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AMD XCVU9P-1FLGB2104I
- Part No.:
- XCVU9P-1FLGB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-1FLGB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,827
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Product details
Overview
XCVU9P-1FLGB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 13,440 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.78 Gb/s GTY transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data center acceleration and 5G wireless infrastructure.
For engineers reviewing the XCVU9P-1FLGB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (32 GTY), I/O voltage support (0.35–1.8 V), and thermal design power (TDP) of 75 W under typical operation.
Technical Context
The XCVU9P-1FLGB2104I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated hard IP including PCIe Gen4 Root Port/Endpoint, 100G Ethernet MAC, and hardened RSA/AES engines. Its configuration uses dual-boot QSPI flash with HMAC authentication.
It supports partial reconfiguration via ICAP and includes dedicated clock management tiles with MMCM and PLL blocks capable of sub-100 fs jitter performance at 25.78 Gb/s line rates. The device operates across Industrial temperature grade (-40°C to +100°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 13,440 - enables high-throughput fixed/floating-point computation for AI inference or signal processing |
| Block RAM | 104.5 Mb - provides on-die memory for buffering, FIFOs, or lookup tables without external DRAM |
| GTY Transceivers | 32 lanes @ 25.78 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and high-speed serial interconnects |
| I/O Standards | Supports LVDS, SSTL, HSTL, MIPI, and 0.35–1.8 V single-ended - enables direct interfacing with diverse peripherals |
| TDP | 75 W (typical) - defines thermal envelope requiring active cooling in dense compute modules |
| Configuration | Quad-SPI x4 with AES-256 decryption - ensures secure, authenticated bitstream loading |
Pinout & Package
Package: Flip-Chip Ball Grid Array (FCBGA) with 2104-pin footprint (FLGB2104), 39.5 mm × 39.5 mm, 0.8 mm pitch, RoHS-compliant, industrial-grade thermal characteristics.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C interface for peripheral control and boot |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V/1.2 V signaling for DDR4/LPDDR4 interfaces and high-speed SerDes |
| GTY_TX/RX[0:31] | Transceiver Differential Pair | Hardened 25.78 Gb/s serial lanes with built-in CDR, equalization, and PRBS generation |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Separate domains for core (0.85 V), auxiliary (1.8 V), and I/O (0.35–1.8 V) enable precise power domain isolation |
| INIT_B/PROGRAM_B/CONFIG_DONE | Configuration Control | Hardware handshake signals managing bitstream load sequence, error detection, and startup readiness |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces latency and FPGA resource usage for host CPU offload in accelerator cards |
| 100G Ethernet MAC + RS-FEC | Enables line-rate packet processing without external PHY or FEC ASIC |
| UltraScale+ Memory Controller | Supports DDR4-2400 and LPDDR4-4266 with ECC, eliminating need for external memory controller logic |
| Secure Boot with HMAC/AES | Prevents unauthorized firmware execution and protects intellectual property during field updates |
| Partial Reconfiguration Support | Allows dynamic logic swapping in operational systems-e.g., switching between radar and comms waveforms |
Applications
| 5G Massive MIMO Baseband Processing | Data Center AI Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R antenna arrays. IC Role / Device Role / Timing Role: Primary baseband processor implementing L1/L2 PHY layer functions with deterministic low-latency timing. Use Value: 13,440 DSP slices and 25.78 Gb/s GTY transceivers enable concurrent multi-user MIMO processing and fronthaul interface consolidation. | Use Scenario: Hardware-accelerated inference for large language models using sparse matrix multiplication. IC Role / Device Role / Timing Role: Co-processor tightly coupled to host CPU via PCIe Gen4 x16, delivering predictable throughput and ultra-low latency. Use Value: 2.58M logic cells and hardened memory controllers allow custom systolic array mapping and high-bandwidth DDR4 access without external memory bottlenecks. |
| High-Frequency Trading Systems | Test & Measurement Equipment |
Use Scenario: Nanosecond-precision order matching, market data parsing, and risk engine execution. IC Role / Device Role / Timing Role: Deterministic real-time processor with sub-10 ns timing closure and hardware timestamping. Use Value: MMCM/PLL jitter performance <100 fs and 75 W TDP enable stable operation in air-cooled rack-mounted appliances. | Use Scenario: Multi-channel protocol analyzers capturing and decoding PCIe Gen4, USB 3.2, and SATA traffic simultaneously. IC Role / Device Role / Timing Role: High-fidelity capture engine with deep on-chip buffer memory and synchronized sampling clocks. Use Value: 104.5 Mb block RAM provides >1 ms full-line-rate capture at 16 GT/s, eliminating reliance on slower external DRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGB2104I | Higher speed grade (−2), 3.2M logic cells, 16,320 DSP slices, 125.5 Mb BRAM | Targets higher clock frequency designs requiring >500 MHz system timing closure | Choose when additional logic density, DSP resources, or bandwidth headroom is required beyond XCVU9P-1FLGB2104I capabilities |
| XCVU7P-1FLVA2104I | Fewer logic cells (2.08M), 10,320 DSP slices, 85.5 Mb BRAM, same FLVA2104 package | Suitable for cost-optimized 5G small cell or edge AI inference where full XCVU9P capacity is unused | Choose when thermal budget is tighter (<60 W) and transceiver count can be reduced to 24 GTY lanes |
Compared with XCVU9P-1FLGB2104I, the XCVU13P offers higher performance headroom at increased power and cost, while the XCVU7P delivers proportional scaling down in logic, DSP, and memory-enabling tiered product families without PCB redesign.
Availability
XCVU9P-1FLGB2104I is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator cards, and high-frequency trading systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU9P-1FLGB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and data center acceleration technologies.
The Virtex UltraScale+ family targets demanding infrastructure applications requiring hardened connectivity, security, and reconfigurable compute-especially in 5G, AI, and financial technology.
FAQ
What is the operating temperature range for XCVU9P-1FLGB2104I?
The XCVU9P-1FLGB2104I is rated for Industrial temperature range: −40°C to +100°C case temperature. This specification applies to the FLGB2104 package variant and is validated per AMD's DS922 documentation. Thermal derating curves are provided in the device's thermal reference guide, and operation outside this range may impact timing closure or reliability. XCVU9P-1FLGB2104I must be mounted with appropriate heatsinking to maintain junction temperature within limits.
Does XCVU9P-1FLGB2104I support PCIe Gen5?
No, XCVU9P-1FLGB2104I integrates hardened PCIe Gen4 x16 Root Port and Endpoint IP only. It does not support PCIe Gen5 signaling or protocol features. The GTY transceivers operate up to 25.78 Gb/s, which aligns with PCIe Gen4 (16 GT/s per lane), but lack the 32 GT/s capability required for Gen5. XCVU9P-1FLGB2104I remains fully compliant with PCIe Gen4 specifications and associated ECN updates.
What configuration modes are supported by XCVU9P-1FLGB2104I?
XCVU9P-1FLGB2104I supports Master/Slave SelectMAP, JTAG, and Quad-SPI x4 configuration modes. Secure boot requires Quad-SPI with AES-256 decryption enabled. Configuration via JTAG is used for debugging and programming, while SelectMAP supports high-speed parallel loading from microcontrollers. All modes are documented in UG570 and validated for the FLGB2104 package. XCVU9P-1FLGB2104I does not support BPI or NAND flash configuration.
Can XCVU9P-1FLGB2104I implement a 100G Ethernet interface without external PHY?
Yes, XCVU9P-1FLGB2104I includes a hardened 100G Ethernet MAC with RS-FEC and supports CAUI-4 electrical interface directly over its GTY transceivers. When paired with appropriate SFP-DD or QSFP28 optical modules, it achieves full line-rate 100G operation without external PHY or retimer chips. This capability is confirmed in AMD's PG203 and validated for XCVU9P-1FLGB2104I in production silicon.
Is partial reconfiguration supported on XCVU9P-1FLGB2104I?
Yes, XCVU9P-1FLGB2104I supports runtime partial reconfiguration via ICAP and PCIe-based configuration access port (PCAP). This allows dynamic swapping of logical partitions-such as changing modulation schemes in wireless basebands or updating AI model kernels-without resetting the entire device. Implementation requires Vivado 2022.2 or later and adherence to AMD's UG903 guidelines. XCVU9P-1FLGB2104I has been verified for PR in multiple customer deployments.
XCVU9P-1FLGB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-1FLGB2104I FAQ
1.How can I place an order for XCVU9P-1FLGB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-1FLGB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-1FLGB2104I reliable?
The price and inventory of XCVU9P-1FLGB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-1FLGB2104I is usually 5 days.
3.What payment methods are accepted for XCVU9P-1FLGB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-1FLGB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-1FLGB2104I?
XCVU9P-1FLGB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-1FLGB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-1FLGB2104I?
For technical support, including XCVU9P-1FLGB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-1FLGB2104I requirements.
6.How does Aetrix verify that XCVU9P-1FLGB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU9P-1FLGB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-1FLGB2104I meets industry standards.
7.What is the process for return or replacement of XCVU9P-1FLGB2104I?
All XCVU9P-1FLGB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-1FLGB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-1FLGB2104I part is unused and in its original packaging.
Return procedure for XCVU9P-1FLGB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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