My Inquiry
My Account
AMD XCVU9P-1FLGA2577E
- Part No.:
- XCVU9P-1FLGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU9P-1FLGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,370
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU9P-1FLGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,825,760 logic cells, 14,520 DSP slices, and 96.2 Gb/s transceiver bandwidth with 32 GTY transceivers operating up to 32.75 Gbps. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting AI acceleration, 5G wireless infrastructure, and high-end test equipment.
For engineers reviewing the XCVU9P-1FLGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, on-chip memory block capacity, I/O voltage support (1.8 V / 1.2 V), and thermal design power (TDP) of 55 W under typical operation.
Technical Context
The XCVU9P-1FLGA2577E implements a heterogeneous architecture combining programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4 PHY), and ultra-high-speed serial transceivers. Its GTY transceivers support PAM4 and NRZ modulation, enabling flexible protocol mapping for CPRI, eCPRI, and OTN.
Configuration is performed via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,825,760 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 14,520 - dedicated arithmetic units supporting 27×18 multiply-accumulate at 500+ MHz |
| GTY Transceivers | 32 lanes, up to 32.75 Gbps - enables 100G/400G Ethernet, CPRI, and high-speed interconnects |
| Memory Interface | DDR4-2400, LPDDR4-4266 - supports up to 8 banks with 256-bit wide interface |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, 1.8 V / 1.2 V - ensures compatibility with diverse peripheral signaling |
| TDP | 55 W typical - defines thermal management requirements for board-level cooling design |
| PCIe Interface | Gen4 x16 hard IP - provides low-latency, deterministic host CPU connectivity without soft-core overhead |
Pinout & Package
The XCVU9P-1FLGA2577E is housed in a 2577-ball Fine-Pitch Flip-Chip Ball Grid Array (FLGA) package with 0.8 mm pitch, designed for high-density routing and thermal dissipation in multi-layer PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog transceiver supply | Separate 1.0 V and 1.2 V rails required for GTY transceiver analog core and termination |
| VCCINT | Core logic supply | 0.85 V ±3% rail powering FPGA fabric, CLBs, and routing switches |
| VCCAUX | Auxiliary supply | 1.8 V rail for configuration logic, PCIe hard IP, and clock management tiles |
| VRP / VRN | Reference voltage pins | Provide precision reference for differential I/O standards including LVDS and SSTL |
| PROGRAM_B | Configuration control | Active-low signal initiating master SPI or BPI configuration from external flash |
| INIT_B | Status indicator | Open-drain output signaling configuration status and bitstream validity |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces latency and resource usage vs. soft IP; supports SR-IOV and ATS for virtualized environments |
| 100G Ethernet MAC + RS-FEC | Enables line-rate 100G processing without external PHY; RS-FEC corrects burst errors in optical links |
| UltraScale+ memory controller | Supports DDR4/LPDDR4 with ECC, AXI4 interface, and 256-bit data width for high-bandwidth memory access |
| AES-256 + HMAC-SHA256 bitstream encryption | Prevents reverse engineering and unauthorized configuration; meets FIPS 140-2 Level 2 requirements |
| Partial reconfiguration capability | Allows dynamic swapping of logic partitions during operation, enabling adaptive compute in radar and comms systems |
Applications
| 5G Massive MIMO Baseband Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R antenna arrays in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Primary baseband processor implementing custom OFDM PHY layers and massive matrix operations. Use Value: GTY transceivers interface directly with RFICs at 24.33 Gbps; DSP slices deliver >10 TFLOPS INT8 throughput for neural network inference. | Use Scenario: Low-latency inference engine for vision-based autonomous systems deployed in edge servers and industrial robots. IC Role / Device Role / Timing Role: Configurable accelerator tightly coupled with host CPU via PCIe Gen4 x16, executing quantized CNN models. Use Value: Hardened PCIe Gen4 reduces host-to-accelerator latency to <1.5 µs; on-chip memory bandwidth exceeds 1 TB/s for weight streaming. |
| High-Speed Test Equipment | Optical Transport Network (OTN) Line Cards |
Use Scenario: Bit-error-rate testing (BERT) and protocol validation for 100G/400G client interfaces in manufacturing test fixtures. IC Role / Device Role / Timing Role: Programmable pattern generator and error detector synchronized to precise clock domains. Use Value: 32 GTY transceivers support simultaneous multi-lane loopback; deterministic timing enables sub-100 ps jitter measurement. | Use Scenario: OTU4/OTU3 framing, FEC decoding, and multiplexing in carrier-grade DWDM line cards. IC Role / Device Role / Timing Role: Line-side framer and forward error correction engine handling 112 Gbps OTU4 payloads. Use Value: Integrated RS-FEC IP achieves 10⁻¹⁵ post-FEC BER; hardened 100G Ethernet MAC aligns with ITU-T G.709. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2577E | Higher speed grade (-2): 30% faster logic performance, 35.5 Gbps GTY max rate, 65 W TDP | Suitable for timing-critical 400G crypto offload where setup closure margin is critical | Select when worst-case timing closure requires additional slack or higher transceiver rates are mandatory |
| XCVU13P-1FLGA2577E | Larger capacity: 3,725,280 logic cells, 18,240 DSP slices, same package footprint | Required for AI training workloads needing >3M LUTs and dual 100G MACs | Choose when logic density or DSP count exceeds XCVU9P-1FLGA2577E limits, with no PCB redesign needed |
Compared with XCVU9P-1FLGA2577E, the -2 speed grade delivers tighter timing margins at higher frequencies but increases thermal load, while the XCVU13P-1 offers scalable logic headroom within identical mechanical constraints-enabling upgrade paths without layout changes.
Availability
XCVU9P-1FLGA2577E is available at Aetrix Electronics and suitable for 5G infrastructure, AI acceleration, and high-speed test equipment requiring stable component supply across long production cycles.
Supply support for XCVU9P-1FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex UltraScale+ family targets demanding infrastructure applications requiring hardened I/O, high transceiver bandwidth, and reconfigurable logic-designed for 5G, AI, and next-generation networking.
FAQ
What is the maximum supported transceiver data rate for XCVU9P-1FLGA2577E?
The XCVU9P-1FLGA2577E supports GTY transceivers operating up to 32.75 Gbps per lane in NRZ mode and 58 Gbps in PAM4 mode. This rating is validated across temperature and voltage corners per AMD's DS924 specification. The XCVU9P-1FLGA2577E achieves this performance using adaptive equalization and decision feedback equalization (DFE) built into each GTY channel.
Does XCVU9P-1FLGA2577E include a hardened 100G Ethernet MAC?
Yes, the XCVU9P-1FLGA2577E integrates a hardened 100G Ethernet MAC with RS-FEC compliant to IEEE 802.3bs. It supports both CAUI-4 and CAUI-10 interfaces and operates at line rate without consuming programmable logic resources. The XCVU9P-1FLGA2577E uses this MAC for direct 100G optical transport and switching applications.
What configuration modes are supported by XCVU9P-1FLGA2577E?
The XCVU9P-1FLGA2577E supports master SPI, slave SPI, BPI, JTAG, and PCIe enumeration configuration modes. Dual-boot capability allows fallback to a secondary bitstream stored in QSPI flash. Configuration security features-including AES-256 decryption and HMAC-SHA256 authentication-are active in all modes. The XCVU9P-1FLGA2577E requires external configuration memory unless using JTAG-only programming.
Is XCVU9P-1FLGA2577E pin-compatible with other Virtex UltraScale+ devices in FLGA2577 package?
The XCVU9P-1FLGA2577E shares the FLGA2577 package footprint with XCVU13P-1FLGA2577E and XCVU11P-1FLGA2577E, enabling mechanical compatibility. However, ball function mapping differs across variants due to varying I/O bank counts and hardened IP placement. The XCVU9P-1FLGA2577E requires its specific pinout documentation for PCB design-no automatic pin-to-pin reuse is guaranteed.
What is the thermal design power (TDP) of XCVU9P-1FLGA2577E under typical operation?
The XCVU9P-1FLGA2577E has a typical TDP of 55 W when operating at junction temperature of 85°C with balanced logic and transceiver utilization. This value is derived from AMD's UG578 power estimation methodology using Vivado 2023.2. The XCVU9P-1FLGA2577E thermal solution must accommodate peak transient power exceeding 65 W during burst-mode transceiver activity.
XCVU9P-1FLGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU9P-1FLGA2577E FAQ
1.How can I place an order for XCVU9P-1FLGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-1FLGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-1FLGA2577E reliable?
The price and inventory of XCVU9P-1FLGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-1FLGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU9P-1FLGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-1FLGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-1FLGA2577E?
XCVU9P-1FLGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-1FLGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-1FLGA2577E?
For technical support, including XCVU9P-1FLGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-1FLGA2577E requirements.
6.How does Aetrix verify that XCVU9P-1FLGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-1FLGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-1FLGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU9P-1FLGA2577E?
All XCVU9P-1FLGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-1FLGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-1FLGA2577E part is unused and in its original packaging.
Return procedure for XCVU9P-1FLGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU9P-1FLGA2577E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
