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AMD XCVU7P-L2FLVC2104E
- Part No.:
- XCVU7P-L2FLVC2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU7P-L2FLVC2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,929
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Product details
Overview
XCVU7P-L2FLVC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,125K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets advanced radar processing, 5G massive MIMO baseband, and high-throughput data center acceleration.
For engineers reviewing the XCVU7P-L2FLVC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, I/O voltage flexibility (1.8 V / 1.2 V / 0.85 V), and thermal design power (TDP) envelope for air-cooled systems.
Technical Context
The XCVU7P-L2FLVC2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and UltraScale+ DSP slices delivering 10.9 TMAC peak compute. Its configuration uses dual-boot BPI flash with AES-256 bitstream encryption and SEU mitigation via ECC on configuration memory.
It supports multi-voltage I/O banks (HR and HP), enabling mixed-signal interface integration including MIPI D-PHY, LVDS, and SSTL-12/15/18. The device operates across -40°C to +100°C junction temperature with industrial-grade reliability qualification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,125,000 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| Block RAM | 72.5 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external DRAM latency |
| Transceiver Max Rate | 25.8 Gb/s - enables 100G Ethernet KR4, CPRI-OBSAI, and JESD204C serial links |
| PCIe Interface | Gen4 x16 - delivers 32 GT/s bidirectional throughput for host CPU/FPGA co-processing |
| DDR4 Support | DDR4-2400 (1200 MHz) - allows direct connection to high-bandwidth memory subsystems up to 128 GB |
| TDP | 45 W typical - defines thermal management requirements for convection-cooled PCB layouts |
| I/O Standards | HR/HP banks supporting SSTL, HSTL, LVCMOS, MIPI D-PHY, LVDS - enables direct sensor and memory interfacing |
Pinout & Package
This device is housed in a 2104-pin Flip-Chip Land Grid Array (FLGA) package with 35 × 35 mm body size, 0.8 mm pitch, and integrated thermal lid for industrial thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS peripherals in Zynq UltraScale+ MPSoC hybrid mode |
| GTYP[0:71] | High-Speed Transceiver | 25.8 Gb/s serial lanes grouped in quads; supports PMA/PMD layers for JESD204C and 100G KR4 |
| PL_IO_L[0:255] | Programmable Logic I/O | Bank-configurable voltage (0.85/1.2/1.8 V); supports source-synchronous interfaces like DDR4 DQ/DQS |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate 0.85 V core, 1.8 V auxiliary, and bank-specific I/O supplies enable low-noise domain partitioning |
| CONFIG_M[0:2] | Configuration Mode | Selects boot source (BPI flash, QSPI, JTAG) and configuration width (x8/x16) at power-on reset |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 Controller | Reduces RTL integration effort and timing closure risk for high-speed host interconnects |
| ECC on Block RAM | Enables single-bit error correction and double-bit error detection for mission-critical memory buffers |
| UltraScale+ DSP Slices | Deliver deterministic 27 × 18 signed multiply-accumulate per slice at 500 MHz for radar FFT pipelines |
| AES-256 Bitstream Encryption | Protects intellectual property against physical readout attacks during field deployment |
| SEU Mitigation | Automatic scrubbing and parity protection on configuration memory prevent functional interruption in radiation-prone environments |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne SAR systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT-based range-Doppler mapping; transceivers interface with ADC/DAC arrays. Use Value: 25.8 Gb/s transceivers sustain 32-channel 12-bit @ 2.4 GSPS ADC streaming without bottlenecks. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 256-antenna active antenna units. IC Role / Device Role / Timing Role: Configurable logic implements real-time DPD lookup tables and inverse FFT; DDR4-2400 buffers coefficient updates. Use Value: 72.5 Mb block RAM stores >100k complex coefficients for concurrent multi-user DPD correction. |
| Data Center Acceleration | Test & Measurement Instrumentation |
Use Scenario: Low-latency packet classification and flow steering in smart NICs. IC Role / Device Role / Timing Role: Hardened PCIe Gen4 x16 handles host DMA; logic fabric runs TCAM emulation and stateful firewall rules. Use Value: 32 GT/s link bandwidth enables sub-500 ns round-trip latency for RDMA over Converged Ethernet (RoCEv2). | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time waveform analysis. IC Role / Device Role / Timing Role: FPGA processes interleaved ADC streams; transceivers feed digitized samples to GPU via PCIe Gen4. Use Value: 1,125K logic cells implement parallel histogram generation and jitter measurement engines at full sample rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-L2FLGA2104E | 1,450K logic cells, 96.5 Mb BRAM, same package footprint and I/O compatibility | Higher compute density required for 400G crypto offload or AI inference kernels | Select when additional logic resources and memory bandwidth exceed XCVU7P-L2FLVC2104E capacity |
| XCVU5P-L2FLVC2104E | 650K logic cells, 42.5 Mb BRAM, identical FLVC2104 package and pinout | Cost-sensitive 5G small cell or edge video analytics where transceiver count is reduced | Choose for lower TDP (32 W) and reduced bill-of-materials cost while retaining same board layout |
Compared with XCVU7P-L2FLVC2104E, the XCVU9P offers higher resource headroom for scaling algorithms, while the XCVU5P reduces power and cost at the expense of logic and memory capacity-both share identical mechanical and electrical interface compatibility.
Availability
XCVU7P-L2FLVC2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and data center accelerator design requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCVU7P-L2FLVC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex UltraScale+ family targets high-throughput, low-latency applications demanding hardened interfaces, large on-chip memory, and radiation-tolerant configuration integrity-designed for aerospace, defense, and telecom infrastructure.
FAQ
What is the maximum supported transceiver data rate for XCVU7P-L2FLVC2104E?
The XCVU7P-L2FLVC2104E supports a maximum transceiver line rate of 25.8 Gb/s per lane. This enables compliance with JESD204C, 100G Ethernet KR4, and CPRI-OBSAI protocols. The device integrates 72 GTY transceivers organized in quads, each capable of independent protocol configuration and dynamic reconfiguration.
Does XCVU7P-L2FLVC2104E include hardened PCIe Gen4 support?
Yes, XCVU7P-L2FLVC2104E includes a fully hardened PCIe Gen4 x16 controller with integrated PHY and DMA engine. It supports both endpoint and root complex configurations, AXI4-Stream and AXI4-MM interfaces, and hot-plug capability. The controller operates at 16 GT/s per lane with end-to-end error reporting and Advanced Error Reporting (AER).
What I/O standards are supported by XCVU7P-L2FLVC2104E?
XCVU7P-L2FLVC2104E supports HR and HP I/O banks with configurable voltage levels (0.85 V, 1.2 V, 1.8 V). Validated standards include SSTL-12/15/18, HSTL-I/II, LVCMOS, LVDS, MIPI D-PHY, and differential signaling modes such as BLVDS and RSDS. Each bank is independently powered and terminated.
Is XCVU7P-L2FLVC2104E qualified for industrial temperature operation?
Yes, XCVU7P-L2FLVC2104E is rated for industrial temperature operation from –40°C to +100°C junction temperature. It meets JEDEC JESD22-A104 reliability testing and is qualified per AMD's industrial-grade screening flow, including extended burn-in and HTOL stress testing.
How much block RAM does XCVU7P-L2FLVC2104E provide?
XCVU7P-L2FLVC2104E provides 72.5 Mb of total block RAM distributed across 2,880 BRAM primitives. Each BRAM can be configured as 36 Kb dual-port memory or split into two 18 Kb blocks. ECC is enabled by default on all BRAM instances, providing SEC-DED protection for critical buffer applications.
XCVU7P-L2FLVC2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 98520
- Number of Logic Elements/Cells:
- 1724100
- Total RAM Bits:
- 260812800
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU7P-L2FLVC2104E FAQ
1.How can I place an order for XCVU7P-L2FLVC2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU7P-L2FLVC2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU7P-L2FLVC2104E reliable?
The price and inventory of XCVU7P-L2FLVC2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU7P-L2FLVC2104E is usually 5 days.
3.What payment methods are accepted for XCVU7P-L2FLVC2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU7P-L2FLVC2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU7P-L2FLVC2104E?
XCVU7P-L2FLVC2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU7P-L2FLVC2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU7P-L2FLVC2104E?
For technical support, including XCVU7P-L2FLVC2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU7P-L2FLVC2104E requirements.
6.How does Aetrix verify that XCVU7P-L2FLVC2104E is sourced from the original manufacturer or authorized distributors?
All XCVU7P-L2FLVC2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU7P-L2FLVC2104E meets industry standards.
7.What is the process for return or replacement of XCVU7P-L2FLVC2104E?
All XCVU7P-L2FLVC2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU7P-L2FLVC2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU7P-L2FLVC2104E part is unused and in its original packaging.
Return procedure for XCVU7P-L2FLVC2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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