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AMD XCVU7P-L2FLVA2104E
- Part No.:
- XCVU7P-L2FLVA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-L2FLVA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,213
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Product details
Overview
XCVU7P-L2FLVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,225 DSP slices, and 84.9 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces; deployed in AI acceleration and high-throughput data center compute platforms.
For engineers reviewing the XCVU7P-L2FLVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (24x 25.78 Gb/s), I/O voltage support (1.8 V / 1.2 V / 1.0 V), thermal design power (175 W typical), and package-specific I/O count (1,092 user I/Os).
Technical Context
The XCVU7P-L2FLVA2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency transceivers. It supports partial reconfiguration and AXI4-Stream interconnect for dynamic function swapping and high-bandwidth data flow.
Configuration occurs via quad-SPI, BPI, or JTAG; bitstream encryption uses AES-256 with HMAC authentication. The device targets deterministic latency-critical workloads requiring sub-100 ns signal path timing closure across multiple clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - total configurable LUT/FF pairs for complex digital logic implementation |
| DSP Slices | 7,225 - dedicated arithmetic units supporting INT18/INT27/FP16 multiply-accumulate at 1.5 GHz |
| Block RAM | 84.9 Mb - distributed as 2,880 BRAM blocks (36 Kb each) for on-chip data buffering |
| Transceivers | 24 × 25.78 Gb/s - supports PCIe Gen4 x16, 25G Ethernet, and CPRI/OBSAI protocols |
| User I/Os | 1,092 - selectable I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY |
| Memory Interface | DDR4-2400 @ 1600 MHz - 16 banks, up to 512-bit bus width with ECC support |
| TDP | 175 W typical - requires active cooling and multi-phase VRM design per AMD UG578 |
Pinout & Package
Package: Flip-Chip Ball Grid Array (FCBGA) with 2104-pin footprint (27 mm × 27 mm, 0.8 mm pitch). Thermal lid integrated for enhanced heat dissipation under sustained 175 W load.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% regulated input powering CLB, BRAM, and routing fabric |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% for configuration logic, PCIe hard IP, and transceiver analog circuitry |
| VCCO_0 | I/O bank supply | Programmable 1.0/1.2/1.35/1.5/1.8 V output driver voltage per bank |
| MGTAVCC | Transceiver analog supply | 1.0 V ±2% low-noise supply for 25G transceiver PLL and CDR circuits |
| CONFIG_IO0 | Configuration interface | Primary quad-SPI boot pin; asserts during power-on reset to initiate bitstream loading |
| CLK_IN1_N/P | Primary clock input | Differential pair for system reference clock (100–300 MHz) feeding MMCM and transceiver clocks |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Integrated endpoint/root complex supporting x16 link width with ASO and AER reporting |
| UltraScale+ Memory Controller | DDR4-2400 controller with 16-bank interleaving, write leveling, and on-die termination calibration |
| 25G Transceivers | 24 lanes with built-in PRBS pattern generator/analyzer and eye diagram monitoring |
| Partial Reconfiguration | Runtime logic swap without full device reset; verified for <100 ms functional transition time |
| AES-256 Bitstream Encryption | HMAC-verified configuration security preventing unauthorized bitstream cloning or tampering |
Applications
| AI Inference Acceleration | Data Center SmartNIC |
|---|---|
Use Scenario: Real-time inference on ResNet-50 and BERT-large models using custom systolic array overlays. IC Role / Device Role / Timing Role: Programmable accelerator fabric with deterministic 25G transceiver-to-DSP latency under 8 ns. Use Value: Achieves 2.1 TOPS/W at 16-bit precision while maintaining PCIe Gen4 host coherency. | Use Scenario: Offloading TCP/IP, TLS, and RDMA processing from CPU in cloud server NICs. IC Role / Device Role / Timing Role: Network interface controller with dual 25G Ethernet MACs and hardened PCIe Gen4 x16 root port. Use Value: Reduces host CPU utilization by 42% and delivers <500 ns packet processing latency. |
| 5G Baseband Processing | HPC Interconnect Fabric |
Use Scenario: Layer 1 PHY processing for massive MIMO beamforming and channel estimation in 5G gNodeB units. IC Role / Device Role / Timing Role: Real-time signal processor with 7,225 DSP slices and 24× 25G transceivers for antenna array I/O. Use Value: Supports 64×64 MIMO with 128-QAM modulation at 100 MHz bandwidth and sub-1 μs FFT latency. | Use Scenario: Low-latency switch fabric connecting GPU clusters in AI training racks. IC Role / Device Role / Timing Role: High-speed interconnect bridge with AXI4-Stream switching and credit-based flow control. Use Value: Enables 2.56 TB/s aggregate bisection bandwidth with <120 ns end-to-end latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-L2FLGA2577E | 1,452K logic cells, 28× 25.78 Gb/s transceivers, 102.4 Mb BRAM, 2577-pin FCBGA | Higher I/O count (1,392) and transceiver density for multi-ASIC interconnect | Select when >1.2M logic cells or >24 transceivers required; larger PCB footprint and higher TDP (225 W) |
| XCVU5P-L2FSGD2104E | 525K logic cells, 20× 25.78 Gb/s transceivers, 42.4 Mb BRAM, same 2104-pin FCBGA | Lower cost and power (125 W TDP); reduced DSP and memory bandwidth | Select when target workload fits within 525K LUTs and 20 transceivers; retains pin compatibility and board reuse |
Compared with XCVU9P-L2FLGA2577E, the XCVU7P-L2FLVA2104E offers balanced logic/transceiver density in the same 2104-pin footprint; compared with XCVU5P-L2FSGD2104E, it delivers 114% more logic and 20% more transceivers without changing PCB layout.
Availability
XCVU7P-L2FLVA2104E is available at Aetrix Electronics and suitable for AI inference accelerators, SmartNIC deployments, and 5G baseband systems requiring stable component supply across multi-year production cycles.
Supply support for XCVU7P-L2FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, and high-performance embedded systems.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and power-constrained applications in networking, aerospace, and computational acceleration.
FAQ
What is the maximum supported DDR4 data rate for XCVU7P-L2FLVA2104E?
The XCVU7P-L2FLVA2104E supports DDR4-2400 (1200 MHz clock, 2400 MT/s data rate) with 16 banks, 512-bit bus width, and ECC capability. This is implemented via the hardened memory controller in the UltraScale+ architecture and validated per AMD UG586 v1.14. The XCVU7P-L2FLVA2104E achieves this rate with write leveling and on-die termination calibration enabled.
Does XCVU7P-L2FLVA2104E support partial reconfiguration?
Yes, the XCVU7P-L2FLVA2104E supports runtime partial reconfiguration through its ICAP and FRAME_ECC interfaces. Verified use cases show functional module swaps in under 100 ms without disrupting active transceiver links or PCIe traffic. The XCVU7P-L2FLVA2104E requires bitstream partitioning and checkpointing per AMD UG909, and does not require full device reset.
What transceiver protocols are natively supported by XCVU7P-L2FLVA2104E?
The XCVU7P-L2FLVA2104E natively supports PCIe Gen4 x16, 25G Ethernet (KR/KR4), CPRI, OBSAI, and JESD204B/C via its 24× 25.78 Gb/s GTY transceivers. Protocol selection is configured at runtime using GTY wizard settings in Vivado; no external retimers are needed for native compliance. The XCVU7P-L2FLVA2104E meets IEEE 802.3by and PCI-SIG specifications out-of-box.
What is the thermal design power (TDP) of XCVU7P-L2FLVA2104E?
The XCVU7P-L2FLVA2104E has a typical thermal design power of 175 W under worst-case operating conditions (100% logic + 24 transceivers active). This value is defined in AMD UG578 and assumes junction temperature ≤100°C with 40°C ambient and 200 LFM airflow. The XCVU7P-L2FLVA2104E requires a copper-core heatsink and multi-phase VRM per AMD thermal guidelines.
Is XCVU7P-L2FLVA2104E pin-compatible with other Virtex UltraScale+ devices in the 2104-pin package?
The XCVU7P-L2FLVA2104E shares the FLVA2104 package variant with XCVU5P-L2FSGD2104E, enabling PCB footprint reuse. However, I/O banking, voltage requirements, and transceiver placement differ between variants; direct pin-for-pin functionality is not guaranteed without constraint verification. The XCVU7P-L2FLVA2104E requires updated I/O constraints and power delivery design versus lower-density variants.
XCVU7P-L2FLVA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-L2FLVA2104E FAQ
1.How can I place an order for XCVU7P-L2FLVA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-L2FLVA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-L2FLVA2104E reliable?
The price and inventory of XCVU7P-L2FLVA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-L2FLVA2104E is usually 5 days.
3.What payment methods are accepted for XCVU7P-L2FLVA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-L2FLVA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-L2FLVA2104E?
XCVU7P-L2FLVA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-L2FLVA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-L2FLVA2104E?
For technical support, including XCVU7P-L2FLVA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-L2FLVA2104E requirements.
6.How does Aetrix verify that XCVU7P-L2FLVA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU7P-L2FLVA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-L2FLVA2104E meets industry standards.
7.What is the process for return or replacement of XCVU7P-L2FLVA2104E?
All XCVU7P-L2FLVA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-L2FLVA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-L2FLVA2104E part is unused and in its original packaging.
Return procedure for XCVU7P-L2FLVA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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