3FLVC2104E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU7P-3FLVC2104E?

For technical support, including XCVU7P-3FLVC2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-3FLVC2104E requirements.

6.How does Aetrix verify that XCVU7P-3FLVC2104E is sourced from the original manufacturer or authorized distributors?

All XCVU7P-3FLVC2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-3FLVC2104E meets industry standards.

7.What is the process for return or replacement of XCVU7P-3FLVC2104E?

All XCVU7P-3FLVC2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-3FLVC2104E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU7P-3FLVC2104E part is unused and in its original packaging.

Return procedure for XCVU7P-3FLVC2104E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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