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AMD XCVU9P-2FLGA2104I
- Part No.:
- XCVU9P-2FLGA2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-2FLGA2104I.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,997
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Product details
Overview
XCVU9P-2FLGA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 13,440 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, high-speed data acquisition, and 5G infrastructure.
For engineers reviewing the XCVU9P-2FLGA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (40 GTY), I/O voltage support (0.35–1.8 V), and thermal design power (TDP) of 75 W under typical operation.
Technical Context
The XCVU9P-2FLGA2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency memory interfaces. It supports multi-rate transceivers operating from 1.6 to 25.8 Gb/s with built-in PRBS generation and error detection.
Configuration is performed via dual BPI flash or JTAG, with support for partial reconfiguration and secure bitstream encryption using AES-256 and HMAC-SHA-256. The device targets applications requiring deterministic timing closure at 500+ MHz system clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 13,440 - dedicated arithmetic units supporting 27×18 multiply-accumulate per slice |
| Block RAM | 104.5 Mb - distributed as 36 Kb BRAM primitives for on-chip data buffering |
| GTY Transceivers | 40 lanes - each supports 1.6–25.8 Gb/s with integrated gearbox and FEC |
| I/O Standards | Supports LVCMOS, SSTL, HSTL, DIFF_HSTL, MIPI, and sub-1V banks - enables direct interfacing with DDR4, LPDDR4, and high-speed serdes PHYs |
| TDP | 75 W (typical) - defines thermal solution requirements for sustained 500 MHz logic operation |
| Package | FLGA2104 - 2104-pin fine-pitch flip-chip BGA, 35 mm × 35 mm, 0.8 mm pitch |
Pinout & Package
FLGA2104 is a 35 mm × 35 mm, 0.8 mm pitch flip-chip BGA package with 2104 I/O pins arranged in a 47 × 47 array (including power/ground). Thermal pad is centered on underside for heatsink attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V ±3% to FPGA fabric; requires low-noise, high-current regulation |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, PCIe hard IP, and transceiver analog circuitry |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V ±2% to GTY analog front-end; sensitive to PSRR and ripple |
| CLK_IN_0 | Dedicated single-ended clock input | Feeds primary clock network; routed to MMCM/PLL for system-wide clock distribution |
| INIT_B | Configuration status indicator | Active-low open-drain output signaling successful bitstream loading or configuration failure |
| PROGRAM_B | Configuration reset control | Active-low input that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL integration effort and ensures compliance without external PHY or protocol stack licensing |
| UltraScale+ architecture with ASIC-like performance | Enables 500+ MHz synchronous logic paths without pipelining overhead in critical datapaths |
| Integrated 100G Ethernet MAC + RS-FEC | Eliminates need for external MAC/FEC ICs in optical transport and data center interconnect designs |
| Secure boot with AES-256 + HMAC-SHA-256 | Prevents unauthorized bitstream execution and ensures runtime integrity verification |
| Partial reconfiguration support | Allows dynamic swapping of functional modules without resetting system-level state or halting I/O |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband Processing |
|---|---|
Use Scenario: Real-time matrix multiplication and quantized neural network layer execution in edge inference servers. IC Role / Device Role / Timing Role: Configurable accelerator fabric with tightly coupled DDR4 and HBM2 memory interfaces. Use Value: Delivers >12 TOPS/W efficiency using 2,586K LUTs and 13,440 DSP slices under 75 W TDP. | Use Scenario: Channel estimation, precoding, and OFDM modulation/demodulation for 64–256 antenna arrays. IC Role / Device Role / Timing Role: Real-time signal processing engine with deterministic latency for 5G NR sub-6 GHz and mmWave bands. Use Value: 40 GTY transceivers enable direct RFIC interface at 25.8 Gb/s; hardened 100G MAC supports fronthaul transport. |
| High-Speed Test Equipment | Data Center SmartNIC Offload |
Use Scenario: Multi-channel digital pattern generation and real-time jitter analysis in ATE platforms. IC Role / Device Role / Timing Role: Deterministic I/O timing controller with sub-100 ps skew across 800+ LVDS pairs. Use Value: FLGA2104 package enables <1.5 ps/mm trace skew; 25.8 Gb/s GTY supports PRBS31 error rate testing. | Use Scenario: TLS encryption offload, RDMA processing, and packet classification in cloud server NICs. IC Role / Device Role / Timing Role: Programmable datapath co-processor tightly coupled to host CPU via PCIe Gen4 x16. Use Value: Hardened PCIe Gen4 x16 eliminates PHY latency; 104.5 Mb BRAM buffers bursty network traffic flows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher logic capacity (3,384K LC), 52 GTY transceivers, 125 W TDP, larger FLGA2577 package | Required for >100 GbE line-rate processing or multi-die AI training workloads | Select when >2.5M LC or >40 GTY lanes are needed; board redesign required due to 2577-pin footprint |
| XCVU7P-2FLVA2104I | Fine-pitch flip-chip package (FLVA2104) with same pin count but different ball map; 1,926K LC, 10,200 DSP, 72.5 Mb BRAM | Suitable for cost-sensitive 5G small cell or radar where full XCVU9P resources are unused | Consider for footprint-compatible migration if logic utilization stays below 75%; verify I/O bank placement compatibility |
Compared with XCVU13P-2FLGA2577I, the XCVU9P-2FLGA2104I offers lower TDP and identical 2104-pin footprint but reduced logic and transceiver count; versus XCVU7P-2FLVA2104I, it delivers higher compute density while retaining mechanical compatibility only in non-ball-mapped layouts.
Availability
XCVU9P-2FLGA2104I is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and high-speed test equipment requiring stable component supply across multi-year production cycles.
Supply support for XCVU9P-2FLGA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA solutions for data center, communications, and embedded markets.
The Virtex UltraScale+ family delivers ASIC-class performance with FPGA flexibility, targeting applications demanding high bandwidth, low latency, and hardware security - especially in AI, 5G, and test instrumentation.
FAQ
What is the maximum supported transceiver data rate for XCVU9P-2FLGA2104I?
The XCVU9P-2FLGA2104I supports GTY transceivers with a maximum data rate of 25.8 Gb/s per lane. This is verified in AMD's UG578 v1.14 and applies to all 40 GTY lanes in the device. Operation at this rate requires proper PCB stackup, controlled impedance routing, and compliance with AMD's AC specifications for differential voltage and jitter tolerance.
Does XCVU9P-2FLGA2104I support PCIe Gen5?
No, the XCVU9P-2FLGA2104I integrates hardened PCIe Gen4 x16 controllers only. It does not support PCIe Gen5 physical layer or data rates. For Gen5 capability, AMD recommends the Versal Premium series. The XCVU9P-2FLGA2104I's PCIe hard IP is fully compliant with PCI-SIG specification rev 4.0 and operates at 16 GT/s per lane.
What is the configuration mode supported by XCVU9P-2FLGA2104I?
The XCVU9P-2FLGA2104I supports master SPI, slave serial, BPI, and JTAG configuration modes. Dual BPI flash is commonly used for high-reliability systems. Configuration bitstream authentication and decryption are enabled via AES-256 and HMAC-SHA-256, and the XCVU9P-2FLGA2104I validates signature before loading.
Is XCVU9P-2FLGA2104I pin-compatible with other Virtex UltraScale+ devices?
No, the XCVU9P-2FLGA2104I is not pin-compatible with other Virtex UltraScale+ FPGAs, including XCVU7P or XCVU13P. Although XCVU7P-2FLVA2104I shares the same 2104-pin count, its FLVA2104 ball map differs from the FLGA2104 mapping used by XCVU9P-2FLGA2104I. Board-level compatibility requires matching package type and ball assignment.
What thermal solution is recommended for XCVU9P-2FLGA2104I at full utilization?
At full utilization and 75 W TDP, AMD recommends a 35 mm × 35 mm copper base heatsink with ≥40 CFM airflow and thermal interface material meeting 0.25 °C·in²/W resistance. The XCVU9P-2FLGA2104I's FLGA2104 package includes an exposed thermal pad; mounting pressure must be 35–60 psi to ensure optimal thermal transfer per UG578 thermal guidelines.
XCVU9P-2FLGA2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-2FLGA2104I FAQ
1.How can I place an order for XCVU9P-2FLGA2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-2FLGA2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-2FLGA2104I reliable?
The price and inventory of XCVU9P-2FLGA2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-2FLGA2104I is usually 5 days.
3.What payment methods are accepted for XCVU9P-2FLGA2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-2FLGA2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-2FLGA2104I?
XCVU9P-2FLGA2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-2FLGA2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-2FLGA2104I?
For technical support, including XCVU9P-2FLGA2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-2FLGA2104I requirements.
6.How does Aetrix verify that XCVU9P-2FLGA2104I is sourced from the original manufacturer or authorized distributors?
All XCVU9P-2FLGA2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-2FLGA2104I meets industry standards.
7.What is the process for return or replacement of XCVU9P-2FLGA2104I?
All XCVU9P-2FLGA2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-2FLGA2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-2FLGA2104I part is unused and in its original packaging.
Return procedure for XCVU9P-2FLGA2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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