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AMD XCVU9P-1FLGA2104I
- Part No.:
- XCVU9P-1FLGA2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-1FLGA2104I.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,117
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Product details
Overview
XCVU9P-1FLGA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 72.5 Mb of block RAM, 100G Ethernet MAC support, and 100+ GTY transceivers operating up to 32.75 Gb/s. It serves as a reconfigurable system-on-chip for 5G wireless infrastructure baseband processing, AI acceleration, and high-throughput data center offload.
For engineers reviewing the XCVU9P-1FLGA2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count and speed, on-die memory bandwidth, DSP slice density, and thermal design power envelope for air-cooled rack deployments.
Technical Context
The XCVU9P-1FLGA2104I implements a heterogeneous architecture with programmable logic fabric, hardened 100G Ethernet MACs, PCIe Gen4 x16 endpoints, and integrated DDR4/RLDRAM3 memory controllers. Its GTY transceivers support PAM4 and NRZ signaling with built-in FEC and PRBS generation.
Configuration occurs via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. Partial reconfiguration is supported across multiple dynamic regions without full device reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - Enables large-scale RTL implementations including multi-core SoC subsystems and real-time signal processing pipelines. |
| Block RAM | 72.5 Mb - Supports high-bandwidth buffering for packet inspection, video frame storage, and matrix transpose operations. |
| GTY Transceivers | 104 × 32.75 Gb/s - Provides native 100G/200G/400G Ethernet connectivity with forward error correction and low-latency serialization. |
| DSP Slices | 10,240 - Delivers 21.5 TFLOPS peak INT8 compute for AI inference acceleration and adaptive filtering. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - Enables direct interfacing with high-speed ADCs, FPGAs, memory, and optical modules without level-shifting. |
| Thermal Design Power | 55 W (typical) - Specifies cooling requirements for sustained operation in 1U server chassis with forced-air convection. |
Pinout & Package
The XCVU9P-1FLGA2104I is housed in a 2104-pin Flip-Chip Land Grid Array (FLGA) package with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation via integrated heat spreader.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V ±3% to programmable logic and CLB resources; requires low-noise regulation and local decoupling. |
| VCCAUX | Auxiliary supply rail | Powers configuration logic, PCIe blocks, and transceiver reference clocks; must be sequenced before VCCINT. |
| MGTAVCC | Transceiver analog supply | Provides 0.95 V ±2% to GTY analog circuitry; isolated from digital rails to minimize jitter coupling. |
| CLK_IN_0 | Primary configuration clock | Accepts 10–100 MHz single-ended or differential input to initialize configuration and PLL lock sequence. |
| INIT_B | Configuration status indicator | Open-drain active-low signal indicating bitstream loading progress and CRC pass/fail during startup. |
| PROGRAM_B | Configuration reset control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration from boot source. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces latency and resource usage for L2 switching and packet classification by eliminating soft IP implementation overhead. |
| PCIe Gen4 x16 Endpoint | Enables direct host CPU coherency and DMA access at 32 GB/s bidirectional bandwidth without external switch chips. |
| Integrated DDR4 Controller | Supports up to 4x64-bit interfaces at 2400 MT/s, simplifying memory subsystem design and reducing BOM count. |
| AES-256 Bitstream Encryption | Protects intellectual property against physical extraction and unauthorized cloning during field deployment. |
| Partial Reconfiguration | Allows runtime swapping of functional modules (e.g., modems, codecs) without interrupting system operation or I/O continuity. |
Applications
| 5G Massive MIMO Baseband Unit | AI Inference Accelerator Card |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and OFDM modulation/demodulation for 64T64R antenna arrays. IC Role / Device Role / Timing Role: Primary baseband processor executing Layer 1 PHY algorithms with deterministic sub-microsecond latency. Use Value: GTY transceivers interface directly with RFICs at 24.33 Gb/s per lane; DSP slices deliver 128 parallel complex multiply-accumulate operations per cycle. | Use Scenario: Low-latency inferencing for vision analytics and natural language processing in edge servers. IC Role / Device Role / Timing Role: Programmable accelerator tightly coupled to host CPU via PCIe Gen4 x16, executing custom neural network layers. Use Value: 10,240 DSP slices enable INT8 convolution at 21.5 TFLOPS; on-chip BRAM provides 72.5 Mb of low-latency weight buffer. |
| Data Center SmartNIC Offload | Radar Signal Processing Platform |
Use Scenario: TCP/IP stack offload, TLS encryption, and RDMA acceleration for cloud-native workloads. IC Role / Device Role / Timing Role: Co-processor managing network I/O path while maintaining cache coherency with host CPU over CXL-compatible interconnect. Use Value: Hardened 100G MAC handles 148.8 Mpps line-rate packet processing; PCIe Gen4 x16 enables zero-copy DMA transfers. | Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture radar (SAR) image formation. IC Role / Device Role / Timing Role: Real-time signal processor synchronizing ADC sampling, FFT computation, and pulse compression with sub-cycle timing precision. Use Value: 2,586K logic cells implement pipelined FFT engines; GTY transceivers stream raw ADC data at 25.78 Gb/s per lane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher speed grade (-2), larger 2,852K logic cells, 2577-pin FLGA package, 120 GTY transceivers. | Targeted at higher-bandwidth 400G/800G optical transport and AI training clusters requiring greater compute density. | Select when >2.5 TFLOPS additional INT8 throughput or >20 Gb/s extra transceiver bandwidth is required. |
| XCVU7P-1FLVA2104I | Lower logic count (2,028K), reduced GTY count (64), same 2104-pin FLGA package, lower TDP (42 W). | Suitable for cost-sensitive 5G mid-haul and industrial vision systems where full XCVU9P capacity is unused. | Choose when thermal budget is constrained or transceiver count can be reduced by ≥38% without performance loss. |
Compared with XCVU9P-1FLGA2104I, the XCVU13P offers higher bandwidth and logic density at increased power and package size, while the XCVU7P delivers identical footprint and thermal profile with scaled-down resources for optimized BOM cost.
Availability
XCVU9P-1FLGA2104I is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator development, and radar signal processing requiring stable component supply across long production lifecycles.
Supply support for XCVU9P-1FLGA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, and communications infrastructure.
The Virtex UltraScale+ family targets high-throughput, low-latency reconfigurable computing in wired/wireless infrastructure and real-time signal processing systems.
FAQ
What is the maximum data rate supported by the GTY transceivers on the XCVU9P-1FLGA2104I?
The XCVU9P-1FLGA2104I features 104 GTY transceivers each capable of 32.75 Gb/s NRZ or 58 Gb/s PAM4 operation. This enables native support for 100G, 200G, and 400G Ethernet protocols with forward error correction. The XCVU9P-1FLGA2104I transceiver architecture includes built-in PRBS generators and error detectors for link validation.
Does the XCVU9P-1FLGA2104I support partial reconfiguration?
Yes, the XCVU9P-1FLGA2104I supports dynamic partial reconfiguration, allowing functional modules to be swapped during operation without resetting the entire device. This capability is implemented through dedicated configuration ports and frame-based bitstream loading. The XCVU9P-1FLGA2104I enables runtime adaptation of signal processing pipelines in 5G baseband and radar applications.
What memory interfaces are natively supported by the XCVU9P-1FLGA2104I?
The XCVU9P-1FLGA2104I integrates hardened controllers for DDR4 (up to 2400 MT/s), RLDRAM3 (up to 2133 MT/s), and LPDDR4 (up to 4266 MT/s). These controllers include calibration logic, write leveling, and read-leveling circuitry. The XCVU9P-1FLGA2104I eliminates need for external memory PHYs in high-bandwidth data buffering applications.
What security features does the XCVU9P-1FLGA2104I provide for bitstream protection?
The XCVU9P-1FLGA2104I implements AES-256 encryption for bitstream confidentiality and HMAC-SHA256 authentication for integrity verification. Keys are stored in on-chip eFUSE and protected by tamper-detection circuitry. The XCVU9P-1FLGA2104I supports secure boot with certificate chain validation and anti-rollback mechanisms for field updates.
Is the XCVU9P-1FLGA2104I compatible with Vivado Design Suite 2023.1?
Yes, the XCVU9P-1FLGA2104I is fully supported in Vivado Design Suite 2023.1 and later versions, including synthesis, implementation, and debug tools. Device-specific IP cores such as 100G Ethernet Subsystem and PCIe Gen4 Root Port are included. The XCVU9P-1FLGA2104I requires license activation for advanced features like partial reconfiguration and hardware debugging.
XCVU9P-1FLGA2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-1FLGA2104I FAQ
1.How can I place an order for XCVU9P-1FLGA2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-1FLGA2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-1FLGA2104I reliable?
The price and inventory of XCVU9P-1FLGA2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-1FLGA2104I is usually 5 days.
3.What payment methods are accepted for XCVU9P-1FLGA2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-1FLGA2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-1FLGA2104I?
XCVU9P-1FLGA2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-1FLGA2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-1FLGA2104I?
For technical support, including XCVU9P-1FLGA2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-1FLGA2104I requirements.
6.How does Aetrix verify that XCVU9P-1FLGA2104I is sourced from the original manufacturer or authorized distributors?
All XCVU9P-1FLGA2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-1FLGA2104I meets industry standards.
7.What is the process for return or replacement of XCVU9P-1FLGA2104I?
All XCVU9P-1FLGA2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-1FLGA2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-1FLGA2104I part is unused and in its original packaging.
Return procedure for XCVU9P-1FLGA2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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