AMD XCVU9P-1FLGB2104E

Overview

XCVU9P-1FLGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,240 logic cells, 13,440 DSP slices, and 104.5 Mb of block RAM, deployed in high-end radar signal processing and 5G massive MIMO baseband systems.

For engineers reviewing the XCVU9P-1FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (0.35–1.8 V), thermal design power (125 W), and package pin count (2104).

Technical Context

The XCVU9P-1FLGB2104E implements a heterogeneous architecture with programmable logic fabric, hardened 32.75 Gb/s GTY transceivers, and integrated ARM Cortex-A53 processing subsystems. It supports PCI Express Gen4 x16, DDR4-2400 memory interfaces, and IEEE 1588v2 time synchronization.

Configuration is performed via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device operates across industrial temperature range (–40°C to +100°C) and supports partial reconfiguration for dynamic function swapping.

Key Specifications

Pinout & Package

Package: Flip-Chip Ball Grid Array (FCBGA) with 2104 I/O balls, 35 mm × 35 mm body, 0.8 mm pitch, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU9P-1FLGB2104E, the XCVU13P-2FLGB2104I delivers 29% more logic and 29% higher DSP throughput at +24% TDP, while the XCVU7P-1FLVA2104E reduces logic by 40% and TDP by 24%-enabling thermal and board-area trade-offs without changing I/O pinout family.

Availability

XCVU9P-1FLGB2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and high-performance computing acceleration requiring stable component supply and long-term industrial lifecycle support.

Supply support for XCVU9P-1FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications such as 5G infrastructure, aerospace radar, and AI inference acceleration.

FAQ

What is the maximum supported transceiver line rate for XCVU9P-1FLGB2104E?

The XCVU9P-1FLGB2104E supports GTY transceivers rated up to 32.75 Gb/s per lane, compliant with CEI-28G-VSR, 100GbE KR4, and JESD204C standards. This line rate enables direct connection to high-speed ADCs/DACs and optical fronthaul interfaces without gearbox logic. The XCVU9P-1FLGB2104E achieves this performance across industrial temperature range with calibrated voltage and temperature compensation.

Does XCVU9P-1FLGB2104E include a hard processor subsystem?

Yes, the XCVU9P-1FLGB2104E integrates a hardened ARM Cortex-A53 quad-core processor subsystem running at up to 1.5 GHz, alongside a dual-core RISC-V microcontroller for real-time monitoring. The XCVU9P-1FLGB2104E uses this subsystem for boot management, security enforcement, and system-level control-separate from the programmable logic fabric used for signal processing.

What I/O voltage standards does XCVU9P-1FLGB2104E support?

The XCVU9P-1FLGB2104E supports 0.35 V to 1.8 V I/O standards including LVCMOS, SSTL, HSTL, and MIPI D-PHY. Each bank is independently configurable, enabling mixed-voltage interfaces-for example, connecting DDR4 memory (1.2 V SSTL) and RF front-end ICs (1.8 V LVCMOS). The XCVU9P-1FLGB2104E requires separate VCCO supplies per bank to maintain signal integrity.

Is partial reconfiguration supported on XCVU9P-1FLGB2104E?

Yes, the XCVU9P-1FLGB2104E fully supports partial reconfiguration through its ICAP and PCAP interfaces, allowing dynamic logic module swaps without resetting the entire device. This capability is used in adaptive radar and software-defined radio systems. The XCVU9P-1FLGB2104E implements frame-based reconfiguration with built-in CRC checking and secure bitstream loading.

What thermal management requirements apply to XCVU9P-1FLGB2104E?

The XCVU9P-1FLGB2104E has a thermal design power of 125 W and requires active cooling with ≥120 CFM airflow and a copper heat spreader mounted directly to the package lid. Junction temperature must be maintained below 100°C under worst-case operating conditions. The XCVU9P-1FLGB2104E includes on-die thermal sensors and analog monitoring pins for closed-loop thermal control implementation.