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AMD XCVU9P-2FLGA2104E
- Part No.:
- XCVU9P-2FLGA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-2FLGA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,919
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Product details
Overview
XCVU9P-2FLGA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 72.5 Mb of block RAM, and 6,840 DSP slices, configured in a 2104-pin flip-chip land grid array (FLGA) package for high-speed serial interface and compute-acceleration applications in radar signal processing and 5G baseband systems.
For engineers reviewing the XCVU9P-2FLGA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (0.35–1.8 V), thermal design power (225 W), and PCIe Gen4 x16 endpoint capability.
Technical Context
The XCVU9P-2FLGA2104E implements a heterogeneous architecture with programmable logic fabric, hardened 32.75 Gb/s GTY transceivers, dual-core ARM Cortex-A53 processor subsystem, and integrated DDR4 memory controllers supporting up to 2,400 MT/s. It supports partial reconfiguration and AXI-based interconnect for system-on-chip integration.
Configuration is performed via quad-SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device operates across extended temperature range (–40°C to +100°C junction) and meets industrial reliability standards including SEU mitigation with built-in scrubbing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 – determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| Block RAM | 72.5 Mb – enables large on-die data buffering and FIFOs without external memory |
| DSP Slices | 6,840 – supports high-throughput fixed/floating-point math for radar FFTs and channel coding |
| GTY Transceivers | 64 channels @ 32.75 Gb/s – provides native support for CPRI/eCPRI, JESD204B/C, and 100G Ethernet |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD – allows direct interfacing with ADCs, DACs, and memory devices |
| Max Junction Temp | +100°C – defines thermal envelope for conduction-cooled industrial and aerospace deployments |
Pinout & Package
Package: 2104-pin Flip-Chip Land Grid Array (FLGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermally enhanced with integrated heat spreader.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary supply rail | Powers configuration logic, PCIe blocks, and clock management tiles at 1.8 V |
| MGTAVCC | Transceiver analog supply | Provides clean 0.92 V to GTY transceiver analog circuitry; sensitive to ripple & noise |
| MR | Master reset input | Asynchronous active-low reset that clears configuration state and halts startup sequence |
| INIT_B | Configuration status output | Open-drain indicator signaling successful bitstream loading or configuration error |
| CLK_IN | Primary configuration clock input | Accepts 30–100 MHz single-ended or differential clock for configuration and startup |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Endpoint | Reduces soft IP overhead and latency for host CPU offload in accelerator cards |
| Integrated DDR4 Memory Controller | Supports dual-channel 72-bit interfaces up to 2,400 MT/s, eliminating need for external controller logic |
| ARM Cortex-A53 Dual-Core Subsystem | Enables real-time control, boot management, and Linux-capable embedded processing alongside programmable logic |
| AES-256 Bitstream Encryption | Protects intellectual property against physical extraction and unauthorized cloning |
| SEU Detection & Correction | Automatically detects and corrects single-event upsets in configuration memory without user intervention |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming, pulse compression, and CFAR detection in airborne AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTY transceivers interface with high-speed ADC/DACs and RFICs. Use Value: 6,840 DSP slices and 32.75 Gb/s transceivers enable sub-microsecond latency processing of multi-channel IF data streams. | Use Scenario: Uplink/downlink channel coding, precoding, and layer mapping in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Accelerates LDPC encoding/decoding and FFT/IFFT operations; PCIe Gen4 x16 connects to host DU/CU servers. Use Value: Hardened PCIe Gen4 and dual DDR4 controllers reduce host dependency and improve fronthaul throughput scalability. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: Custom hardware acceleration for financial risk modeling and genomic sequence alignment in data centers. IC Role / Device Role / Timing Role: Configurable logic implements domain-specific pipelines; ARM subsystem manages runtime reconfiguration and host coordination. Use Value: Partial reconfiguration capability allows dynamic kernel swapping without full system reboot or downtime. | Use Scenario: Real-time protocol analysis and jitter tolerance testing in 100G/400G optical test platforms. IC Role / Device Role / Timing Role: GTY transceivers generate and analyze PAM4/NRZ signals; logic fabric implements PRBS pattern generation and error counting. Use Value: Native 32.75 Gb/s transceiver performance eliminates need for external retimers or gearbox ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA accelerator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher logic density (3,742K cells), larger package (2577-pin), higher TDP (285 W) | Better suited for multi-die system emulation and AI training acceleration requiring >2M LUTs | Select when additional logic, DSP, or memory bandwidth exceeds XCVU9P-2FLGA2104E capacity |
| XCVU7P-2FLVA2104I | Same pin count (2104), lower speed grade (-2 vs -2), industrial temp rating (–40°C to +100°C), no ARM subsystem | Targeted at cost-sensitive defense EW systems where embedded processing is handled externally | Choose when ARM subsystem is unnecessary and thermal margin must accommodate uncooled enclosures |
Compared with XCVU9P-2FLGA2104E, the XCVU13P offers greater compute headroom at higher power and footprint cost, while the XCVU7P trades embedded processing and transceiver performance for simplified thermal design and lower BOM cost in deterministic real-time systems.
Availability
XCVU9P-2FLGA2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-performance computing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCVU9P-2FLGA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client markets, with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for mission-critical infrastructure, emphasizing hardened interfaces, security, and heterogeneous integration for 5G, aerospace, and AI workloads.
FAQ
What is the maximum supported transceiver data rate for XCVU9P-2FLGA2104E?
The XCVU9P-2FLGA2104E supports GTY transceivers operating up to 32.75 Gb/s per lane. This rate is validated for protocols including JESD204C, 100G Ethernet (CAUI-4), and CPRI over copper or optical interfaces. The XCVU9P-2FLGA2104E transceiver architecture includes adaptive equalization and clock data recovery optimized for high-loss channels.
Does XCVU9P-2FLGA2104E include an embedded processor subsystem?
Yes, the XCVU9P-2FLGA2104E integrates a dual-core ARM Cortex-A53 application processor subsystem running at up to 1.5 GHz, with NEON SIMD extensions and TrustZone security. This subsystem operates independently of the programmable logic and is used for boot management, real-time control, and Linux-based application hosting alongside FPGA-accelerated functions in the XCVU9P-2FLGA2104E.
What I/O standards are supported by XCVU9P-2FLGA2104E?
The XCVU9P-2FLGA2104E supports 22 I/O standards including LVDS, MIPI D-PHY, SSTL-12/15/18, HSTL-I/II, POD12, and differential signaling such as DIFF_HSTL_I_18. These are configurable per bank and support mixed-voltage operation across 0.35 V to 1.8 V, enabling direct connection to high-speed ADCs, DDR4 memory, and SerDes PHYs without level-shifting components in the XCVU9P-2FLGA2104E design.
Is XCVU9P-2FLGA2104E suitable for aerospace applications?
The XCVU9P-2FLGA2104E is qualified for extended temperature operation (–40°C to +100°C junction) and includes SEU mitigation features such as configuration scrubbing and ECC protection. While not radiation-hardened, it is deployed in commercial space-qualified systems with additional shielding and system-level error handling. Its use in aerospace applications requires validation per program-specific radiation and reliability requirements for the XCVU9P-2FLGA2104E.
What configuration methods are supported by XCVU9P-2FLGA2104E?
The XCVU9P-2FLGA2104E supports multiple configuration modes: master/slave SPI (quad/dual), JTAG boundary-scan, and BPI parallel NOR flash. Configuration can be initiated via mode pins or internal watchdog timeout. Bitstream authentication and decryption using AES-256 and HMAC-SHA256 are enforced during all configuration paths for the XCVU9P-2FLGA2104E.
XCVU9P-2FLGA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-2FLGA2104E FAQ
1.How can I place an order for XCVU9P-2FLGA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-2FLGA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-2FLGA2104E reliable?
The price and inventory of XCVU9P-2FLGA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-2FLGA2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-2FLGA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-2FLGA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-2FLGA2104E?
XCVU9P-2FLGA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-2FLGA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-2FLGA2104E?
For technical support, including XCVU9P-2FLGA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-2FLGA2104E requirements.
6.How does Aetrix verify that XCVU9P-2FLGA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-2FLGA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-2FLGA2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-2FLGA2104E?
All XCVU9P-2FLGA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-2FLGA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-2FLGA2104E part is unused and in its original packaging.
Return procedure for XCVU9P-2FLGA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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