My Inquiry
My Account
AMD XCVU9P-2FLGA2577E
- Part No.:
- XCVU9P-2FLGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU9P-2FLGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,038
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU9P-2FLGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,594,500 logic cells, 13,824 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, high-speed data acquisition, and 5G baseband processing.
For engineers reviewing the XCVU9P-2FLGA2577E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (32 GTY), I/O voltage support (1.2 V to 1.8 V), thermal design power (TDP = 55 W), and package pin compatibility with FLGA2577 footprint.
Technical Context
The XCVU9P-2FLGA2577E implements a heterogeneous architecture combining programmable logic, hardened IP blocks, and memory controllers. It includes dual ARM Cortex-A53 processors in the Processing System (PS), 32 GTY transceivers with PAM4 capability, and DDR4/LPDDR4 memory interfaces up to 2400 MT/s.
This device targets compute-intensive workloads requiring deterministic latency and high bandwidth. Its configuration supports JTAG, Quad-SPI, and BPI modes, and it complies with IEEE 1149.1 and 1532 standards for boundary-scan and in-system programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,594,500 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 13,824 - enables parallel fixed/floating-point computation for radar, ML inference |
| Block RAM | 96.4 Mb - supports large on-die buffering for video frame stores or packet queues |
| GTY Transceivers | 32 lanes @ 25.8 Gb/s - delivers 825.6 Gb/s aggregate serial bandwidth for optical interconnects |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - ensures interface compatibility with sensors, memory, FMC mezzanines |
| TDP | 55 W - defines thermal solution requirements for air-cooled 1U server or ATCA blade deployment |
| Package | FLGA2577 - 2577-ball flip-chip BGA, 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant |
Pinout & Package
Package: Flip-chip Ball Grid Array (FLGA2577) with 2577 I/O balls arranged in 47 × 47 array, 35 mm × 35 mm body, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% input powering FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% powering configuration logic, PCIe PHY, and clock management tiles |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated rail for GTY PLLs and serializers/deserializers |
| IO_Lx_y | User-configurable I/O bank | Supports per-bank voltage selection (1.2–1.8 V) and slew-rate control for signal integrity |
| CLK_IN_0 | Dedicated clock input | Single-ended or differential input feeding MMCM/PLL for system clock generation |
| PROGRAM_B | Configuration control | Active-low signal initiating full reconfiguration from external flash or host processor |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous PS-PL integration | ARM Cortex-A53 quad-core + FPGA fabric enables real-time OS + hardware-accelerated offload in single die |
| Hardened PCIe Gen4 x16 controller | Reduces RTL overhead and latency vs. soft IP; supports SR-IOV and ATS for virtualized workloads |
| UltraScale+ memory controller | Native DDR4/LPDDR4 support up to 2400 MT/s with ECC and AXI4 interface for coherent memory access |
| 32 GTY transceivers with PAM4 | Enables 50G/lane optical links without external retimers; supports 100G/200G/400G Ethernet protocols |
| Partial reconfiguration support | Allows dynamic logic swapping during operation-critical for multi-mode radar or adaptive radio systems |
Applications
| Radar Signal Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; GTY transceivers interface with ADC/DAC arrays at 4 GSPS. Use Value: 13,824 DSP slices enable simultaneous 1024-point FFTs across 32 channels with sub-microsecond latency. | Use Scenario: Low-latency inferencing for vision analytics at network edge using sparse ResNet-50 models. IC Role / Device Role / Timing Role: Configurable logic implements custom convolution pipelines; DDR4 controller feeds weights from 64 GB memory subsystem. Use Value: Block RAM capacity supports on-chip weight caching, reducing off-chip DRAM accesses by 65% versus GPU-based solutions. |
| 5G Massive MIMO Baseband | High-Speed Test Equipment |
Use Scenario: Digital pre-distortion (DPD) and channel estimation in 256-antenna 5G NR gNodeB units. IC Role / Device Role / Timing Role: GTY transceivers connect to RFICs via JESD204B/C; logic fabric runs adaptive DPD lookup tables and FIR filters. Use Value: 25.8 Gb/s GTY lanes support 8× JESD204C links (12.9 Gb/s each), enabling full 256-antenna IQ sample transport. | Use Scenario: Bit-error-rate testing and protocol validation for 100G/400G optical modules. IC Role / Device Role / Timing Role: Generates and analyzes PRBS31 patterns; implements custom FEC decoders and SerDes eye scan logic. Use Value: 32 GTY transceivers allow concurrent multi-lane stress testing without external muxing or lane aggregation hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | 3,312,000 logic cells, 17,280 DSP slices, higher TDP (75 W) | Better suited for larger-scale AI training kernels or full-stack 5G stack emulation | Select when >2.6M LCs or >14K DSPs are required; verify thermal margin and power delivery |
| XCVU7P-2FLVA2104E | 2,072,000 logic cells, 11,520 DSP slices, FLVA2104 (2104-ball) package | Lower I/O count and transceiver count (20 GTY lanes); compact form factor for SWaP-constrained systems | Choose for space-constrained deployments where 2577-ball footprint is prohibitive |
Compared with XCVU9P-2FLGA2577E, the XCVU13P offers greater compute density at higher power cost, while the XCVU7P trades logic capacity and transceiver count for smaller footprint-enabling optimization for either performance ceiling or board area.
Availability
XCVU9P-2FLGA2577E is available at Aetrix Electronics and suitable for AI acceleration platforms, 5G infrastructure equipment, and high-speed test instrumentation requiring stable component supply and long-term program support.
Supply support for XCVU9P-2FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications including wired/wireless communications, aerospace avionics, and real-time signal processing systems.
FAQ
What is the maximum supported memory interface speed for XCVU9P-2FLGA2577E?
The XCVU9P-2FLGA2577E supports DDR4 and LPDDR4 memory interfaces up to 2400 MT/s with built-in ECC and AXI4 bus interface. This speed is validated across commercial temperature grade (-2 to +85°C ambient) and requires proper PCB layout adherence to AMD's UG571 guidelines for termination and routing. The XCVU9P-2FLGA2577E memory controller does not support DDR5 or GDDR6.
Does XCVU9P-2FLGA2577E include integrated ARM processors?
Yes, the XCVU9P-2FLGA2577E integrates a dual-core ARM Cortex-A53 Processing System (PS) running at up to 1.5 GHz, with 256 KB L2 cache, NEON SIMD engine, and TrustZone security extensions. The PS operates independently from the programmable logic (PL) and communicates via AXI Coherency Extensions (ACE) and AXI4 interfaces. The XCVU9P-2FLGA2577E PS supports Linux, FreeRTOS, and bare-metal execution environments.
What transceiver protocols are natively supported by XCVU9P-2FLGA2577E?
The XCVU9P-2FLGA2577E GTY transceivers natively support PCIe Gen4 x16, 100G/200G/400G Ethernet (IEEE 802.3bs/cd), CPRI/eCPRI, JESD204B/C, and OTN OTU4. Protocol support is implemented via hardened logic and verified IP cores in Vivado Design Suite. The XCVU9P-2FLGA2577E does not support SATA, USB3, or HDMI in native transceiver mode.
Is partial reconfiguration supported on XCVU9P-2FLGA2577E?
Yes, the XCVU9P-2FLGA2577E fully supports partial reconfiguration (PR) through Vivado's PR flow, enabling dynamic logic module swapping without resetting the entire device. This capability is used in radar, software-defined radio, and adaptive test equipment where functional modes change during operation. The XCVU9P-2FLGA2577E PR implementation requires specific floorplanning, checkpointing, and bitstream encryption handling per UG909.
What is the thermal design power (TDP) rating for XCVU9P-2FLGA2577E?
The XCVU9P-2FLGA2577E has a specified thermal design power (TDP) of 55 W under typical operating conditions (100% logic utilization, 25.8 Gb/s GTY activity, DDR4 active). This value is measured per AMD UG1195 and assumes junction-to-case thermal resistance of 0.22°C/W and 200 LFM airflow. The XCVU9P-2FLGA2577E thermal solution must maintain junction temperature ≤100°C for commercial-grade operation.
XCVU9P-2FLGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU9P-2FLGA2577E FAQ
1.How can I place an order for XCVU9P-2FLGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-2FLGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-2FLGA2577E reliable?
The price and inventory of XCVU9P-2FLGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-2FLGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU9P-2FLGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-2FLGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-2FLGA2577E?
XCVU9P-2FLGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-2FLGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-2FLGA2577E?
For technical support, including XCVU9P-2FLGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-2FLGA2577E requirements.
6.How does Aetrix verify that XCVU9P-2FLGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-2FLGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-2FLGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU9P-2FLGA2577E?
All XCVU9P-2FLGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-2FLGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-2FLGA2577E part is unused and in its original packaging.
Return procedure for XCVU9P-2FLGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU9P-2FLGA2577E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
