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AMD XCVU9P-1FLGC2104E
- Part No.:
- XCVU9P-1FLGC2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-1FLGC2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,534
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Product details
Overview
XCVU9P-1FLGC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 13,440 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.78 Gb/s transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-throughput data center offload applications.
For engineers reviewing the XCVU9P-1FLGC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance in air-cooled 2104-pin FC-BGA packaging, and support for partial reconfiguration in dynamic compute workloads.
Technical Context
The XCVU9P-1FLGC2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, DDR4/DDR5 controllers, 100G Ethernet MAC), and ultra-low-latency memory interfaces. Its -1 speed grade guarantees operation up to 750 MHz in select logic paths and supports 25.78 Gb/s PAM4 signaling in GTY transceivers.
It features 24 I/O banks supporting multiple standards including LVDS, SSTL, HSTL, and MIPI, with programmable slew rate and drive strength per pin. The device includes integrated configuration security (AES-256, HMAC-SHA256) and real-time system monitoring via on-die sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - Enables large-scale RTL implementations such as multi-core AI inference engines or full-stack 5G L1/L2 protocol stacks. |
| DSP Slices | 13,440 - Supports concurrent execution of >10,000 MAC operations/cycle for matrix-heavy workloads. |
| Block RAM | 96.4 Mb - Provides on-chip buffering for streaming video pipelines or packet buffering in 100G+ networking. |
| Transceiver Speed | 25.78 Gb/s (GTY) - Enables native 100G Ethernet (4×25G) or 400G Ethernet (16×25G) physical layer connectivity. |
| I/O Pins | 832 user-configurable - Supports high-density interconnect to DDR5 memory, QSFP28 modules, and companion ASICs. |
| Speed Grade | -1 - Guarantees timing closure at 750 MHz in critical paths under industrial temperature range (–40°C to +100°C). |
| Package | 2104-pin FC-BGA (FLGC2104) - 35 mm × 35 mm footprint with 0.8 mm pitch; optimized for controlled-impedance PCB routing and thermal dissipation. |
Pinout & Package
The XCVU9P-1FLGC2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FC-BGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid. Pin functions are organized across 24 I/O banks, each supporting independent VCCO and VREF settings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 65 | Configurable as SDIO, UART, SPI, or GPIO; connects directly to PS (Processing System) in Zynq UltraScale+ MPSoC hybrid mode. |
| GTYTXN/GTYTXP[0:63] | Differential Transceiver Output | Supports 25.78 Gb/s PAM4 or NRZ; requires AC-coupling and precise trace length matching. |
| VRP/VRN[0:15] | Voltage Reference Inputs | Provide stable reference for SSTL/HSTL I/O standards; must be decoupled with 0.1 µF capacitors. |
| INIT_B, PROGRAM_B | Configuration Control | Active-Low signals managing configuration state machine; tied high via 4.7 kΩ pull-up in default boot mode. |
| VCCAUX, VCCINT, VCCO | Power Supply Rails | Separate 1.8 V (VCCAUX), 0.85 V (VCCINT), and 1.2–1.8 V (VCCO) domains enable mixed-voltage I/O interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort by eliminating soft IP synthesis; supports SR-IOV and ATS for virtualized data center environments. |
| UltraScale+ Memory Interface | Native DDR4/DDR5 PHY with 3200 MT/s data rate and built-in DQS gating; eliminates external memory controller IC. |
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset-critical for adaptive radio or multi-tenant accelerator partitioning. |
| Integrated Security Engine | AES-256 bitstream encryption and HMAC-SHA256 authentication prevent unauthorized configuration and cloning. |
| Real-Time Monitoring | On-die temperature, voltage, and current sensors feed telemetry to system management firmware without external components. |
Applications
| AI Acceleration | 5G Wireless Infrastructure |
|---|---|
Use Scenario: Deploying low-latency CNN inference engines for edge video analytics in smart city cameras. IC Role / Device Role / Timing Role: Configurable fabric executes convolution kernels; GTY transceivers stream 4K video to host GPU over PCIe Gen4. Use Value: 2,586,000 logic cells and 13,440 DSP slices deliver >20 TOPS/W efficiency while maintaining sub-100 µs inference latency. | Use Scenario: Implementing Layer 1 PHY and Layer 2 scheduler in massive MIMO baseband units. IC Role / Device Role / Timing Role: Hardened 100G Ethernet MAC handles fronthaul traffic; DDR5 interface buffers CPRI/O-RAN IQ samples. Use Value: Native 25.78 Gb/s GTY lanes replace discrete SerDes, reducing BOM count and signal integrity risk in RF unit designs. |
| Data Center Offload | High-Frequency Trading |
Use Scenario: Accelerating TLS 1.3 handshake and packet filtering in SmartNICs for cloud hypervisors. IC Role / Device Role / Timing Role: AES-256 engine performs crypto ops; PCIe Gen4 x16 provides 32 GB/s host bandwidth for zero-copy packet I/O. Use Value: Integrated security and high-bandwidth I/O eliminate need for separate crypto co-processors and reduce end-to-end packet latency by >40%. | Use Scenario: Executing ultra-low-latency market data parsing and order routing logic in exchange co-location racks. IC Role / Device Role / Timing Role: Deterministic timing path with -1 speed grade ensures <5 ns jitter on timestamp generation and FIFO control. Use Value: On-die temperature sensing enables real-time thermal throttling compensation, preserving sub-10 ns timing accuracy under burst load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher logic density (3.7M LC), faster speed grade (-2), larger 2577-pin package; higher power and cost. | Better suited for full 400G Ethernet line cards or multi-die AI training accelerators requiring >3M LC. | Select when XCVU9P-1FLGC2104E logic or transceiver resources are insufficient for target design scale. |
| XCVU7P-1FLVA2104I | Same 2104-pin FLVA package but lower logic count (2.0M LC), fewer GTY lanes (48 vs. 64), industrial temp rating only. | Targeted at cost-sensitive 100G optical transport or radar beamforming where full XCVU9P capacity is unused. | Choose when thermal envelope or budget constraints preclude use of XCVU9P-1FLGC2104E's full capability set. |
Compared with XCVU13P-2FLGA2577E and XCVU7P-1FLVA2104I, the XCVU9P-1FLGC2104E delivers optimal balance of transceiver count, logic density, and thermal/power profile for mid-scale AI and 5G infrastructure-avoiding overdesign while ensuring headroom for future feature upgrades.
Availability
XCVU9P-1FLGC2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G wireless infrastructure, and data center offload applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCVU9P-1FLGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, gaming, and embedded systems.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and secure reconfigurable computing in telecom infrastructure, AI hardware, and mission-critical embedded platforms.
FAQ
What is the maximum supported data rate for GTY transceivers in XCVU9P-1FLGC2104E?
The XCVU9P-1FLGC2104E supports GTY transceivers rated up to 25.78 Gb/s using PAM4 modulation or 16.3 Gb/s with NRZ. This enables native 100G Ethernet (4×25G) and compatibility with QSFP28 and OSFP interfaces. The actual achievable rate depends on PCB channel loss, reference clock stability, and equalization settings configured in Vivado.
Does XCVU9P-1FLGC2104E support DDR5 memory interfaces?
Yes, the XCVU9P-1FLGC2104E includes a hardened DDR5 PHY supporting data rates up to 3200 MT/s with on-die termination and write-leveling calibration. It interfaces directly with standard DDR5 UDIMMs and RDIMMs, and requires no external memory controller IC. Configuration is managed through the Memory Interface Generator (MIG) tool in Vivado.
What is the operating temperature range for XCVU9P-1FLGC2104E?
The XCVU9P-1FLGC2104E is specified for commercial operation from 0°C to +85°C ambient temperature. Its thermal design supports air-cooled deployment in standard 1U/2U servers and telecom chassis. Junction temperature must remain below 100°C under sustained load, monitored via on-die sensors accessible through JTAG or I2C.
Can XCVU9P-1FLGC2104E perform partial reconfiguration?
Yes, the XCVU9P-1FLGC2104E fully supports partial reconfiguration through Vivado's hierarchical design flow. Users can dynamically swap logic modules-such as different cipher engines or radio waveforms-without resetting the entire device. This capability is validated in AMD's PR demo designs and leverages dedicated configuration ports and frame-based bitstream loading.
Is PCIe Gen4 x16 support implemented in hard IP or soft logic in XCVU9P-1FLGC2104E?
The XCVU9P-1FLGC2104E implements PCIe Gen4 x16 in hardened silicon IP, not soft logic. This includes the PHY, data link, and transaction layers, enabling deterministic latency, full SR-IOV support, and compliance with PCI-SIG specifications without consuming programmable logic resources or requiring synthesis time.
XCVU9P-1FLGC2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-1FLGC2104E FAQ
1.How can I place an order for XCVU9P-1FLGC2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-1FLGC2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-1FLGC2104E reliable?
The price and inventory of XCVU9P-1FLGC2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-1FLGC2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-1FLGC2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-1FLGC2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-1FLGC2104E?
XCVU9P-1FLGC2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-1FLGC2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-1FLGC2104E?
For technical support, including XCVU9P-1FLGC2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-1FLGC2104E requirements.
6.How does Aetrix verify that XCVU9P-1FLGC2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-1FLGC2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-1FLGC2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-1FLGC2104E?
All XCVU9P-1FLGC2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-1FLGC2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-1FLGC2104E part is unused and in its original packaging.
Return procedure for XCVU9P-1FLGC2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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