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AMD XCVU9P-1FLGA2577I
- Part No.:
- XCVU9P-1FLGA2577I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU9P-1FLGA2577I.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,894
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Product details
Overview
XCVU9P-1FLGA2577I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,594,350 logic cells, 13,824 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.8 Gb/s transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal conditioning.
For engineers reviewing the XCVU9P-1FLGA2577I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (64), I/O voltage support (0.35–1.8 V), thermal design power (175 W), and package ball pitch (0.8 mm).
Technical Context
The XCVU9P-1FLGA2577I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers, and integrated RFSoC analog-to-digital converters in select variants - though this specific part excludes RF-ADC blocks. It supports DDR4-2400 memory interfaces with 2400 MT/s data rates and includes dual 100G Ethernet MACs.
Configuration occurs via quad-SPI, BPI, or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device operates across industrial temperature range (–40°C to +100°C) and requires multi-rail power sequencing (VCCINT, VCCAUX, VCCO, VRP, VREF).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,594,350 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 13,824 - enables parallel fixed/floating-point computation for matrix math and filtering |
| Block RAM | 104.5 Mb - supports large on-chip buffering for video frame stores or packet queues |
| Transceivers | 64 lanes @ 25.8 Gb/s - delivers 1.65 Tb/s aggregate serial bandwidth for inter-FPGA or ASIC links |
| I/O Standards | Supports LVDS, SSTL, HSTL, MIPI, and differential signaling up to 1.8 V - enables direct interface to ADCs, DACs, and memory |
| PCIe Interface | Gen4 x16 root port or endpoint - provides host CPU coherency and DMA access without bridge chips |
| Operating Temp | –40°C to +100°C - qualified for industrial and outdoor embedded deployment |
Pinout & Package
This device is packaged in a 2577-ball Flip-Chip Land Grid Array (FLGA) with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via solder-bumped die attach.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to FPGA fabric; requires tight regulation (±3%) and low-noise filtering |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, transceivers, and clock management tiles |
| VCCO_0 | I/O bank power | Configurable 0.35–1.8 V per bank; sets output swing and input threshold for connected peripherals |
| MGTAVCC | Transceiver analog supply | 1.0 V dedicated rail for PLLs and serializers; sensitive to ripple & noise |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential reference clocks up to 1.2 GHz for MMCM/PLL locking |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables hierarchical floorplanning and partial reconfiguration for dynamic function swapping |
| Hardened PCIe Gen4 Controller | Reduces RTL overhead and timing closure risk versus soft IP implementations |
| Multi-rate Transceivers | Supports protocol stacking (e.g., 100G Ethernet + CPRI + JESD204B) on shared lanes |
| Secure Boot with AES-HMAC | Prevents unauthorized bitstream execution and ensures firmware authenticity at power-on |
| Industrial Temp Grade | Validated operation without derating across full –40°C to +100°C junction range |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time inference on vision transformers using sparse weight mapping and quantized activation streams. IC Role / Device Role / Timing Role: Configurable compute fabric executing custom systolic arrays with deterministic latency under 200 ns. Use Value: Delivers >12 TOPS/W efficiency via parallel DSP slice utilization and on-die memory hierarchy. | Use Scenario: Digital pre-distortion (DPD) and channel estimation for 64T64R active antenna systems. IC Role / Device Role / Timing Role: Real-time signal processor handling 128 complex-valued FFTs per millisecond with sub-cycle jitter control. Use Value: Achieves <–50 dBc ACLR using 25.8 Gb/s transceivers synchronized to common 10 MHz reference. |
| Phased Array Radar Processing | High-Speed Data Acquisition |
Use Scenario: Beamforming and pulse-Doppler processing across 256-element radar front-ends. IC Role / Device Role / Timing Role: Time-synchronized acquisition engine managing 32-channel ADC interfaces with deterministic TDC alignment. Use Value: Enables <1 ps RMS time-of-flight resolution using calibrated delay chains and phase-locked transceiver clocks. | Use Scenario: Multi-channel oscilloscope capturing 16-bit samples at 1 GS/s across 8 channels simultaneously. IC Role / Device Role / Timing Role: High-throughput data concentrator aggregating JESD204B lanes into DDR4 memory buffers. Use Value: Sustains 12.8 GB/s sustained write bandwidth with ECC-protected memory controller and burst-length optimization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher speed grade (–2), 3,328K logic cells, 17,280 DSP slices, 125.5 Mb BRAM | Required for designs needing >200 MHz system clock or >100 Gb/s encrypted data paths | Select when higher timing margin or larger algorithm footprint is required; same FLGA2577 package |
| XCVU7P-1FLVA2104I | Fewer resources: 1,545K logic cells, 8,544 DSP slices, 72.5 Mb BRAM, 48 transceivers | Suitable for mid-tier 5G small cells or edge AI where cost and power constrain scale | Choose for lower TDP (<120 W) and reduced PCB layer count; different FLVA2104 package |
Compared with XCVU9P-1FLGA2577I, the XCVU13P offers greater resource headroom for future-proofing, while the XCVU7P trades capability for lower cost and thermal envelope - both require distinct board layouts and power delivery tuning.
Availability
XCVU9P-1FLGA2577I is available at Aetrix Electronics and suitable for AI inference engines, 5G massive MIMO baseband units, and phased array radar subsystems requiring stable component supply over extended production lifecycles.
Supply support for XCVU9P-1FLGA2577I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and security-critical applications including wireless infrastructure, defense EW systems, and real-time financial analytics.
FAQ
What is the maximum supported memory interface speed for XCVU9P-1FLGA2577I?
XCVU9P-1FLGA2577I supports DDR4-2400 memory interfaces with data rates up to 2400 MT/s. It includes hardened memory controllers with built-in calibration logic and supports RDIMM/LRDIMM topologies. The device achieves this performance using dedicated I/O banks with programmable drive strength and on-die termination. XCVU9P-1FLGA2577I also supports LPDDR4 at 4266 Mbps in selected configurations.
Does XCVU9P-1FLGA2577I include integrated analog-to-digital converters?
No, XCVU9P-1FLGA2577I does not include integrated RF analog-to-digital converters. That functionality is present only in the Virtex UltraScale+ RFSoC variants (e.g., XCVU9P-L2RF). The XCVU9P-1FLGA2577I is a pure digital FPGA with hardened transceivers and memory controllers but no on-die ADC/DAC blocks.
What configuration modes are supported by XCVU9P-1FLGA2577I?
XCVU9P-1FLGA2577I supports multiple configuration modes: Master/Slave SelectMAP, Serial (SPI flash), BPI (NOR flash), and JTAG. Configuration can be initiated via mode pins at power-up or triggered dynamically through ICAP. Bitstream authentication uses AES-256 decryption and HMAC-SHA-256 verification. XCVU9P-1FLGA2577I also supports fallback configuration and multi-boot from dual flash devices.
Is XCVU9P-1FLGA2577I qualified for automotive applications?
XCVU9P-1FLGA2577I is rated for industrial temperature range (–40°C to +100°C) and meets JEDEC JESD22-A108 reliability standards, but it is not AEC-Q100 qualified. For automotive use cases requiring AEC-Q100 Grade 2 or 3 compliance, AMD offers the XCVU9P-1FLGA2577I-ES variant with additional qualification testing. Standard XCVU9P-1FLGA2577I is deployed in industrial and aerospace systems, not safety-critical automotive ECUs.
What thermal management guidance applies to XCVU9P-1FLGA2577I?
XCVU9P-1FLGA2577I has a maximum junction temperature of +100°C and typical thermal design power of 175 W under worst-case operating conditions. AMD recommends a vapor chamber heatsink with ≥0.15°C/W thermal resistance and forced airflow ≥200 LFM. PCB layout must include ≥8 thermal vias per power ball and copper pour on inner layers. XCVU9P-1FLGA2577I includes on-die temperature sensors accessible via I2C for closed-loop thermal throttling.
XCVU9P-1FLGA2577I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU9P-1FLGA2577I FAQ
1.How can I place an order for XCVU9P-1FLGA2577I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-1FLGA2577I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-1FLGA2577I reliable?
The price and inventory of XCVU9P-1FLGA2577I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-1FLGA2577I is usually 5 days.
3.What payment methods are accepted for XCVU9P-1FLGA2577I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-1FLGA2577I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-1FLGA2577I?
XCVU9P-1FLGA2577I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-1FLGA2577I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-1FLGA2577I?
For technical support, including XCVU9P-1FLGA2577I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-1FLGA2577I requirements.
6.How does Aetrix verify that XCVU9P-1FLGA2577I is sourced from the original manufacturer or authorized distributors?
All XCVU9P-1FLGA2577I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-1FLGA2577I meets industry standards.
7.What is the process for return or replacement of XCVU9P-1FLGA2577I?
All XCVU9P-1FLGA2577I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-1FLGA2577I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-1FLGA2577I part is unused and in its original packaging.
Return procedure for XCVU9P-1FLGA2577I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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