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AMD XCVU9P-1FLGA2104E
- Part No.:
- XCVU9P-1FLGA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-1FLGA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,240
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Product details
Overview
XCVU9P-1FLGA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 13,440 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for high-bandwidth data center acceleration and 5G wireless infrastructure.
For engineers reviewing the XCVU9P-1FLGA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (40 GTY), I/O voltage support (1.8 V / 1.2 V / 1.0 V), and thermal design power (TDP) of 55 W under typical configuration.
Technical Context
The XCVU9P-1FLGA2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency memory interfaces. It supports multi-chip module (MCM) integration via silicon interposer and enables partial reconfiguration for dynamic function swapping.
Its 16 nm FinFET process delivers improved power efficiency over previous generations, and the device includes integrated system monitoring (temperature, voltage, current) with AXI-based access. Configuration occurs via dual BPI NOR flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - determines maximum combinational/sequential logic capacity for custom datapaths and control units |
| DSP Slices | 13,440 - enables parallel execution of fixed/floating-point multiply-accumulate operations per clock cycle |
| Block RAM | 72.5 Mb - provides on-die memory for FIFOs, buffers, lookup tables, and local instruction storage |
| GTY Transceivers | 40 lanes @ 25.8 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and high-speed serial backplane interconnects |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, and differential signaling up to 1.8 V - enables direct interfacing with DDR4, LPDDR4, and high-speed ADC/DAC |
| TDP | 55 W (typical) - defines thermal envelope requiring active cooling and PCB copper pour planning |
| Configuration Interface | Quad-SPI, BPI, JTAG - allows flexible boot sources and secure in-field updates |
Pinout & Package
The XCVU9P-1FLGA2104E is housed in a 2104-pin Flip-Chip Land Grid Array (FLGA) package with 35 × 35 mm body size, 0.8 mm pitch, and thermal lid. It features 832 user I/O pins distributed across 24 banks, supporting mixed-voltage operation and bank-specific VCCO/VREF configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% required for logic fabric and CLB operation; decoupling critical for signal integrity |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% powers configuration logic, PLLs, and transceiver reference circuitry |
| VCCO | I/O bank supply | Configurable per-bank (1.0–1.8 V); sets output swing and input threshold for connected peripherals |
| MIO[0:7] | Multiplexed I/O | Hardened PS-GPIO interface for Zynq UltraScale+ MPSoC co-processing or external control signaling |
| GTYP/N | Transceiver differential pair | High-speed serial lane with integrated CDR, equalization, and PRBS pattern generation |
| CONFIG_DONE | Configuration status | Open-drain output indicating successful bitstream load and initialization completion |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort and guarantees sub-100 ns latency for host-to-FPGA memory-mapped transactions |
| DDR4 Memory Controller | Supports up to 4x 72-bit channels at 2400 MT/s, enabling >150 GB/s aggregate memory bandwidth |
| Partial Reconfiguration | Allows dynamic swap of logic regions without resetting the entire device or disrupting active I/O paths |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning by securing configuration data in nonvolatile memory |
| System Monitor (XADC) | On-die 12-bit ADC with 17 channels monitors die temperature, supply voltages, and external analog signals |
Applications
| AI Acceleration Engine | 5G Baseband Processing |
|---|---|
Use Scenario: Real-time inference acceleration for CNN and Transformer models in edge servers. IC Role / Device Role / Timing Role: Configurable hardware accelerator replacing GPU offload; timing-critical dataflow orchestration via deterministic clock domains. Use Value: Achieves 2.1 TOPS/W efficiency at 16-bit precision using DSP-slice-based matrix multiplication and on-chip BRAM caching. | Use Scenario: Massive MIMO precoding and channel estimation in FR2 mmWave gNodeB units. IC Role / Device Role / Timing Role: Real-time baseband signal processor with synchronized multi-lane GTY transceivers feeding RFIC DACs. Use Value: Supports 8×8 MIMO with 200 MHz channel bandwidth using 40 GTY lanes and hardened 100G Ethernet MAC for fronthaul. |
| Data Center SmartNIC | Radar Signal Processing |
Use Scenario: Offloading TCP/IP stack, RDMA, and NVMe-over-Fabric protocol processing from CPU. IC Role / Device Role / Timing Role: PCIe Gen4 endpoint with DMA engines and packet classification logic; low-latency timing via dedicated clock networks. Use Value: Reduces host CPU utilization by 42% and achieves <500 ns packet processing latency with line-rate 100G throughput. | Use Scenario: Pulse-Doppler radar beamforming and CFAR detection in airborne SAR platforms. IC Role / Device Role / Timing Role: High-throughput digital down-converter and FFT engine synchronized to 122.88 MHz sampling clock. Use Value: Processes 16 simultaneous receive channels at 12-bit resolution with real-time range-Doppler map generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher logic density (3,384,000 LC), 16 GTY lanes at 32.75 Gb/s, 75 W TDP | Better suited for multi-100G transport and AI training workloads requiring larger on-die memory | Select when higher transceiver speed or logic capacity justifies increased power and cost |
| XCVU7P-1FLVA2104I | Lower speed grade (-1 vs -2), industrial temp range (-40°C to +100°C), same FLGA2104 package | Targeted for ruggedized avionics and defense systems requiring extended thermal operation | Choose for environments where reliability under thermal stress outweighs peak performance needs |
Compared with XCVU9P-1FLGA2104E, the XCVU13P offers greater bandwidth and compute density at higher power, while the XCVU7P trades speed for industrial-grade thermal robustness-enabling trade-offs between throughput, efficiency, and environmental resilience.
Availability
XCVU9P-1FLGA2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and data center SmartNIC applications requiring stable component supply and long-term lifecycle support.
Supply support for XCVU9P-1FLGA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, CPU, and GPU design.
The Virtex UltraScale+ family targets high-performance, high-bandwidth applications including cloud acceleration, wired/wireless infrastructure, and advanced radar systems.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU9P-1FLGA2104E?
The XCVU9P-1FLGA2104E supports GTY transceivers operating up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G Ethernet (4×25G), CPRI Option 10, and PCIe Gen4. Operation at this speed requires proper PCB stack-up, controlled impedance routing, and compliance with AMD's IBIS-AMI model guidelines. The XCVU9P-1FLGA2104E does not support 32.75 Gb/s - that capability is reserved for higher-grade devices like the XCVU13P.
Does the XCVU9P-1FLGA2104E include hardened PCIe Gen4 controller logic?
Yes, the XCVU9P-1FLGA2104E integrates a hardened PCIe Gen4 x16 root port or endpoint controller. This block handles link training, transaction layer packet (TLP) routing, and error reporting without consuming programmable logic resources. It supports ASPM L0s/L1, ECRC, and SR-IOV, and is fully compliant with PCI-SIG specification rev 4.0. The XCVU9P-1FLGA2104E's implementation eliminates the need for soft-core PCIe IP in most high-throughput applications.
What I/O standards are supported by the XCVU9P-1FLGA2104E for DDR4 memory interfacing?
The XCVU9P-1FLGA2104E supports SSTL12 I/O standard for DDR4 memory interfaces, with dedicated hard IP controllers capable of driving 72-bit wide interfaces at 2400 MT/s. Each memory controller bank requires matched VCCO = 1.2 V and VREF = 0.6 V. The XCVU9P-1FLGA2104E also supports LPDDR4 via POD11 I/O in specific banks, but DDR4 remains its primary high-bandwidth memory interface.
Is partial reconfiguration supported on the XCVU9P-1FLGA2104E, and what are the constraints?
Yes, the XCVU9P-1FLGA2104E supports dynamic partial reconfiguration (PR) through Vivado Design Suite. Reconfigurable partitions must be placed within a single SLR (Super Logic Region), and PR boundaries cannot cross clock domain crossings or hardened IP blocks. The XCVU9P-1FLGA2104E allows up to 8 concurrent PR regions, with bitstream loading time under 5 ms per region when using ICAP. PR is not supported for GTY transceiver configuration or PCIe hard IP.
What thermal management requirements apply to the XCVU9P-1FLGA2104E in continuous operation?
The XCVU9P-1FLGA2104E has a typical TDP of 55 W and a maximum junction temperature of 100°C. Continuous operation requires a heatsink with ≥0.25°C/W thermal resistance and forced airflow ≥200 LFM. The package includes thermal sensors accessible via the System Monitor, and thermal throttling activates if die temperature exceeds 95°C. The XCVU9P-1FLGA2104E's FLGA2104 footprint mandates 10-layer PCB with internal copper planes for heat spreading.
XCVU9P-1FLGA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-1FLGA2104E FAQ
1.How can I place an order for XCVU9P-1FLGA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-1FLGA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-1FLGA2104E reliable?
The price and inventory of XCVU9P-1FLGA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-1FLGA2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-1FLGA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-1FLGA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-1FLGA2104E?
XCVU9P-1FLGA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-1FLGA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-1FLGA2104E?
For technical support, including XCVU9P-1FLGA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-1FLGA2104E requirements.
6.How does Aetrix verify that XCVU9P-1FLGA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-1FLGA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-1FLGA2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-1FLGA2104E?
All XCVU9P-1FLGA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-1FLGA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-1FLGA2104E part is unused and in its original packaging.
Return procedure for XCVU9P-1FLGA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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