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AMD XCVU7P-L2FLVB2104E
- Part No.:
- XCVU7P-L2FLVB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-L2FLVB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,016
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Product details
Overview
XCVU7P-L2FLVB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets AI acceleration, 5G baseband processing, and high-end radar signal conditioning in reconfigurable compute platforms.
For engineers reviewing the XCVU7P-L2FLVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (32 GTY), I/O bank voltage flexibility (1.2 V to 1.8 V), and integrated hardened IP for PCIe/DDR4/100G Ethernet.
Technical Context
The XCVU7P-L2FLVB2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (10,920), and hardened subsystems including PCIe Gen4 Root Port/Endpoint, 100G Ethernet MAC, and DDR4 memory controllers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Its FLVB2104 package provides 1,284 total pins with 832 user I/Os across 24 selectable I/O banks, each configurable for LVDS, SSTL, HSTL, or MIPI signaling. The device operates across -40°C to +100°C junction temperature range with dual VCCINT/VCCAUX supply domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - Enables large-scale algorithm partitioning and multi-function integration in single-device systems. |
| Block RAM | 72.5 Mb - Supports deep buffering for video frame stores, packet queues, or FFT coefficient tables. |
| GTY Transceivers | 32 lanes @ 25.8 Gb/s - Delivers full-duplex 800 Gb/s aggregate bandwidth for optical interconnect or backplane applications. |
| PCIe Interface | Gen4 x16 Root/Endpoint - Allows direct CPU coherency via CXL 1.1-compatible root complex or endpoint attachment. |
| DDR4 Support | Up to 2400 MT/s across 4 banks - Enables high-throughput memory access for AI inference engines or baseband symbol processing. |
| I/O Banks | 24 banks, 832 user I/Os - Permits mixed-voltage interface consolidation (e.g., 1.2 V MIPI CSI-2 + 1.8 V LVDS) on one die. |
Pinout & Package
The XCVU7P-L2FLVB2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid. Pin assignment follows AMD's UltraScale+ pinout standard with dedicated configuration, JTAG, and power delivery balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M18 | CONFIG_DONE | Open-drain status output confirming successful bitstream loading and I/O initialization. |
| P15 | INIT_B | Active-low open-drain indicator signaling configuration engine readiness or error state. |
| R14 | PROGRAM_B | Active-low input initiating master SPI or BPI configuration sequence reset. |
| T13 | CLK_IN1_M2C | Dedicated single-ended clock input for configuration and startup timing reference. |
| AB12 | GTY_RXN_0 | Differential negative input for first GTY transceiver lane, supporting 25.8 Gb/s PAM4 or NRZ. |
| AB11 | GTY_RXP_0 | Differential positive input for first GTY transceiver lane, routed with matched length to AB12. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 Controller | Integrated root port and endpoint logic eliminates external PHY and reduces latency by >300 ns vs. soft IP. |
| UltraRAM Primitives | 288 × 72 Kb asymmetric RAM blocks enable true dual-port operation without resource contention. |
| Dynamic Function eXchange (DFX) | Enables runtime partial reconfiguration of logic regions while maintaining system operation and I/O continuity. |
| Multi-Standard I/O | Single I/O bank supports simultaneous LVDS, SSTL-12, and HSTL-I standards via per-bank VCCO selection. |
| Security Boot | AES-256 + SHA-3 authenticated boot prevents unauthorized bitstream execution and ensures supply chain integrity. |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time low-latency inference on vision transformers using sparse weight mapping and quantized activation streams. IC Role / Device Role / Timing Role: Configurable accelerator fabric with hardened AXI4-Stream DMA and on-chip memory hierarchy. Use Value: Achieves 12.4 TOPS/W at INT8 via DSP slice optimization and UltraRAM-based weight caching. | Use Scenario: Channel estimation, precoding matrix computation, and OFDM symbol generation for 256-antenna active antenna systems. IC Role / Device Role / Timing Role: Real-time signal processor with deterministic 12 ns clock-to-output timing on GTY lanes for RFIC synchronization. Use Value: Supports 4× concurrent 100 MHz bandwidth carriers with sub-100 ns latency for closed-loop beamforming control. |
| Phased Array Radar Processing | High-Speed Test Equipment |
Use Scenario: Digital beamforming, pulse compression, and CFAR detection across 1024-channel receive chains. IC Role / Device Role / Timing Role: Time-synchronized acquisition engine with 32 GTY lanes feeding ADC samples directly into FFT pipelines. Use Value: Enables 2.4 GHz instantaneous bandwidth capture and real-time Doppler processing at <500 ns pipeline latency. | Use Scenario: Protocol-aware pattern generation and analysis for PCIe Gen4, DDR4, and 100G Ethernet compliance testing. IC Role / Device Role / Timing Role: Reconfigurable protocol analyzer with deterministic jitter injection and eye diagram measurement capability. Use Value: Delivers ±0.3 ps RMS jitter accuracy and <1.2 UI eye height margin verification per IEEE 802.3cd. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable compute applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-L2FLGB2104E | Higher logic density (2,586K cells), 115.2 Mb BRAM, same GTY transceiver spec but larger thermal envelope (35 W typical). | Required for >10k LUT AI kernels or >8-channel 100G Ethernet aggregation. | Select when design exceeds XCVU7P routing utilization or requires >64 MB on-die memory. |
| XCVU5P-L2FSGD2104E | Fewer GTY lanes (20), lower BRAM (42.5 Mb), identical FLGB2104 footprint but reduced I/O count (624 vs. 832). | Suitable for cost-sensitive 5G fronthaul or mid-tier test equipment with <400 Gb/s aggregate bandwidth. | Choose for designs where transceiver count and I/O density can be traded for lower BOM cost and power. |
Compared with XCVU7P-L2FLVB2104E, the XCVU9P offers higher capacity at increased thermal load, while the XCVU5P reduces I/O and transceiver count to lower cost-neither is pin-compatible, requiring PCB redesign for migration.
Availability
XCVU7P-L2FLVB2104E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO baseband units, and phased array radar signal processors requiring stable component supply across extended product lifecycles.
Supply support for XCVU7P-L2FLVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Virtex UltraScale+ family targets high-bandwidth, low-latency reconfigurable systems demanding hardened connectivity, memory, and security IP-designed for AI, 5G, and defense electronics.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU7P-L2FLVB2104E?
The XCVU7P-L2FLVB2104E supports GTY transceivers operating up to 25.8 Gb/s per lane in both NRZ and PAM4 modes. This rating is validated across the full industrial temperature range (-40°C to +100°C) and confirmed in AMD's UltraScale+ DC and AC switching characteristics documentation. The XCVU7P-L2FLVB2104E achieves this speed using calibrated TX pre-emphasis and RX equalization settings.
Does the XCVU7P-L2FLVB2104E include a hardened PCIe Gen4 controller?
Yes, the XCVU7P-L2FLVB2104E integrates a fully compliant PCIe Gen4 x16 root port and endpoint controller with AXI4 interface, supporting both link training and power management states. The XCVU7P-L2FLVB2104E does not require external PHY or soft IP implementation, reducing latency and board area versus discrete solutions.
What I/O standards are supported by the XCVU7P-L2FLVB2104E?
The XCVU7P-L2FLVB2104E supports LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling standards across its 24 I/O banks. Each bank accepts independent VCCO voltages from 1.2 V to 1.8 V, enabling mixed-standard interfaces on a single device. The XCVU7P-L2FLVB2104E also supports on-die termination calibration for impedance matching.
Is partial reconfiguration supported on the XCVU7P-L2FLVB2104E?
Yes, the XCVU7P-L2FLVB2104E supports Dynamic Function eXchange (DFX) for runtime partial reconfiguration of designated logic regions without disrupting active I/O or system operation. This capability is implemented in hardware and verified in AMD's UltraScale+ DFX User Guide. The XCVU7P-L2FLVB2104E allows secure, authenticated bitstream loading during operation.
What is the block RAM capacity of the XCVU7P-L2FLVB2104E?
The XCVU7P-L2FLVB2104E provides 72.5 Mb of total block RAM distributed across 2,880 BRAM primitives, each configurable as 36 Kb dual-port or 18 Kb single-port memory. This capacity supports large FIFOs, coefficient buffers, and lookup tables in signal processing pipelines. The XCVU7P-L2FLVB2104E also includes 288 UltraRAM blocks for high-density, low-power storage.
XCVU7P-L2FLVB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-L2FLVB2104E FAQ
1.How can I place an order for XCVU7P-L2FLVB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-L2FLVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-L2FLVB2104E reliable?
The price and inventory of XCVU7P-L2FLVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-L2FLVB2104E is usually 5 days.
3.What payment methods are accepted for XCVU7P-L2FLVB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-L2FLVB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-L2FLVB2104E?
XCVU7P-L2FLVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-L2FLVB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-L2FLVB2104E?
For technical support, including XCVU7P-L2FLVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-L2FLVB2104E requirements.
6.How does Aetrix verify that XCVU7P-L2FLVB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU7P-L2FLVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-L2FLVB2104E meets industry standards.
7.What is the process for return or replacement of XCVU7P-L2FLVB2104E?
All XCVU7P-L2FLVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-L2FLVB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-L2FLVB2104E part is unused and in its original packaging.
Return procedure for XCVU7P-L2FLVB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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